类别是'专用'
专用 (1453)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 端口的数量 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | 内存IC类型 | 输出启用 | 混合内存类型 | 长度 | 宽度 | |||||||||||||||||
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![]() | TH50VSF3580AASB | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TOSHIBA CORP | BGA | LFBGA, BGA69,10X12,32 | 90 ns | 2097152 words | 2000000 | 85 °C | -30 °C | PLASTIC/EPOXY | LFBGA | BGA69,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 69 | Transferred | e0 | EAR99 | 锡铅 | USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 512K X 16 OR 1M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 69 | R-PBGA-B69 | 不合格 | 3.3 V | OTHER | 2.67 V | ASYNCHRONOUS | 0.05 mA | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | FLASH+SRAM | 12 mm | 9 mm | ||||||||||||
![]() | SST32HF162-70-4C-TBK | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SILICON STORAGE TECHNOLOGY INC | BGA | TBGA, BGA48,6X8,40 | 70 ns | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TBGA | BGA48,6X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 48 | 无 | e0 | EAR99 | 锡铅 | ALSO CONTAINS 128K X 16 SRAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 1 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.3 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 1MX16 | 1.2 mm | 16 | 0.00003 A | 16777216 bit | 存储器电路 | FLASH+SRAM | 12 mm | 10 mm | |||||||||||
![]() | M4-4102-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST34WA1601-70-5E-MVJE | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | MICROCHIP TECHNOLOGY INC | BGA | 6 X 8 MM, 0.92 MM HEIGHT, 0.30 MM BALL, ROHS COMPLIANT, MO-225, VFBGA-44 | 1048576 words | 1000000 | 85 °C | -20 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | 44 | 有 | 有 | EAR99 | ZERO DENSITY PSRAM | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | compliant | 40 | 44 | R-PBGA-B44 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 1MX16 | 1 mm | 16 | 16777216 bit | 存储器电路 | 8 mm | 6 mm | ||||||||||||||
![]() | SSDSC2KB480G701 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | , | 2018-07-27 | Obsolete | EAR99 | 8542.32.00.71 | compliant | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | PF28F1602C3TD70 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEL CORP | BGA | LFBGA, BGA66,8X12,32 | 70 ns | 1048576 words | 1000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | BGA66,8X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 66 | 有 | EAR99 | SRAM IS ORGANIZED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 1 | 0.8 mm | compliant | 未说明 | 66 | R-PBGA-B66 | 不合格 | 3.3 V | 商业扩展 | 2.7 V | ASYNCHRONOUS | 0.05 mA | 1MX16 | 1.4 mm | 16 | 0.000005 A | 16777216 bit | 存储器电路 | FLASH+SRAM | 10 mm | 8 mm | ||||||||||
![]() | TMS44C251-12SD | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | TEXAS INSTRUMENTS INC | ZIP, ZIP28,.1 | 120 ns | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | ZIP | ZIP28,.1 | RECTANGULAR | IN-LINE | 5 V | 28 | 无 | EAR99 | 8542.32.00.71 | ZIG-ZAG | THROUGH-HOLE | 未说明 | 1.27 mm | not_compliant | 未说明 | R-PZIP-T28 | 不合格 | COMMERCIAL | 0.095 mA | 256KX4 | 4 | 0.005 A | 1048576 bit | 存储器电路 | ||||||||||||||||||||||
![]() | S71PL129JC0BFW9U0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64 | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 64 | 有 | e1 | EAR99 | 锡银铜 | PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 64 | R-PBGA-B64 | 不合格 | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | 存储器电路 | 11.6 mm | 8 mm | ||||||||||||
![]() | S71NS256PB0ZJETV3 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 56 | 有 | EAR99 | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PBGA-B56 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | 9.2 mm | 8 mm | |||||||||||||||
![]() | TC528126AJ-12 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | TOSHIBA CORP | SOJ, SOJ40,.44 | 120 ns | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ40,.44 | RECTANGULAR | 小概要 | 5 V | 40 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | J BEND | 1.27 mm | unknown | R-PDSO-J40 | 不合格 | COMMERCIAL | 0.045 mA | 128KX8 | 8 | 0.01 A | 1048576 bit | 视频DRAM | ||||||||||||||||||||||
![]() | TC518128AFWL-80 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TOSHIBA CORP | SOIC | 80 ns | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 32 | 无 | e0 | 锡铅 | CE/AUTO/SELF REFRESH | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | unknown | 未说明 | 32 | R-PDSO-G32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 128KX8 | 3-STATE | 2.8 mm | 8 | 1048576 bit | PARALLEL | PSEUDO STATIC RAM | YES | 20.6 mm | 10.7 mm | ||||||||||||
![]() | PF38F1030W0YBQF | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | NUMONYX | FBGA, BGA88,8X12,32 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 88 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | OTHER | 0.055 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||
![]() | TC51832AFL-70 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TOSHIBA CORP | SOIC | 70 ns | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 28 | 无 | e0 | 锡铅 | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | unknown | 未说明 | 28 | R-PDSO-G28 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 32KX8 | 2.7 mm | 8 | 262144 bit | PARALLEL | PSEUDO STATIC RAM | 18.5 mm | 8.8 mm | ||||||||||||||||
![]() | NAND98W3M1AZBC5E | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NUMONYX | BGA | FBGA, BGA137,10X15,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA137,10X15,32 | RECTANGULAR | 网格排列 | 3 V | 137 | 有 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 0.8 mm | unknown | 未说明 | 137 | R-PBGA-B137 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | |||||||||||||||||||||||||
![]() | MC-242453F9-B10-BT3 | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NEC ELECTRONICS CORP | BGA | TFBGA, | 2097152 words | 2000000 | 70 °C | -20 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 77 | Obsolete | EAR99 | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 77 | R-PBGA-B77 | 不合格 | 3 V | COMMERCIAL | 2.6 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | 12 mm | 7 mm | |||||||||||||||||||
![]() | NAND99W3M1BZBC5E | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA137,10X15,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA137,10X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 3 V | 137 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B137 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | ||||||||||||||||||||||||||||||
![]() | S71NS256PB0ZJETV2 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | CYPRESS SEMICONDUCTOR CORP | , | Transferred | EAR99 | 8542.32.00.71 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSM514212-34ZS | OKI Electric Industry Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | OKI ELECTRIC INDUSTRY CO LTD | ZIP | ZIP, | 5048 words | 5048 | 70 °C | PLASTIC/EPOXY | ZIP | RECTANGULAR | IN-LINE | 5 V | 28 | Obsolete | EAR99 | 8542.32.00.71 | ZIG-ZAG | THROUGH-HOLE | 1 | 1.27 mm | unknown | 28 | R-PZIP-T28 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 5048X8 | 10.16 mm | 8 | 40384 bit | 存储器电路 | 36 mm | 2.8 mm | ||||||||||||||||||||
![]() | MSM514212-34ZS | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | LAPIS SEMICONDUCTOR CO LTD | ZIP, ZIP28,.1 | 34 ns | 70 °C | PLASTIC/EPOXY | ZIP | ZIP28,.1 | RECTANGULAR | IN-LINE | 5 V | 28 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | ZIG-ZAG | THROUGH-HOLE | 1.27 mm | unknown | R-PZIP-T28 | 不合格 | COMMERCIAL | 0.03 mA | 0.03 A | ||||||||||||||||||||||||||||
![]() | S71PL064JB0BFWQB0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | 9 X 7 MM, 1.20 MM PITCH, LEAD FREE, FBGA-56 | 65 ns | 3 | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 56 | 有 | e1 | 有 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 56 | R-PBGA-B56 | 不合格 | 3.6 V | 商业扩展 | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | 存储器电路 | FLASH+PSRAM | 9 mm | 7 mm | ||||||||
![]() | M4-4112RS-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RD38F2030W0ZTQ0 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | NUMONYX | FBGA, BGA88,8X12,32 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 88 | 无 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | OTHER | 0.055 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||
![]() | RD38F2030W0ZTQ0 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA88,8X12,32 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 88 | 无 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | OTHER | 0.055 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||
![]() | MCM66734P | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP24,.6 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 24 | 无 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||||||||
![]() | S71GL032NA0BFW0U0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 56 | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 1M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 56 | R-PBGA-B56 | 不合格 | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | 9 mm | 7 mm |