类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 访问模式 | 自我刷新 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||
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 | CY7C1049CV33-8ZSXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | 0°C~70°C TA | Tray | 2011 | e4 | Obsolete | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 30 | 44 | 3.3V | 3.6V | 3V | 4Mb 512K x 8 | 1 | 100mA | SRAM | Parallel | 3-STATE | 8 | 8ns | 19b | 4 Mb | COMMON | Asynchronous | 8b | 2V | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95128-DFCS6TP/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-UFBGA, WLCSP | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | BOTTOM | 1 | 0.4mm | M95128 | 5.5V | 1.7V | SPI, Serial | 128Kb 16K x 8 | 20MHz | 20 ns | EEPROM | SPI | 8 | 5ms | 128 kb | 0.000001A | SPI | 4000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.271mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1513KV18-250BZI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C1513 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 500mA | 250MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL256SAGMFIG10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 2016 | FL-S | 活跃 | 3 (168 Hours) | 16 | ALSO CONFIGURABLE AS 256M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 256Mb 32M x 8 | SYNCHRONOUS | 133MHz | 0.1mA | FLASH | SPI - Quad I/O | 32MX8 | 8 | 0.0001A | 268435456 bit | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | BOTTOM | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C09359AV-9AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 1997 | e4 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 3V~3.6V | QUAD | 1 | 3.3V | 0.5mm | CY7C09359 | 100 | 3.3V | 3.6V | 3V | 144Kb 8K x 18 | 2 | 230mA | 67MHz | 9ns | SRAM | Parallel | 8KX18 | 3-STATE | 18 | 13b | 144 kb | 0.0005A | COMMON | Synchronous | 18b | 3V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STK15C88-NF45I | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | Obsolete | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 20 | STK15C88 | 28 | 5V | 5V | 256Kb 32K x 8 | 70mA | NVSRAM | Parallel | 8b | 32KX8 | 8 | 45ns | 256 kb | 0.0015A | 45 ns | 8b | 2.67mm | 17.905mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62147EV30LL-45ZSXA | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 2001 | MoBL® | e4 | Discontinued | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY62147 | 44 | 3V | 3.6V | 2.2V | 4Mb 256K x 16 | 1 | 20mA | SRAM | Parallel | 3-STATE | 45ns | 18b | 4 Mb | 0.000007A | 45 ns | COMMON | Asynchronous | 16b | 1.04mm | 18.52mm | 10.26mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C128C-SSPD-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100 | e4 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 镍钯金 | 2.5V~5.5V | DUAL | 1 | 5V | 1.27mm | AT24C128C | 不合格 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 128 kb | 0.000004A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 10100DDR | 1.75mm | 4.925mm | 3.9mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | MT48LC16M8A2FB-75:G | Micron | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | GRID ARRAY, THIN PROFILE, FINE PITCH | 16000000 | PLASTIC/EPOXY | BGA60,8X15,32 | 30 | 5.4 ns | 70 °C | 无 | MT48LC16M8A2FB-75:G | 133 MHz | 16777216 words | 3.3 V | TFBGA | RECTANGULAR | Micron Technology Inc | Obsolete | MICRON TECHNOLOGY INC | 8.53 | BGA | YES | 60 | 8 X 16 MM, PLASTIC, FBGA-60 | e0 | EAR99 | Tin/Lead/Silver (Sn/Pb/Ag) | AUTO/SELF REFRESH | 8542.32.00.02 | DRAMs | CMOS | BOTTOM | BALL | 235 | 1 | 0.8 mm | unknown | 60 | R-PBGA-B60 | 不合格 | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.31 mA | 16MX8 | 3-STATE | 1.2 mm | 8 | 0.002 A | 134217728 bit | COMMON | 同步剧 | 4096 | 1,2,4,8,FP | 1,2,4,8 | 四库页面突发 | YES | 16 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M29W800DB70ZE6E | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TFBGA | RECTANGULAR | Numonyx内存解决方案 | Transferred | NUMONYX | BGA | 5.1 | 524288 words | M29W800DB70ZE6E | 有 | 85 °C | 70 ns | 未说明 | -40 °C | BGA48,6X8,32 | PLASTIC/EPOXY | 512000 | GRID ARRAY, THIN PROFILE, FINE PITCH | 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 | YES | 48 | 3 V | e1 | EAR99 | NOR型号 | 底部启动区块 | 8542.32.00.51 | 闪存 | CMOS | BOTTOM | BALL | 未说明 | 1 | 0.8 mm | compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX16 | 1.2 mm | 16 | 0.0001 A | 8388608 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | BOTTOM | YES | 8 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR93G66FVM-3GTTR | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | YES | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2016 | 活跃 | 1 (Unlimited) | 8 | ALSO OPERATES AT 1.7V WITH 1MHZ AND 2.5V AT 2MHZ | 1.7V~5.5V | DUAL | 未说明 | 1 | 5V | 0.65mm | 未说明 | R-PDSO-G8 | 5.5V | 4.5V | 4Kb 256 x 16 | SYNCHRONOUS | 3MHz | EEPROM | SPI | 256X16 | 16 | 5ms | 4096 bit | SERIAL | 3-WIRE | 5ms | 8 | 0.9mm | 2.9mm | 2.8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR93G66FVM-3AGTTR | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | YES | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | ALSO AVAILABLE 1.7V-2.5V OPERATES WITH 1MHZ, 2.5V-4.5V OPERATES WITH 2MHZ | 1.7V~5.5V | DUAL | 未说明 | 1 | 5V | 0.65mm | 未说明 | R-PDSO-G8 | 5.5V | 4.5V | 4Kb 256 x 16 | SYNCHRONOUS | 3MHz | EEPROM | SPI | 256X16 | 16 | 5ms | 4096 bit | SERIAL | 3-WIRE | 5ms | 0.9mm | 2.9mm | 2.8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT28FW02GBBA1HPC-0AAT | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | 表面贴装 | 64-LBGA | 64-LBGA (11x13) | Non-Volatile | -40°C~105°C TA | Tray | 2017 | Automotive, AEC-Q100 | 活跃 | 3 (168 Hours) | 1.7V~3.6V | 2Gb 128M x 16 | 105ns | FLASH | Parallel | 60ns | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AS7C4098A-12TIN | Alliance Memory, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | 44-TSOP2 | Volatile | -40°C~85°C TA | Tray | 2001 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 4.5V~5.5V | 5V | Parallel | 5.5V | 4.5V | 4Mb 256K x 16 | 1 | 12ns | SRAM | Parallel | 12ns | 18b | 4 Mb | 1.05mm | 18.54mm | 10.29mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BU9829GUL-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 9-UFBGA, WLCSP | 9 | Non-Volatile | -30°C~85°C TA | Tape & Reel (TR) | 2010 | yes | 活跃 | 1 (Unlimited) | 9 | 8542.32.00.51 | 1.6V~3.6V | BOTTOM | 未说明 | 1 | 1.8V | 0.5mm | 未说明 | BU9829 | 9 | 不合格 | 3.6V | 1.8/3.3V | 1.6V | SPI, Serial | 16Kb 2K x 8 | SYNCHRONOUS | 5MHz | EEPROM | SPI | 2KX8 | 8 | 5ms | 16 kb | 0.000001A | SPI | 100000 Write/Erase Cycles | 5ms | 10 | SOFTWARE | 0.55mm | 1.74mm | 1.65mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC256-90TU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 表面贴装 | 28-TSSOP (0.465, 11.80mm Width) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | 活跃 | 3 (168 Hours) | 28 | 4.5V~5.5V | DUAL | 1 | 5V | 0.55mm | R-PDSO-G28 | 5.5V | 4.5V | 256Kb 32K x 8 | ASYNCHRONOUS | 90ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 262144 bit | 5V | 10ms | 1.2mm | 11.8mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AS7C34098A-12TCN | Alliance Memory, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44-TSOP2 | Volatile | 0°C~70°C TA | Tray | 2001 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V | 3.3V | Parallel | 3.6V | 3V | 4Mb 256K x 16 | 1 | 12ns | SRAM | Parallel | 12ns | 18b | 4 Mb | 83MHz | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C006A-20AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 64-LQFP | 64 | Volatile | 0°C~70°C TA | Tray | 1997 | e4 | yes | Obsolete | 3 (168 Hours) | 64 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 0.8mm | 20GHz | 30 | CY7C006 | 64 | 5V | 5V | 128Kb 16K x 8 | 2 | 275mA | SRAM | Parallel | 16KX8 | 3-STATE | 8 | 20ns | 28b | 128 kb | 0.0015A | COMMON | Asynchronous | 8b | 2V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29AL016J55TFIR23 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | AL-J | e3 | Obsolete | 3 (168 Hours) | 48 | Matte Tin (Sn) | 底部启动区块 | 8542.32.00.51 | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.5mm | 未说明 | R-PDSO-G48 | 不合格 | 3.6V | 3.3V | 3V | 16Mb 2M x 8 1M x 16 | ASYNCHRONOUS | 0.03mA | FLASH | Parallel | 1MX16 | 16 | 55ns | 0.000005A | 16777216 bit | 55 ns | 3V | 8 | YES | YES | YES | 12131 | 16K8K32K64K | YES | BOTTOM | YES | 1.2mm | 18.4mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TC58NYG2S0HBAI4 | Kioxia America, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 63-VFBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 63 | 1.7V~1.95V | BOTTOM | BALL | 1 | 1.8V | 0.8mm | R-PBGA-B63 | 1.95V | 1.7V | 4Gb 512M x 8 | ASYNCHRONOUS | FLASH | 512MX8 | 8 | 25ns | 4294967296 bit | PARALLEL | 1.8V | 1mm | 11mm | 9mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF802C-70-4C-EKE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2011 | SST39 MPF™ | e3 | 活跃 | 3 (168 Hours) | 48 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 0.5mm | SST39VF802C | 3.3V | 8Mb 512K x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 512KX16 | 16 | 10μs | 19b | 8 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 256 | 2K | YES | TOP | YES | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX66L1G45GMI-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | SOP | YES | 85°C | Tube | 2017 | 不用于新设计 | 16 | 3A991.B.1.A | ALSO IT CAN BE CONFIGURED AS 1G X 1 BIT | 8542.32.00.51 | DUAL | 鸥翼 | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | INDUSTRIAL | 2.7V | SYNCHRONOUS | 104MHz | 256MX4 | 4 | 1073741824 bit | SERIAL | FLASH | 2.7V | 2 | 2.65mm | 10.3mm | 7.52mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M25PE80-VMN6P | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2012 | yes | Obsolete | 3 (168 Hours) | 2.7V~3.6V | M25PE80 | 8 | 3.3V | 2.7V | SPI, Serial | 8Mb 1M x 8 | 8mA | 75MHz | 8 ns | FLASH | SPI | 15ms, 3ms | 1b | 8 Mb | Synchronous | 8b | 1.75mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q256FVFIQ | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | 16 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | R-PDSO-G16 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 256Mb 32M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 0.000025A | 268435456 bit | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2.64mm | 10.31mm | 7.49mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C04-DRMF3TG/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-WFDFN Exposed Pad | YES | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | M24C04 | R-PDSO-N8 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 512X8 | 8 | 4ms | 4096 bit | I2C | 4ms | 0.8mm | 3mm | 2mm | ROHS3 Compliant |