类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | CY7C1041D-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tube | 2004 | e4 | yes | Obsolete | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.8mm | 100MHz | 20 | CY7C1041 | 44 | 5V | 5V | 4Mb 256K x 16 | 1 | 90mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 18b | 4 Mb | COMMON | Asynchronous | 16b | 2V | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX29LV640EBXEI-70G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-LFBGA, CSPBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2009 | MX29LV | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 0.8mm | 48 | 3.6V | 2.7V | 64Mb 8M x 8 | 16mA | FLASH | Parallel | 4MX16 | 16 | 70ns | 22b | 64 Mb | 70 ns | Asynchronous | 3V | 8 | 1.3mm | 8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF6402B-70-4I-B1KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | SST39VF6402B | 48 | 3.3V | 3.6V | 2.7V | 64Mb 4M x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 4MX16 | 16 | 10μs | 22b | 64 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 2K | 2K | TOP | YES | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | 93LC46A-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 3V | 2.54mm | 93LC46A | 8 | 5.5V | 3/5V | 2.5V | Serial | 1Kb 128 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 1 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 5.334mm | 9.27mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W987D6HBGX6E | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 54-TFBGA | YES | Volatile | -25°C~85°C TC | Tray | 2011 | 不用于新设计 | 3 (168 Hours) | 54 | AUTO/SELF REFRESH | 1.7V~1.95V | BOTTOM | 1 | 1.8V | 0.8mm | R-PBGA-B54 | 不合格 | 1.95V | 1.8V | 1.7V | 128Mb 8M x 16 | 1 | SYNCHRONOUS | 166MHz | 5.4ns | DRAM | Parallel | 8MX16 | 3-STATE | 16 | 15ns | 0.00001A | 134217728 bit | COMMON | 4096 | 1248FP | 1248 | 1.025mm | 9mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MB85RS16PNF-G-JNERE1 | Fujitsu Electronics America, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOP | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 2.7V~3.6V | 20MHz | SPI, Serial | 16Kb 2K x 8 | 20MHz | FRAM | SPI | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1297H-133AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2003 | e3 | Obsolete | 3 (168 Hours) | 100 | Matte Tin (Sn) | FLOW-THROUGH ARCHITECTURE | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | unknown | 20 | CY7C1297 | 100 | 不合格 | 3.3V | 3.6V | 3.135V | 1Mb 64K x 18 | 2 | 225mA | 133MHz | 3.33 ns | SRAM | Parallel | 64KX18 | 3-STATE | 18 | 16b | 1.1 Mb | 0.04A | COMMON | Synchronous | 18b | 3.14V | 1.6mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PC28F00AM29EWLA | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64-LBGA | 64 | 64-FBGA (11x13) | Non-Volatile | -40°C~85°C TA | Tray | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.7V~3.6V | 28F00AM29EW | 2.7V | Parallel | 3.6V | 2.7V | 1Gb 128M x 8 64M x 16 | 31mA | 100ns | FLASH | Parallel | 100ns | 1 Gb | Asynchronous | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA64X/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2002 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA64 | 8 | 5.5V | 2/5V | I2C, Serial | 64Kb 8K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT45DB021E-SSHN2B-T | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e4 | 活跃 | 1 (Unlimited) | 8 | 1.65V~3.6V | DUAL | 260 | 1 | 1.8V | 1.27mm | 未说明 | 8 | 不合格 | 3.6V | 1.65V | SPI, Serial | 2Mb 256Bytes x 1024 pages | 16mA | 70MHz | 8 ns | FLASH | SPI | 8b | 2MX1 | 1 | 8μs, 3ms | 22b | 2 Mb | Synchronous | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 1.75mm | 4.925mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C64D-XPD-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Automotive grade | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | 8542.32.00.51 | 2.5V~5.5V | DUAL | 1 | 5V | 0.65mm | R-PDSO-G8 | 5.5V | 2.5V | 64Kb 8K x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8KX8 | 8 | 5ms | 65536 bit | SERIAL | I2C | 1.2mm | 4.4mm | 3mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL128P0XMFI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | FL-P | e3 | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 22mA | 104MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 8 | 3ms | 1b | 128 Mb | 0.00002A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.65mm | 10.3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | M93C66-MN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | M93C66 | 8 | R-PDSO-G8 | 5V | 5V | Serial | 4Kb 512 x 8 256 x 16 | 2MHz | 200 ns | EEPROM | SPI | 256X16 | 16 | 5ms | 4 kb | 0.00005A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC16BHT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24LC16BH | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 16Kb 2K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA04-I/SNG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24AA04 | 8 | 不合格 | 5.5V | 2/5V | 1.7V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXMR | NO | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC01BHT-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 8-TSSOP | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | 活跃 | 1 (Unlimited) | 125°C | -40°C | 2.5V~5.5V | 400kHz | 24LC01BH | 5V | 2-Wire, Serial | 5.5V | 2.5V | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 1 kb | 100kHz | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C09579V-100BBC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 172-LFBGA | 172 | Volatile | 0°C~70°C TA | Tray | 2000 | e0 | no | Obsolete | 3 (168 Hours) | 172 | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 3V~3.6V | BOTTOM | 220 | 1 | 3.3V | 1mm | CY7C09579 | 172 | 3.3V | 3.465V | 3.135V | 1.152Mb 32K x 36 | 2 | 385mA | 100MHz | 5ns | SRAM | Parallel | 3-STATE | 36 | 30b | 1.1 Mb | 0.001A | COMMON | Synchronous | 36b | 3.14V | 15mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC08BH-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24LC08BH | 8 | 5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C46CT-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93C46C | 8 | 5V | 5V | Serial | 1Kb 128 x 8 64 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 64X16 | 16 | 2ms | 1 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | IS43LR16160G-6BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Industrial grade | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 60-TFBGA | 60 | Volatile | -40°C~85°C TA | Tray | e1 | 活跃 | 3 (168 Hours) | 60 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 1.7V~1.95V | BOTTOM | 1 | 1.8V | 0.8mm | 1.8V | 1.95V | 1.7V | 256Mb 16M x 16 | 1 | SYNCHRONOUS | 166MHz | 5.5ns | DRAM | Parallel | 16b | 16MX16 | 16 | 15ns | 13b | 256 Mb | 1.1mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RMLV1616AGSA-5S2#AA0 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | Industrial grade | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | Volatile | -40°C~85°C TA | Tray | yes | 活跃 | 3 (168 Hours) | 48 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 48 | R-PDSO-G48 | 3.6V | 2.7V | 16Mb 2M x 8 1M x 16 | ASYNCHRONOUS | SRAM | Parallel | 1MX16 | 16 | 55ns | 16777216 bit | 55 ns | 8 | 1.2mm | 18.4mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL032P0XMFI001 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | S25FL032P0XMFI001 | Non-Volatile | -40°C~85°C TA | Tube | 2013 | FL-P | Obsolete | 3 (168 Hours) | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | SPI, Serial | 32Mb 4M x 8 | 38mA | 104MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 5μs, 3ms | 1b | 32 Mb | Synchronous | 8b | 256B | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF040B-50-4C-QAF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Commercial grade | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2010 | SST25 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | SST25VF040B | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 4Mb 512K x 8 | 50MHz | 0.03mA | 50 ns | FLASH | SPI | 8b | 4MX1 | 1 | 10μs | 1b | 4 Mb | 0.00002A | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 6mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC32AT-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24LC32A | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 32Kb 4K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 34LC02T-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | EAR99 | 8542.32.00.51 | 2.2V~5.5V | DUAL | 260 | 1 | 2.5V | 0.95mm | 40 | 34LC02 | 6 | 不合格 | 5V | 2.2V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | SOFTWARE | 10100DDR | 1.45mm | 2.9mm | 1.55mm | 无SVHC | ROHS3 Compliant |