N/A

-

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

无

A54SX32A-FFG256

172 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

N

0°C ~ 70°C (TA)

Tray

A54SX32A

e0

TIN LEAD/TIN LEAD SILVER

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.7 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

140 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

153 MHz

有

24

Actel

0.196363 oz

5.25 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-PQG160A

QFP

SQUARE

活跃

MICROSEMI CORP

5.53

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

微芯片技术

Details

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

5 V

AUTOMOTIVE

24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.4 ns

24000

3.4 mm

28 mm

28 mm

N/A

-

34 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

429

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P030

活跃

1.575 V

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFN-48

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

1.5 V

30

85 °C

有

A3P030-2QNG48

350 MHz

HQCCN

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

QFN-48

YES

48-QFN (6x6)

48

微芯片技术

Details

0 to 70 °C

Tray

A3P030

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

1.5 V

COMMERCIAL

2 mA

768 CLBS, 30000 GATES

现场可编程门阵列

30000

2

768

30000

0.88 mm

6 mm

6 mm

N/A

-

N

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL010T-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL010T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

233

2.44 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

23 mm

23 mm

N/A

-

N

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL090T

1.14V ~ 2.625V

1.2 V

86184

2648064

4 Transceiver

N/A

-

N

86184 LE

425 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090TS-FG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

69 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

175 MHz

有

90

Actel

5.5 V

Tray

A40MX04

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-2VQG80I

101 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

VQFP

YES

80-VQFP (14x14)

80

微芯片技术

Details

-40°C ~ 85°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

41 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

有

160

Actel

0.012720 oz

Tray

EX64

活跃

2.7 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

85 °C

有

EX64-PTQG64I

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.6

表面贴装

TQFP-64

YES

64-TQFP (10x10)

64

微芯片技术

Details

-40°C ~ 85°C (TA)

Tray

eX64

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

2.5 V

INDUSTRIAL

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

0.7 ns

3000

1.4 mm

10 mm

10 mm

N/A

-

N

270 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

Tray

A3PE600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE600-2FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

A3PE600

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.575 V

Tray

M1A3P250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P250-1VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

Details

0°C ~ 85°C (TJ)

Tray

M1A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

Details

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

70 °C

有

M1A3P600L-FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Details

有

90

IGLOO2

293

Tray

M2GL150

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

有

M2GL150-FCSG536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

N/A

-

表面贴装

240-BFQFP Exposed Pad

YES

189

0°C~70°C TA

Tray

FLEX-10KA®

e0

Obsolete

6 (Time on Label)

240

3A991

Tin/Lead (Sn/Pb)

8542.39.00.01

3V~3.6V

QUAD

鸥翼

220

3.3V

0.5mm

30

EPF10K100

S-PQFP-G240

189

不合格

2.5/3.33.3V

0.8 ns

189

可加载 PLD

4992

24576

158000

624

REGISTERED

4

4.1mm

32mm

32mm

Non-RoHS Compliant

N/A

-

8 Weeks

表面贴装

484-BGA

YES

240

-40°C~100°C TJ

Tray

2018

Cyclone® V GX

e1

活跃

3 (168 Hours)

484

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5CGXFC4

S-PBGA-B484

240

不合格

1.11.2/3.32.5V

240

现场可编程门阵列

50000

2862080

18868

2mm

23mm

23mm

符合RoHS标准

N/A

-

8 Weeks

表面贴装

780-BBGA, FCBGA

YES

372

-40°C~100°C TJ

Tray

Stratix® IV GX

e1

活跃

3 (168 Hours)

780

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

0.87V~0.93V

BOTTOM

BALL

245

0.9V

1mm

40

EP4SGX230

S-PBGA-B780

372

不合格

0.91.2/31.52.5V

717MHz

372

现场可编程门阵列

228000

17544192

9120

3.5mm

29mm

29mm

符合RoHS标准

N/A

-

8 Weeks

206

9.3kB

表面贴装

表面贴装

256-LFBGA

256

FLASH

-40°C~100°C TJ

Tray

2000

MachXO2

e1

yes

活跃

3 (168 Hours)

256

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.14V~1.26V

BOTTOM

BALL

260

1.2V

0.8mm

not_compliant

30

LCMXO2-2000

207

不合格

1.2V

82μA

21.3kB

现场可编程门阵列

2112

75776

133MHz

264

1056

1.7mm

14mm

14mm

ROHS3 Compliant

无铅

N/A

-

表面贴装

表面贴装

456-BBGA

456

329

0°C~85°C TJ

Tray

2008

Spartan®-IIE

e1

yes

Obsolete

3 (168 Hours)

456

3A991.D

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

250

1.8V

1mm

30

XC2S600E

456

514

1.8V

36kB

357MHz

现场可编程门阵列

15552

294912

600000

3456

6

0.47 ns

210000

23mm

23mm

无

符合RoHS标准

无铅

N/A

-

表面贴装

100-TQFP

YES

81

-40°C~100°C TJ

Tray

FLEX 6000

e0

Obsolete

3 (168 Hours)

100

EAR99

Tin/Lead (Sn/Pb)

ALSO CONFIGURABLE WITH 5V VCC

8542.39.00.01

3V~3.6V

QUAD

鸥翼

235

3.3V

0.5mm

30

EPF6016

S-PQFP-G100

81

不合格

2.5/3.33.3V

153MHz

81

可加载 PLD

1320

16000

132

MACROCELL

4

1.27mm

14mm

14mm

Non-RoHS Compliant

N/A

-

表面贴装

358-LFBGA, FCBGA

YES

156

0°C~85°C TJ

Tray

Arria II GX

e1

Obsolete

3 (168 Hours)

358

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

0.87V~0.93V

BOTTOM

BALL

260

0.9V

0.8mm

40

EP2AGX65

S-PBGA-B358

156

不合格

0.91.2/3.31.52.5V

500MHz

156

现场可编程门阵列

60214

5371904

2530

1.7mm

17mm

17mm

符合RoHS标准

N/A

-

10 Weeks

表面贴装

1760-BBGA, FCBGA

YES

700

0°C~85°C TJ

Tray

2010

Virtex®-7 XT

e1

yes

活跃

4 (72 Hours)

1761

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

0.97V~1.03V

BOTTOM

BALL

1V

1mm

XC7VX485T

1761

S-PBGA-B1761

700

11.8V

4.5MB

1818MHz

700

现场可编程门阵列

485760

37969920

37950

-2

607200

0.61 ns

3.5mm

42.5mm

42.5mm

无

ROHS3 Compliant

N/A

-

10 Weeks

Copper, Silver, Tin

表面贴装

表面贴装

1738-BBGA, FCBGA

1738

960

0°C~85°C TJ

Tray

1999

Virtex®-5 FXT

e1

活跃

4 (72 Hours)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

0.95V~1.05V

BOTTOM

BALL

245

1V

not_compliant

30

XC5VFX200T

960

不合格

2MB

现场可编程门阵列

196608

16809984

15360

1

3.5mm

42.5mm

42.5mm

ROHS3 Compliant

N/A

-

8 Weeks

表面贴装

1152-BBGA, FCBGA

YES

492

-40°C~100°C TJ

Tray

Arria 10 GX

活跃

3 (168 Hours)

8542.39.00.01

0.87V~0.93V

BOTTOM

BALL

未说明

0.9V

1mm

未说明

S-PBGA-B1152

492

不合格

0.9V

492

现场可编程门阵列

570000

42082304

217080

3.65mm

35mm

35mm

符合RoHS标准

N/A

-

12 Weeks

表面贴装

780-BBGA, FCBGA

YES

372

-40°C~100°C TJ

Tray

Arria II GX

活跃

3 (168 Hours)

780

0.87V~0.93V

BOTTOM

BALL

1mm

S-PBGA-B780

现场可编程门阵列

89178

6839296

3747

2.6mm

29mm

29mm

符合RoHS标准

N/A

-

10 Weeks

表面贴装

484-BGA

YES

338

-40°C~100°C TJ

Tray

Spartan®-7

活跃

3 (168 Hours)

484

8542.39.00.01

0.95V~1.05V

BOTTOM

BALL

未说明

1V

未说明

S-PBGA-B484

540kB

现场可编程门阵列

102400

4423680

8000

1.27 ns

ROHS3 Compliant

N/A

-

16 Weeks

表面贴装

表面贴装

256-LBGA

256

195

-40°C~100°C TJ

Tray

1999

Spartan®-3AN

e0

活跃

3 (168 Hours)

256

EAR99

Tin/Lead (Sn63Pb37)

1.14V~1.26V

BOTTOM

BALL

240

1.2V

1mm

not_compliant

30

XC3S400AN

256

160

不合格

1.2V

1.21.2/3.33.3V

45kB

667MHz

4.88 ns

现场可编程门阵列

8064

368640

400000

4

896

0.71 ns

896

1.55mm

17mm

17mm

Non-RoHS Compliant