类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 自我刷新 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||
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 | 24LC01BHT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 24LC01BH | 8 | 5V | 2-Wire, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24C02C-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24C02C | 8 | 5V | 5V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 1ms | 2 kb | 0.00005A | I2C | 1000000 Write/Erase Cycles | 1ms | 200 | HARDWARE | 1010DDDR | 950μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL01GP13TFIV10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-P | e3 | Obsolete | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 1.65V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 1.8/3.33/3.3V | 2.7V | 1Gb 128M x 8 | 110mA | FLASH | Parallel | 1GX1 | 1 | 130ns | 1 Gb | 0.000005A | 130 ns | Asynchronous | 3V | 8 | YES | YES | YES | 1K | 128K | 8/16words | YES | YES | 1.2mm | 18.4mm | 14mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PC28F512P33BFD | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 64-TBGA | YES | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2008 | Axcell™ | e1 | yes | Obsolete | 3 (168 Hours) | 64 | 锡银铜 | 2.3V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 30 | 28F512P33 | 64 | 2.3V | Parallel, Serial | 512Mb 32M x 16 | 31mA | 52MHz | FLASH | Parallel | 32MX16 | 16 | 95ns | 25b | 512 Mb | 95 ns | Asynchronous | 16b | 1.2mm | 10mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24VL024H/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -20°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.65mm | 40 | 24VL024H | 8 | 不合格 | 3.3V | 3.6V | 1.5V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24VL014H/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -20°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.65mm | 40 | 24VL014H | 8 | 不合格 | 3.3V | 3.6V | 1.5V | I2C, Serial | 1Kb 128 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11LC080-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | 8-MSOP | Non-Volatile | -40°C~125°C TA | Tube | 2009 | 活跃 | 1 (Unlimited) | 125°C | -40°C | 2.5V~5.5V | 100kHz | 11LC080 | 5V | Serial | 5.5V | 2.5V | 8Kb 1K x 8 | 5mA | 100kHz | EEPROM | 单线 | 5ms | 8 kb | 100kHz | 950μm | 3mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT49BV162AT-70TI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | 48-TSOP | Non-Volatile | -40°C~85°C TC | Tray | 1997 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.65V~3.6V | 70GHz | AT49BV162 | Parallel | 3.6V | 2.65V | 16Mb 2M x 8 1M x 16 | 25mA | 70ns | FLASH | Parallel | 16b | 200μs | 16 Mb | Asynchronous | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25PF040CT-40I/NP | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | SST25 | 活跃 | 1 (Unlimited) | 8 | 2.3V~3.6V | DUAL | 1 | 3.3V | 0.5mm | SST25PF040C | R-PDSO-N8 | 3.6V | 2.3V | 4Mb 512K x 8 | SYNCHRONOUS | 40MHz | 0.015mA | FLASH | SPI | 4MX1 | 1 | 5ms | 0.00001A | 4194304 bit | SERIAL | 3.3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | NO | 0.6mm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC256X-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 25LC256 | 8 | 5V | SPI, Serial | 256Kb 32K x 8 | 6mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 11LC080T-E/TT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | TO-236-3, SC-59, SOT-23-3 | YES | 3 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 3 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.95mm | 40 | 11LC080 | 3 | 5V | Serial | 8Kb 1K x 8 | 5mA | 100kHz | EEPROM | 单线 | 1KX8 | 8 | 5ms | 8 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.12mm | 2.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS42S16400J-7BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 54-TFBGA | 54 | TF-BGA-54-8000X8000DE | Volatile | -40°C~85°C TA | Tray | e1 | 活跃 | 3 (168 Hours) | 54 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 3V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | 54 | 3.3V | 3.6V | 3V | 64Mb 4M x 16 | 1 | 70mA | 143MHz | 5.4ns | DRAM | Parallel | 16b | 4MX16 | 3-STATE | 16 | 14b | 64 Mb | COMMON | 4096 | 1248FP | 1248 | NO | YES | 1.2mm | 8mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L6433FMI-08G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2009 | MXSMIO™ | e3 | 活跃 | 3 (168 Hours) | 16 | Matte Tin (Sn) | ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT | 2.65V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | R-PDSO-G16 | 3.6V | 2.65V | 64Mb 8M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 16MX4 | 4 | 50μs, 1.2ms | 67108864 bit | SERIAL | 3V | 2 | 2.65mm | 10.3mm | 7.52mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PC28F512P30EFA | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64-TBGA | YES | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2002 | Axcell™ | e1 | yes | Obsolete | 3 (168 Hours) | 64 | EAR99 | 锡银铜 | 对称块 | 8542.32.00.51 | 1.7V~2V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | 28F512P30 | 64 | 1.8V | 1.81.8/3.3V | 1.7V | Parallel, Serial | 512Mb 32M x 16 | 31mA | 52MHz | FLASH | Parallel | 32MX16 | 16 | 100ns | 25b | 512 Mb | 0.000225A | 100 ns | Asynchronous | 16b | NO | NO | 512 | 64K | 16words | 1.2mm | 10mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1372DV25-167AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | NoBL™ | e3 | yes | Obsolete | 3 (168 Hours) | 100 | Matte Tin (Sn) | 2.375V~2.625V | QUAD | 1 | 2.5V | 0.65mm | CY7C1372 | 100 | 2.5V | 18Mb 1M x 18 | 2 | 275mA | 167MHz | 3.4ns | SRAM | Parallel | 3-STATE | 36 | 20b | 18 Mb | 0.07A | COMMON | Synchronous | 18b | 18 | YES | 1.6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93AA76CT-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 93AA76C | 8 | 5.5V | 2/5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 16 | 5ms | 8 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 8 | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS61WV6416EEBLL-10TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 44 | 2.4V~3.6V | DUAL | 1 | 3V | 0.8mm | 不合格 | 3.6V | 2.5/3.3V | 2.4V | 1Mb 64K x 16 | SRAM | Parallel | 64KX16 | 3-STATE | 16 | 10ns | 0.004A | 1048576 bit | 10 ns | COMMON | 2V | 1.2mm | 18.41mm | 10.16mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B256LA-SP45XIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | 48-BSSOP (0.295, 7.50mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.41 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.635mm | 30 | CY14*256 | 48 | 不合格 | 3V | 3.6V | 2.7V | 256Kb 32K x 8 | 52mA | ASYNCHRONOUS | NVSRAM | Parallel | 8b | 32KX8 | 8 | 45ns | 256 kb | 0.005A | 45 ns | 8b | 2.794mm | 15.875mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 25LC640XT-I/STG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4.40 MM, PLASTIC, TSSOP-8 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 8000 | PLASTIC/EPOXY | -40 °C | 40 | 85 °C | 有 | 25LC640XT-I/STG | 2 MHz | 8192 words | 5 V | TSSOP | RECTANGULAR | Microchip Technology Inc | 不推荐 | MICROCHIP TECHNOLOGY INC | 5.2 | SOIC | YES | 8 | 8 | Compliant | Tape & Reel (TR) | e3 | 有 | EAR99 | 哑光锡 | 85 °C | -40 °C | 8542.32.00.51 | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | INDUSTRIAL | 2.5 V | SPI, Serial | 5.5 V | 2.5 V | 8 kB | SYNCHRONOUS | 230 ns | 8KX8 | 1.2 mm | 8 | 64 kb | 65536 bit | 2 MHz | SERIAL | EEPROM | SPI | 5 ms | 4.4 mm | 3 mm | 无 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25010A-10TU-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 8-TSSOP | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~5.5V | 20MHz | AT25010 | 5V | 2-Wire, SPI, Serial | 5.5V | 2.7V | 1Kb 128 x 8 | 10mA | 20MHz | 40 ns | EEPROM | SPI | 5ms | 1 kb | 10MHz | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C2165KV18-550BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C2165 | 165 | 1.8V | 1.9V | 1.7V | 18Mb 512K x 36 | 2 | 1.1A | 550MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 17b | 18 Mb | 0.34A | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC01B-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 2.54mm | 24LC01B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | NO | 4.32mm | 9.27mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25C040/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25C040 | 8 | 5V | 5V | SPI, Serial | 4Kb 512 x 8 | 5mA | 3MHz | 150 ns | EEPROM | SPI | 5ms | 4 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.5mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11LC010-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 11LC010 | 8 | 5V | Serial | 1Kb 128 x 8 | 5mA | 100kHz | EEPROM | 单线 | 5ms | 1 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 4.953mm | 10.16mm | 7.112mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 23LC512-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Automotive grade | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Volatile | -40°C~125°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | NOT APPLICABLE | 1 | 5V | 2.54mm | NOT APPLICABLE | 23LC512 | 5.5V | 2.5V | 512Kb 64K x 8 | 1 | 10mA | 16MHz | 32 ns | SRAM | SPI - Quad I/O | 8 | 16b | 512 kb | SERIAL | Synchronous | 8b | 5.334mm | ROHS3 Compliant |