类别是'逻辑 - 专用逻辑'
逻辑 - 专用逻辑 (4668)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 极性 | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 最大电源电压 | 最小电源电压 | 比特数 | 传播延迟 | 接通延迟时间 | 家人 | 逻辑功能 | 输入数量 | 输出特性 | 输出极性 | 逻辑IC类型 | 触发器类型 | 高电平输出电流 | 传播延迟(tpd) | 低水平输出电流 | fmax-Min | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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 | SSTV16859CKLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | 56 | Positive Edge | 2006 | e3 | yes | Discontinued | 3 (168 Hours) | 56 | Matte Tin (Sn) - annealed | 85°C | -40°C | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 200MHz | 未说明 | 56 | 26 | 不合格 | Non-Inverting | 2.5V | COMMERCIAL | 2.7V | 2.3V | 13 | 3.5 ns | SSTV | Buffer | D FLIP-FLOP | -20mA | 20mA | 8mm | 8mm | 850μm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
 | SSTV16859CKLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | 56 | Positive Edge | Tape & Reel (TR) | 2006 | yes | Discontinued | 85°C | -40°C | 200MHz | 56 | 26 | Non-Inverting | 2.7V | 2.3V | 13 | 3.5 ns | Buffer | -20mA | 20mA | 8mm | 8mm | 850μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||
 | SSTVF16857AGT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TFSOP | 48 | Tape & Reel (TR) | 2007 | no | Discontinued | 70°C | 0°C | 48 | 2.7V | 14 | Buffer | D FLIP-FLOP | 12.5mm | 6.1mm | 1mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | SSTUF32864CHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | Tape & Reel (TR) | 2004 | Discontinued | 70°C | 0°C | 25 | Non-Inverting | 1.9V | 1.7V | 25 | 3 ns | Buffer | 25 | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | SSTUA32866BHLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | 96 | Positive Edge | 2005 | yes | Discontinued | 70°C | 0°C | unknown | 410MHz | 96 | 25 | Non-Inverting | 1.9V | 1.7V | 2.4 ns | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||
 | SSTUF32866EHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | Tape & Reel (TR) | 2005 | e1 | yes | Discontinued | 3 (168 Hours) | 96 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | 270MHz | 30 | 96 | 25 | 不合格 | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 25 | 3 ns | SSTU | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
 | SSTVA16859AGLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TFSOP | 64 | Tape & Reel (TR) | 2011 | e3 | yes | Discontinued | 1 (Unlimited) | Matte Tin (Sn) - annealed | 70°C | 0°C | 未说明 | 未说明 | 64 | 2.7V | Buffer | D FLIP-FLOP | 17mm | 6.1mm | 1mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | 74SSTUBF32868ABKG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 410MHz | 1 | 表面贴装 | TFBGA | 176 | Positive Edge | 2006 | e1 | yes | 活跃 | 3 (168 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 260 | 410MHz | 176 | 56 | 1.8V | Non-Inverting | 1.9V | 1.7V | 28 | 3 ns | 3 ns | Buffer | D FLIP-FLOP | -6mA | 6mA | 15mm | 6mm | 1.2mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
 | SSTVA16859CKLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 56 | 2008 | e3 | yes | 活跃 | 3 (168 Hours) | 56 | EAR99 | 哑光锡 | 70°C | 0°C | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 未说明 | 56 | 不合格 | 2.7V | Non-Inverting | COMMERCIAL | 2.3V | 13 | SSTV | Buffer | D FLIP-FLOP | 积极优势 | 2.6 ns | 210 MHz | 1mm | 8mm | 8mm | 850μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
 | SSTVA16859BKLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | 56 | Positive Edge | Tape & Reel (TR) | 2006 | e3 | yes | Discontinued | 3 (168 Hours) | 56 | Matte Tin (Sn) - annealed | 70°C | 0°C | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 210MHz | 30 | 56 | 26 | 不合格 | Non-Inverting | 2.5V | COMMERCIAL | 2.7V | 2.3V | 13 | 3.5 ns | SSTV | Buffer | D FLIP-FLOP | -16mA | 16mA | 8mm | 8mm | 850μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | SSTVF16857AGLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | TSSOP | 48 | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 1 (Unlimited) | 48 | EAR99 | Matte Tin (Sn) | 70°C | 0°C | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 2.5V | 0.5mm | 30 | 48 | 2.7V | COMMERCIAL | 2.3V | 14 | SSTV | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 200 MHz | 1.2mm | 12.5mm | 6.1mm | 1mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
 | SSTUF32864BHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | Tape & Reel (TR) | 2004 | Discontinued | 70°C | 0°C | 25 | Non-Inverting | 1.9V | 1.7V | 25 | 3 ns | Buffer | 25 | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | SSTUF32864EHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | Tape & Reel (TR) | 2004 | e0 | yes | Discontinued | Tin/Lead (Sn/Pb) | 70°C | 0°C | 未说明 | 未说明 | 96 | 25 | Non-Inverting | 1.9V | 1.7V | 3 ns | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
 | 74SSTU32864CBFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 340MHz | 1 | Copper, Silver, Tin | 表面贴装 | 96 | Positive Edge | 2007 | e1 | yes | Discontinued | 3 (168 Hours) | 96 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | 340MHz | 40 | 96 | 25 | 1.8V | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 25 | 2.35 ns | SSTU | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||
 | IDT74SSTV16859PAG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TFSOP | Tape & Reel (TR) | 2007 | e3 | 1 (Unlimited) | 64 | Matte Tin (Sn) - annealed | 70°C | 0°C | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 2.5V | 0.5mm | 30 | 64 | R-PDSO-G64 | 不合格 | 2.7V | 2.5V | INDUSTRIAL | 2.3V | 13 | SSTV | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 2.8 ns | 200 MHz | 1.1mm | 17mm | 6.1mm | 符合RoHS标准 | ||||||||||||||||||||||||||
 | IDT74SSTVN16859CPAG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TFSOP | Tape & Reel (TR) | 2007 | e3 | 64 | 哑光锡 | 70°C | 0°C | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | 64 | R-PDSO-G64 | 不合格 | 2.7V | COMMERCIAL | 2.3V | 13 | SSTV | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 2.4 ns | 220 MHz | 1.1mm | 17mm | 6.1mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | IDT74SSTU32864ABFG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 96 | Tape & Reel (TR) | 2007 | e1 | 3 (168 Hours) | 96 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | unknown | 30 | 96 | 不合格 | 1.9V | 1.8V | COMMERCIAL | 1.7V | 25 | SSTU | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 2.35 ns | 340 MHz | 1.5mm | 13.5mm | 5.5mm | 符合RoHS标准 | |||||||||||||||||||||||||
 | IDT74SSTU32864DBFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 96 | 2007 | e1 | 3 (168 Hours) | 96 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | unknown | 30 | 96 | 不合格 | 1.9V | 1.8V | COMMERCIAL | 1.7V | 25 | SSTU | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 2.35 ns | 340 MHz | 1.5mm | 13.5mm | 5.5mm | 符合RoHS标准 | ||||||||||||||||||||||||||
 | IDT74SSTUA32864BFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 96 | 2011 | 70°C | 0°C | 1.9V | Buffer | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 74SSTUBF32865ABKG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 410MHz | 1 | Copper, Silver, Tin | 表面贴装 | 160 | Positive Edge | 2006 | e1 | yes | 活跃 | 3 (168 Hours) | 160 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 410MHz | 30 | 160 | 56 | 不合格 | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 28 | 3 ns | Buffer | OPEN-DRAIN | D FLIP-FLOP | -8mA | 8mA | 13mm | 9mm | 1.3mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||
 | SSTUAF32866BHLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | Tape & Reel (TR) | 2006 | e1 | yes | Discontinued | 3 (168 Hours) | 96 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | 410MHz | 未说明 | 96 | 25 | 不合格 | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 25 | 3 ns | 32866 | Buffer | OPEN-DRAIN | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||
 | 74SSTVF16859NLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 220MHz | 1 | Tin | 表面贴装 | 56 | Positive Edge | Tape & Reel | 2007 | e3 | yes | Discontinued | 3 (168 Hours) | 56 | EAR99 | 70°C | -40°C | QUAD | 260 | 1 | 2.5V | 0.5mm | 220MHz | 30 | 56 | 26 | 2.5V | Non-Inverting | COMMERCIAL | 2.7V | 2.3V | 13 | 2.9 ns | 2.9 ns | SSTV | Buffer | D FLIP-FLOP | -16mA | 16mA | 8mm | 8mm | 850μm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||
 | 74SSTV16857PAG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 220MHz | 1 | Tin | 表面贴装 | TSSOP | 48 | Positive Edge | Tape & Reel (TR) | 2007 | e3 | yes | Discontinued | 1 (Unlimited) | 48 | EAR99 | 85°C | 0°C | DUAL | 鸥翼 | 260 | 1 | 2.5V | 0.5mm | 220MHz | 30 | 48 | 14 | 2.5V | Non-Inverting | 3.3V | INDUSTRIAL | 2.7V | 2.3V | 14 | 2.8 ns | SSTV | Buffer | D FLIP-FLOP | -20mA | 20mA | 200 MHz | 12.5mm | 6.1mm | 1mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||
 | SSTUB32871AHMLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | 2011 | e1 | yes | Discontinued | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 260 | 410MHz | 未说明 | 96 | Non-Inverting | 1.9V | 1.7V | 27 | 3 ns | Buffer | D FLIP-FLOP | -8mA | 8mA | 11.5mm | 5mm | 1.2mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
 | IDT74SSTVN16859PAG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TFSOP | 2007 | e3 | 1 (Unlimited) | 64 | Matte Tin (Sn) - annealed | 70°C | 0°C | 220 MHZ FOR PC3200 OPERATION | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 2.5V | 0.5mm | 30 | 64 | R-PDSO-G64 | 不合格 | 2.7V | 2.5V | COMMERCIAL | 2.3V | 13 | SSTV | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 2.7 ns | 200 MHz | 1.1mm | 17mm | 6.1mm | 符合RoHS标准 |