N/A

-

Tray

A2F200

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

20

1.425 V

100 °C

无

A2F200M3F-FG484I

80 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

MCU - 41, FPGA - 94

-40°C ~ 100°C (TJ)

SmartFusion®

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

94

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

23 mm

23 mm

N/A

-

有

2 x 32 kB

1.2 GHz

220000 LE

+ 100 C

5.287155 oz

- 40 C

1

SMD/SMT

27500 LAB

964731

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

有

10AS022E3F29I1HG

活跃

FPGA - Field Programmable Gate Array

INTEL CORP

2.25

SoC FPGA

780-BBGA, FCBGA

780-FBGA (29x29)

288

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

12 Transceiver

FPGA - 220K Logic Elements

2 Core

--

SoC FPGA

N/A

-

Tray

M2S090

活跃

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

484-BGA

484-FPBGA (23x23)

微芯片技术

267

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

MSL 3 - 168 hours

209

Tray

M2S005

活跃

-

166 MHz

6060 LE

SMD/SMT

-

64 kB

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S005-1FGG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.79

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

209

2.44 mm

现场可编程门阵列

191Kbit

1

FPGA - 5K Logic Modules

6060

1 Core

128KB

23 mm

23 mm

N/A

-

Tray

Obsolete

TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.2 V

30

1.14 V

85 °C

无

M2S005-TQ144

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.85

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

84

0°C ~ 85°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

240

0.5 mm

not_compliant

S-PQFP-G144

84

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

84

1.6 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

128KB

20 mm

20 mm

N/A

-

有

-

166 MHz

6060 LE

119

SMD/SMT

505 LAB

Microchip

Microchip Technology / Atmel

Details

-

64 kB

161

Tray

M2S005

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

有

M2S005S-VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

2.4

SoC FPGA

VFPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

50 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

8.06

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

SOC - Systems on a Chip

0.125 W

CMOS

BOTTOM

BALL

250

0.8 mm

通用型

compliant

S-PBGA-B256

161

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

1.56 mm

现场可编程门阵列

1

FPGA - 5K Logic Modules

6060

1 Core

128KB

SoC FPGA

14 mm

14 mm

N/A

-

1.14 V

1.26 V

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

0 to 85 °C

SmartFusion®2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Tray

M2S005

活跃

-

166 MHz

6060 LE

SMD/SMT

-

64 kB

256-LBGA

256-FPBGA (17x17)

微芯片技术

161

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

169

Tray

M2S005

活跃

-

166 MHz

6060 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

85 °C

有

M2S005-VFG400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.28

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

2.5, 3.3 V

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

现场可编程门阵列

STD

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

N/A

-

-

80 MHz

6000 LE

204 I/O

+ 100 C

0.062696 oz

- 40 C

60

SMD/SMT

-

Microchip

Microchip Technology / Atmel

SmartFusion

Details

-

64 kB

Tray

A2F500

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

30

1.425 V

100 °C

有

A2F500M3G-FGG484I

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.22

SoC FPGA

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

有

-40°C ~ 100°C (TJ)

Tray

A2F500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

不合格

1.5 V

1.5,1.8,2.5,3.3 V

INDUSTRIAL

16.5 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

N/A

-

Tray

M2S025

活跃

-

166 MHz

27696 LE

-

64 kB

400-LFBGA

400-VFBGA (17x17)

微芯片技术

207

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

1.425 V

1.575 V

MCU - 41, FPGA - 128

Tray

A2F500

活跃

有

-

100 MHz

6000 LE

+ 85 C

0.534969 oz

0 C

60

SMD/SMT

-

Microchip

Microchip Technology / Atmel

SmartFusion

Details

-

64 kB

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

40

1.425 V

85 °C

有

A2F500M3G-1FGG484

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.36

SoC FPGA

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.5000 V

0 to 85 °C

Tray

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

不合格

1.5 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

N/A

-

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

-

166 MHz

27696 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

484-BGA

484-FPBGA (23x23)

微芯片技术

25 V

0 to 85 °C

SmartFusion®2

200 ppm/°C

6.8

0.05 W

通用型

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

1

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

Tray

M2S010

活跃

-

166 MHz

12084 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

484-BGA

484-FPBGA (23x23)

微芯片技术

233

0°C ~ 85°C (TJ)

SmartFusion®2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 1 month ago)

有

This product may require additional documentation to export from the United States.

-

166 MHz

12084 LE

119

SMD/SMT

1007 LAB

Microchip

Microchip Technology / Atmel

-

64 kB

138

Tray

M2S010

活跃

SoC FPGA

VFPBGA-256

256-FPBGA (17x17)

微芯片技术

Compliant

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

SOC - Systems on a Chip

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

SoC FPGA

N/A

-

40 MHz

40 MHz

表面贴装

1.5000 V

1.425 V

500000

500000

1.575 V

有

This product may require additional documentation to export from the United States.

-

80 MHz

6000 LE

204 I/O

+ 85 C

0 C

60

SMD/SMT

-

Microchip

Microchip Technology / Atmel

SmartFusion

Details

-

64 kB

Tray

A2F500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

40

1.425 V

85 °C

有

A2F500M3G-FGG484

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.37

SoC FPGA

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

±2.8(20th) ppm/Year

-20 to 70 °C

Tray

A2F500

e1

Temperature Compensated Crystal Oscillator (TCXO)

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

4.6 ppm

10

S-PBGA-B484

128

不合格

3.0000 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

10 pF

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

削波正弦波

512KB

SoC FPGA

23 mm

23 mm

N/A

-

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXMB3G4F40C4N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

MCU - 208, FPGA - 540

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB3

S-PBGA-B1517

540

商业扩展

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

40 mm

40 mm

N/A

-

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

1.1 V

1.07 V

85 °C

5ASXBB3D6F40C6N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

MCU - 208, FPGA - 540

0°C ~ 85°C (TJ)

Tray

Arria V SX

活跃

BOTTOM

BALL

1 mm

compliant

5ASXBB3

S-PBGA-B1517

540

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

40 mm

40 mm

N/A

-

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5ASXFB3G4F35I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

MCU - 208, FPGA - 385

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

BOTTOM

BALL

未说明

1 mm

compliant

5ASXFB3

S-PBGA-B1152

385

不合格

1.1,1.2/3.3,2.5 V

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

385

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

35 mm

35 mm

N/A

-

Tray

Obsolete

144-LQFP

144-TQFP (20x20)

微芯片技术

84

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

256KB

N/A

-

Compliant

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

有

5CSXFC4C6U23I7N

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

2.03

64KB

672-FBGA

YES

484

672-UBGA (23x23)

672

MCU - 181, FPGA - 145

-40°C ~ 100°C (TJ)

Tray

Cyclone® V SX

活跃

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

800 MHz

5CSXFC4

S-PBGA-B672

145

不合格

1.1 V

1.1,1.2/3.3,2.5 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

800MHz

2.9 MB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

3.125 Gbps

MCU, FPGA

145

1.85 mm

现场可编程门阵列

40000

ARM

6

FPGA - 40K Logic Elements

40000

--

23 mm

23 mm

N/A

-

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

有

5CSEBA4U23I7SN

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.58

672-FBGA

YES

672-UBGA (23x23)

672

MCU - 181, FPGA - 145

-40°C ~ 100°C (TJ)

Tray

Cyclone® V SE

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

800MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 40K Logic Elements

40000

--

23 mm

23 mm

N/A

-

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA484,22X22,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEBA5U19C7SN

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.55

484-FBGA

YES

484-UBGA (19x19)

484

MCU - 151, FPGA - 66

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSEBA5

S-PBGA-B484

66

不合格

1.1,1.2/3.3,2.5 V

OTHER

800MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

1.9 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

19 mm

19 mm

N/A

-

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5ASXBB5D4F40I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

MCU - 208, FPGA - 540

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASXBB5

S-PBGA-B1517

540

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

40 mm

40 mm

N/A

-

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.1 V

未说明

1.07 V

125 °C

有

5CSEMA6F31A7N

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

2.04

896-BGA

YES

896-FBGA (31x31)

896

MCU - 181, FPGA - 288

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

5CSEMA6

S-PBGA-B896

288

不合格

1.1,1.2/3.3,2.5 V

AUTOMOTIVE

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

2 mm

现场可编程门阵列

FPGA - 110K Logic Elements

110000

--

31 mm

31 mm