类别是'逻辑 - 专用逻辑'
逻辑 - 专用逻辑 (4668)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 输出类型 | 工作电源电压 | 极性 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 最大电源电压 | 最小电源电压 | 比特数 | 传播延迟 | 回应时间 | 家人 | 逻辑功能 | 放大器类型 | 输入数量 | 输出特性 | 逻辑类型 | 负电源电压(Vsup) | 平均偏置电流-最大值 (IIB) | 输出极性 | 电源电压限制-最大值 | 逻辑IC类型 | 接口IC类型 | 触发器类型 | 高电平输出电流 | 传播延迟(tpd) | 低水平输出电流 | 最大负电源电压(Vsup) | fmax-Min | 输入失调电压-最大值 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||||
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![]() | SSTVA16859CGLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | TSSOP | 64 | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 64 | EAR99 | 哑光锡 | 70°C | 0°C | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 2.5V | 0.5mm | 64 | 2.7V | Non-Inverting | COMMERCIAL | 2.3V | 13 | SSTV | Buffer | D FLIP-FLOP | 积极优势 | 2.6 ns | 210 MHz | 1.2mm | 17mm | 6.1mm | 1mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||
![]() | 74SSTVF16859NLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 220MHz | 1 | Tin | 表面贴装 | 56 | Positive Edge | 2007 | e3 | yes | Discontinued | 3 (168 Hours) | 56 | EAR99 | 70°C | -40°C | QUAD | 260 | 1 | 2.5V | 0.5mm | 220MHz | 30 | 56 | 26 | 2.5V | Non-Inverting | COMMERCIAL | 2.7V | 2.3V | 13 | 2.9 ns | SSTV | Buffer | D FLIP-FLOP | -16mA | 16mA | 8mm | 8mm | 850μm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||
![]() | SSTVF16859BG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TFSOP | 64 | 2011 | no | Discontinued | 70°C | 0°C | 64 | 2.7V | Buffer | D FLIP-FLOP | 17mm | 6.1mm | 1mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74SSTU32866BBFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | 2007 | e1 | yes | Discontinued | 3 (168 Hours) | 96 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | 270MHz | 30 | 96 | 25 | 1.8V | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 25 | 2.4 ns | SSTU | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
![]() | NLSF457MU3TCG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 125°C | YES | -55°C | Tape & Reel (TR) | e4 | yes | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 无铅 | 未说明 | 1 | 3.3V | 0.35mm | 未说明 | R-PDSO-N8 | 5.5V | MILITARY | 1.65V | NLSF457 | 逻辑电路 | 0.55mm | 1.45mm | 1mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74F381 | MICROSS/On Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Tray | 74F | 活跃 | 3 (168 Hours) | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74F382 | MICROSS/On Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Tray | 74F | 活跃 | 3 (168 Hours) | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSTUAF32868AHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 410MHz | 1 | 表面贴装 | TFBGA | 176 | Positive Edge | Tape & Reel (TR) | 2006 | e1 | yes | Discontinued | 3 (168 Hours) | 176 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 410MHz | 未说明 | 176 | 56 | 不合格 | 1.8V | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 28 | 3 ns | Buffer | OPEN-DRAIN | D FLIP-FLOP | -6mA | 6mA | 15mm | 6mm | 1.2mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
![]() | SSTUAF32865AHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 410MHz | 1 | 表面贴装 | 160 | Positive Edge | Tape & Reel (TR) | 2006 | e1 | yes | Discontinued | 3 (168 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 260 | 410MHz | 未说明 | 160 | 56 | 不合格 | 1.8V | Non-Inverting | 1.9V | 1.7V | 28 | 3 ns | Buffer | -8mA | 8mA | 13mm | 9mm | 1.3mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
![]() | MAX9963AGCCQ+D | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-TQFP Exposed Pad | 100 | 0°C~70°C | Tube | e3 | yes | Obsolete | 1 (Unlimited) | 100 | EAR99 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 4 | -1.5V~6.5V | 0.5mm | 100 | OPEN-COLLECTOR | 4 | 2.2 ns | Comparator, Driver | -5.25V | 25μA | 15000μV | 1.2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PI74SSTU32864NBE | Diodes Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 96-LFBGA | 0°C~70°C | Tray | Obsolete | 1 (Unlimited) | 1.7V~1.9V | 74SSTU32864 | 25, 14 | 1:1, 1:2 Configurable Registered Buffer | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MAX9963AJCCQ+D | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 70°C | Bulk | 2005 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | EAR99 | TIN | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 4 | 9.75V | 0.5mm | 未说明 | 100 | S-PQFP-G100 | 不合格 | OPEN-EMITTER | COMMERCIAL | 2.2 ns | COMPARATOR | -5.25V | 25μA | 11.5V | -7V | 100000μV | 1.2mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | MAX9963AJCCQ+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 70°C | Bulk | e3 | yes | Obsolete | 3 (168 Hours) | 100 | EAR99 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 4 | 9.75V | 0.5mm | 40 | 100 | S-PQFP-G100 | 不合格 | OPEN-EMITTER | COMMERCIAL | 2.2 ns | COMPARATOR | -5.25V | 25μA | 11.5V | -7V | 100000μV | 1.2mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | PI74SSTU32864ANBE | Diodes Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 96-LFBGA | 0°C~70°C | Tray | Obsolete | 1 (Unlimited) | 1.7V~1.9V | 74SSTU32864 | 25, 14 | 1:1, 1:2 Configurable Registered Buffer | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PI74SSTU32866NBE | Diodes Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 96-LFBGA | 0°C~70°C | Tray | Obsolete | 1 (Unlimited) | 1.7V~1.9V | 74SSTU32866 | 25, 14 | 1:1, 1:2 Configurable Registered Buffer with Parity | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PI74SSTVF16857KE | Diodes Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFSOP (0.173, 4.40mm Width) | 0°C~70°C | Tube | 74SSTVF | Obsolete | 1 (Unlimited) | 2.3V~2.7V | 74SSTVF16857 | 14 | Registered Buffer with SSTL_2 Compatible I/O for DDR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSTUAF32868AHLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 410MHz | 1 | 表面贴装 | TFBGA | 176 | Positive Edge | 2006 | e1 | yes | Discontinued | 3 (168 Hours) | 176 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 410MHz | 未说明 | 176 | 56 | 1.8V | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 28 | 3 ns | Buffer | D FLIP-FLOP | -6mA | 6mA | 15mm | 6mm | 1.2mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||
![]() | SSTUAF32868BHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | TFBGA | 176 | Positive Edge | Tape & Reel (TR) | 2006 | e1 | yes | Discontinued | 3 (168 Hours) | 176 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 410MHz | 30 | 176 | 56 | 不合格 | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 28 | 3 ns | Buffer | OPEN-DRAIN | D FLIP-FLOP | -6mA | 6mA | 15mm | 6mm | 1.2mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
![]() | IDT74SSTUBH32868ABKG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TFBGA | 2006 | e1 | yes | 3 (168 Hours) | 176 | 锡银铜 | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 30 | 176 | R-PBGA-B176 | 不合格 | 1.9V | COMMERCIAL | 1.7V | 28 | SSTU | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 1.5 ns | 410 MHz | 15mm | 6mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
![]() | 74SSTUBF32869ABKG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper, Silver, Tin | 表面贴装 | TFBGA | 150 | 340MHz | 2006 | e1 | yes | 活跃 | 3 (168 Hours) | 150 | EAR99 | 锡银铜 | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 30 | 150 | 不合格 | 1.9V | Non-Inverting | 1.8V | COMMERCIAL | 1.7V | 14 | 32869 | Buffer | OPEN-DRAIN | D FLIP-FLOP | 积极优势 | 3 ns | 13mm | 8mm | 1.2mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
![]() | SSTUB32S868DHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | TFBGA | 176 | Positive Edge | Tape & Reel (TR) | 2006 | e1 | yes | Discontinued | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 410MHz | 176 | 56 | Non-Inverting | 1.9V | 1.7V | 25 | 3 ns | Buffer | 28 | -16mA | 16mA | 15mm | 6mm | 1.2mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSTUAF32869AHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | TFBGA | 150 | Positive Edge | Tape & Reel (TR) | 2006 | e1 | yes | Discontinued | 3 (168 Hours) | 150 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 340MHz | 未说明 | 150 | 28 | 不合格 | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 14 | 3 ns | Buffer | OPEN-DRAIN | D FLIP-FLOP | -12mA | 12mA | 13mm | 8mm | 1.2mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
![]() | SLG7NT408V | Silego | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 基于缓冲器或反相器的外设驱动器 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT74SSTU32865BKG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160 | 2007 | e1 | 3 (168 Hours) | 160 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 30 | 160 | 不合格 | 1.9V | 1.8V | COMMERCIAL | 1.7V | 28 | SSTU | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 2.15 ns | 270 MHz | 1.3mm | 13mm | 9mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
![]() | SSTUB32S868BHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TFBGA | 176 | Tape & Reel (TR) | 2009 | e0 | yes | Discontinued | Tin/Lead (Sn/Pb) | 未说明 | 未说明 | 176 | 1.9V | 25 | Buffer | 总线驱动器 | 15mm | 6mm | 1.2mm | 符合RoHS标准 | 无铅 |