类别是'嵌入式 - FPGA（现场可编程门阵列）'
嵌入式 - FPGA（现场可编程门阵列） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 内存大小 | 内存大小 | 时钟频率 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||||||||
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 | EP1S60F1020C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 1020-BBGA | YES | 773 | 0°C~85°C TJ | Tray | Stratix® | e1 | Obsolete | 3 (168 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | compliant | 40 | EP1S60 | S-PBGA-B1020 | 1018 | 不合格 | 1.51.5/3.3V | 1018 | 6570 CLBS | 现场可编程门阵列 | 57120 | 5215104 | 5712 | 6570 | 3.5mm | 33mm | 33mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | A3P1000-2FG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 11000 LE | 300 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 310 MHz | 有 | 60 | ProASIC3 | 0.014110 oz | 1.575 V | Tray | A3P1000 | 活跃 | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P1000-2FG484I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | A3P1000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
 | EP1K100QC208-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP | YES | 147 | 0°C~70°C TA | Tray | ACEX-1K® | e0 | Obsolete | 3 (168 Hours) | 208 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EP1K100 | S-PQFP-G208 | 147 | 不合格 | 2.52.5/3.3V | 0.7 ns | 147 | 可加载 PLD | 4992 | 49152 | 257000 | 624 | MIXED | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP1K30FC256-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BBGA | YES | 171 | 0°C~70°C TA | Tray | ACEX-1K® | e0 | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EP1K30 | S-PBGA-B256 | 171 | 不合格 | 2.52.5/3.3V | 0.6 ns | 171 | 可加载 PLD | 1728 | 24576 | 119000 | 216 | MIXED | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP1S80B956C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 956-BBGA | YES | 683 | 0°C~85°C TJ | Tray | Stratix® | e1 | Obsolete | 3 (168 Hours) | 956 | 3A001.A.7.A | 锡银铜 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1.27mm | compliant | 40 | EP1S80 | S-PBGA-B956 | 1238 | 不合格 | 1.51.5/3.3V | 1238 | 9191 CLBS | 现场可编程门阵列 | 79040 | 7427520 | 7904 | 9191 | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC5VLX330T-1FFG1738I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 1738-BBGA, FCBGA | 960 | -40°C~100°C TJ | Tray | 1999 | Virtex®-5 LXT | e1 | yes | 活跃 | 4 (72 Hours) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 0.95V~1.05V | BOTTOM | BALL | 245 | 1V | not_compliant | 30 | XC5VLX330 | 960 | 不合格 | 1.4MB | 960 | 现场可编程门阵列 | 331776 | 11943936 | 25920 | 1 | 3.5mm | 42.5mm | 42.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP3C10E144I7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 144-LQFP Exposed Pad | YES | 94 | -40°C~100°C TJ | Tray | Cyclone® III | e0 | 活跃 | 3 (168 Hours) | 144 | EAR99 | 锡铅 | 8542.39.00.01 | 1.15V~1.25V | QUAD | 鸥翼 | 1.2V | 0.4mm | EP3C10 | S-PQFP-G144 | 94 | 不合格 | 472.5MHz | 94 | 现场可编程门阵列 | 10320 | 423936 | 645 | 1.65mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 10M08DAU324C8G | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-LFBGA | YES | 246 | 0°C~85°C TJ | Tray | MAX® 10 | 活跃 | 3 (168 Hours) | 324 | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B324 | 246 | 不合格 | 1.2V | 246 | 现场可编程门阵列 | 8000 | 387072 | 500 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P250-2FG256 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 157 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 90 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P250 | 活跃 | 表面贴装 | FBGA-256 | 256-FPBGA (17x17) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 70 °C | Tray | A3P250 | 1.425V ~ 1.575V | 1.5 V | 36864 | 250000 | 2 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-1TQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 140 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 198 MHz | 有 | 40 | Actel | 5.25 V | Tray | A42MX16 | 活跃 | 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-1TQG176 | 108 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| A3P600-2FG256 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 177 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 90 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P600 | 活跃 | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | A3P600-2FG256 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 70 °C | Tray | A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 110592 | 600000 | 2 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
 | XC7S6-1CSGA225I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 225-LFBGA, CSPBGA | YES | 100 | -40°C~100°C TJ | Tray | Spartan®-7 | 活跃 | 3 (168 Hours) | 225 | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 未说明 | S-PBGA-B225 | 22.5kB | 469 CLBS | 现场可编程门阵列 | 6000 | 184320 | 1.27 ns | 469 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC4013XL-3PQ208C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 160 | 0°C~85°C TJ | Tray | 1998 | XC4000E/X | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn85Pb15) | 3V~3.6V | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | XC4013XL | 208 | 192 | 3.3V | 2.3kB | 166MHz | 现场可编程门阵列 | 1368 | 18432 | 13000 | 576 | 3 | 1536 | 1.6 ns | 576 | 576 | 10000 | 4.1mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EPF10K50EQC240-1 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 240-BQFP | YES | 189 | 0°C~70°C TA | Tray | FLEX-10KE® | e0 | Obsolete | 6 (Time on Label) | 240 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPF10K50 | S-PQFP-G240 | 189 | 不合格 | 2.52.5/3.3V | 140MHz | 0.5 ns | 189 | 可加载 PLD | 2880 | 40960 | 199000 | 360 | MIXED | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EP1SGX25FF1020C6 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 1020-BBGA | YES | 607 | 0°C~85°C TJ | Tray | Stratix® GX | e0 | Obsolete | 3 (168 Hours) | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 220 | 1.5V | 1mm | 30 | EP1SGX25 | S-PBGA-B1020 | 614 | 不合格 | 1.51.5/3.3V | 614 | 2852 CLBS | 现场可编程门阵列 | 25660 | 1944576 | 2566 | 2852 | 3.5mm | 33mm | 33mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPF10K50SQC240-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 240-BFQFP | YES | 189 | 0°C~70°C TA | Tray | FLEX-10KS® | e0 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPF10K50 | S-PQFP-G240 | 189 | 不合格 | 2.52.5/3.3V | 0.5 ns | 189 | 可加载 PLD | 2880 | 40960 | 199000 | 360 | MIXED | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-1TQG176I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 140 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 198 MHz | 有 | 40 | Actel | 5.5 V | Tray | A42MX16 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX16-1TQG176I | 108 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 1.4 mm | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| A42MX09-3TQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 104 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 296 MHz | 有 | 40 | Actel | 5.25 V | Tray | A42MX09 | 活跃 | 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX09-3TQG176 | 161 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 684 CLBS, 14000 GATES | 1.6 mm | 现场可编程门阵列 | 14000 | 1.6 ns | 684 | 14000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-2PQG160 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 125 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 215 MHz | 有 | 24 | Actel | 0.196363 oz | 5.25 V | Tray | A42MX16 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-2PQG160 | 117 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | PQFP-160 | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.1 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| A42MX36-1CQ208B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 176 I/O | 3.3 V | - 55 C | + 125 C | SMD/SMT | 有 | 1 | Actel | 3.3 V | Tray | A42MX36 | 活跃 | CERAMIC, QFP-208 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | -55 °C | 3.3 V | 20 | 125 °C | 无 | A42MX36-1CQ208B | 83 MHz | GQFF | SQUARE | 活跃 | MICROSEMI CORP | 5.19 | QFP | Military grade | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TJ) | A42MX36 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 208 | S-CQFP-F208 | 不合格 | 3.3 V | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | 现场可编程门阵列 | 2560 | 54000 | MIL-STD-883 | 1 | 1822 | 2.3 ns | 2438 | 2414 | 54000 | 29.21 mm | 29.21 mm | 无 | ||||||||||||||||||||||||||||||||||
| A42MX16-1PQG160 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 125 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 198 MHz | 有 | 24 | Actel | 0.196363 oz | 5.25 V | Tray | A42MX16 | 活跃 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-1PQG160 | 108 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | PQFP-160 | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||
 | EP1K50TI144-2 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | YES | 102 | -40°C~85°C TA | Tray | ACEX-1K® | e0 | Obsolete | 3 (168 Hours) | 144 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EP1K50 | S-PQFP-G144 | 102 | 不合格 | 2.52.5/3.3V | 37.5MHz | 0.4 ns | 102 | 可加载 PLD | 2880 | 40960 | 199000 | 360 | MIXED | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LFEC33E-3F672C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 53kB | 表面贴装 | 表面贴装 | 672-BBGA | 672 | 496 | 0°C~85°C TJ | Tray | 2000 | EC | no | Obsolete | 3 (168 Hours) | EAR99 | 8542.39.00.01 | 1.14V~1.26V | not_compliant | 340MHz | LFEC33 | 672 | 1.2V | 78.6kB | 32800 | 434176 | 4096 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP4S40G2F40I1N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 1517-BBGA, FCBGA | YES | 654 | 0°C~100°C TJ | Tray | STRATIX® IV GT | e1 | 活跃 | 3 (168 Hours) | 3A001.A.7.A | 锡银铜 | 8542.39.00.01 | 0.92V~0.98V | BOTTOM | BALL | 245 | 0.95V | 1mm | 30 | EP4S40G2 | S-PBGA-B | 654 | 不合格 | 0.951.2/31.52.5V | 654 | 现场可编程门阵列 | 228000 | 17544192 | 9120 | 3.8mm | 40mm | 40mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP3SL340F1760C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 1760-BBGA, FCBGA | YES | 1120 | 0°C~85°C TJ | Tray | Stratix® III L | e1 | 活跃 | 3 (168 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | 8542.39.00.01 | 0.86V~1.15V | BOTTOM | BALL | 245 | 0.9V | 1mm | 40 | EP3SL340 | S-PBGA-B1760 | 不合格 | 1.2/3.3V | 717MHz | 现场可编程门阵列 | 337500 | 18822144 | 13500 | 3.9mm | 42.5mm | 42.5mm | 符合RoHS标准 |