N/A

-

YES

Obsolete

XILINX INC

LCC

WQCCJ, LDCC44,.7SQ

76.9 MHz

1

25

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

44

无

e0

锡铅

54 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 108 FLIP-FLOPS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-CQCC-J44

不合格

INDUSTRIAL

22 ns

8 DEDICATED INPUTS, 25 I/O

4.826 mm

UV PLD

MACROCELL

54

NO

8

NO

16.51 mm

16.51 mm

N/A

-

YES

NXP SEMICONDUCTORS

LCC

QCCJ,

77 MHz

32

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

44

Obsolete

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

N/A

-

YES

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5 V

44

无

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

EE PLD

64

YES

YES

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

80 MHz

3

32

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

44

无

e0

锡铅

YES

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

32

不合格

COMMERCIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

16.585 mm

16.585 mm

N/A

-

YES

XILINX INC

QFP

TFQFP,

59 MHz

80

70 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.63 V

2.97 V

3.3 V

100

Obsolete

128 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

100

S-PQFP-G100

不合格

COMMERCIAL

17.5 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

N/A

-

YES

NXP SEMICONDUCTORS

111 MHz

32

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3 V

3.3 V

44

Obsolete

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

9 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

N/A

-

YES

Obsolete

XILINX INC

3

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

44

无

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

COMMERCIAL

9 ns

EE PLD

64

YES

YES

N/A

-

YES

Obsolete

XILINX INC

BGA

FBGA, BGA48,7X7,32

222 MHz

3

38

70 °C

PLASTIC/EPOXY

FBGA

BGA48,7X7,32

SQUARE

GRID ARRAY, FINE PITCH

2.62 V

2.37 V

2.5 V

48

有

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

YES

8542.39.00.01

BOTTOM

BALL

260

0.8 mm

compliant

30

48

S-PBGA-B48

不合格

COMMERCIAL

5 ns

0 DEDICATED INPUTS, 38 I/O

1.8 mm

闪存 PLD

MACROCELL

72

YES

YES

7 mm

7 mm

N/A

-

YES

Obsolete

XILINX INC

QFP

LFQFP, QFP128,.63X.87,20

63 MHz

1

97

70 °C

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

5.25 V

4.75 V

5 V

128

无

YES

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

128

R-PQFP-G128

不合格

COMMERCIAL

14.5 ns

2 DEDICATED INPUTS, 97 I/O

1.6 mm

EE PLD

MACROCELL

128

YES

2

YES

20 mm

14 mm

N/A

-

YES

Obsolete

XILINX INC

BGA

WBGA, BGA225,15X15

45.5 MHz

1

78

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WBGA

BGA225,15X15

SQUARE

GRID ARRAY, WINDOW

5.5 V

4.5 V

5 V

225

无

108 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS

8542.39.00.01

BOTTOM

BALL

1.5 mm

unknown

225

S-CBGA-B225

不合格

INDUSTRIAL

36 ns

12 DEDICATED INPUTS, 78 I/O

UV PLD

MACROCELL

108

NO

12

NO

N/A

-

YES

Transferred

飞利浦半导体

QFP, TQFP100,.63SQ

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

100

无

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G100

不合格

INDUSTRIAL

13.5 ns

EE PLD

64

YES

YES

N/A

-

YES

XILINX INC

QFP

HEAT SINK, QFP-304

192

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

304

Transferred

e3

有

哑光锡

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

304

S-PQFP-G304

不合格

0 DEDICATED INPUTS, 192 I/O

4.5 mm

MASK PLD

MACROCELL

40 mm

40 mm

N/A

-

YES

Obsolete

XILINX INC

QFJ

WQCCJ, LDCC84,1.2SQ

40 MHz

1

42

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

84

无

3A001.A.2.C

PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

84

S-CQCC-J84

不合格

MILITARY

40 ns

12 DEDICATED INPUTS, 42 I/O

4.826 mm

UV PLD

MACROCELL

72

NO

12

NO

29.21 mm

29.21 mm

N/A

-

N/A

-

NO

Transferred

飞利浦半导体

DIP, DIP24,.3

125 °C

-55 °C

CERAMIC

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5 V

24

无

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T24

10

不合格

MILITARY

40 ns

PLA-TYPE

22

OT PLD

38535Q/M;38534H;883B

42

N/A

-

NO

飞利浦组件

,

10

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

24

Obsolete

3A001.A.2.C

8542.39.00.01

DUAL

THROUGH-HOLE

unknown

R-CDIP-T24

不合格

MILITARY

40 ns

12 DEDICATED INPUTS, 10 I/O

OT PLD

COMBINATORIAL

12

N/A

-

YES

Obsolete

ADVANCED MICRO DEVICES INC

6 X 6 MM, 0.50 MM PITCH, CSP-56

213 MHz

3

45

70 °C

PLASTIC/EPOXY

LFBGA

BGA56,10X10,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.9 V

1.7 V

1.8 V

56

有

e1

锡银铜

FAST ZERO POWER DESIGN TECHNOLOGY

BOTTOM

BALL

260

0.5 mm

compliant

30

S-PBGA-B56

45

不合格

COMMERCIAL

4 ns

PLA-TYPE

45

0 DEDICATED INPUTS, 45 I/O

1.35 mm

闪存 PLD

MACROCELL

64

6 mm

6 mm

N/A

-

YES

Obsolete

XILINX INC

LCC

PLASTIC, LCC-84

83 MHz

3

69

70 °C

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

84

无

e0

Tin/Lead (Sn85Pb15)

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

84

S-PQCC-J84

不合格

COMMERCIAL

7.5 ns

0 DEDICATED INPUTS, 69 I/O

5.08 mm

闪存 PLD

MACROCELL

72

YES

NO

29.3116 mm

29.3116 mm

N/A

-

YES

Obsolete

XILINX INC

QFP

QFP,

50 MHz

3

108

85 °C

-40 °C

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

160

无

e0

锡铅

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

160

S-PQFP-G160

不合格

INDUSTRIAL

20 ns

0 DEDICATED INPUTS, 108 I/O

4.1 mm

闪存 PLD

MACROCELL

28 mm

28 mm

N/A

-

YES

Obsolete

ALTERA CORP

QFP

HFQFP,

141

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

1.8 V

208

无

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

220

0.5 mm

compliant

208

S-PQFP-G208

不合格

4 DEDICATED INPUTS, 141 I/O

4.1 mm

可加载 PLD

MACROCELL

4

28 mm

28 mm

N/A

-

YES

NXP SEMICONDUCTORS

LFQFP,

63 MHz

96

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

5.5 V

4.5 V

5 V

128

Transferred

128 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

R-PQFP-G128

不合格

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

2

20 mm

14 mm

N/A

-

YES

NXP SEMICONDUCTORS

QFP,

66 MHz

80

85 °C

-40 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

5.5 V

4.5 V

5 V

100

Transferred

8542.39.00.01

QUAD

鸥翼

0.65 mm

unknown

R-PQFP-G100

不合格

INDUSTRIAL

15 ns

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

MACROCELL

2

20 mm

14 mm

N/A

-

INTEL CORP

,

活跃

8542.39.00.01

compliant

N/A

-

ALTERA CORP

,

Transferred

8542.39.00.01

unknown

N/A

-

YES

XILINX INC

QFP

TFQFP,

66 MHz

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.63 V

2.97 V

3.3 V

100

Obsolete

128 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

100

S-PQFP-G100

不合格

INDUSTRIAL

12 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm