类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 输出低电流-最大值 | 过滤器 | 压缩法 | 负电源电压 | 标准 | 增益公差-最大 | 线性编码 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 长度 | 宽度 | |||||||||||||||
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PC33889DW | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | FREESCALE SEMICONDUCTOR INC | SOIC | SOP, | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 28 | Obsolete | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 28 | R-PDSO-G28 | 不合格 | AUTOMOTIVE | 2.65 mm | 电路接口 | 17.925 mm | 7.5 mm | ||||||||||||||||||||||||||||||||
TEA7088AFP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | STMICROELECTRONICS | SOIC | SOP, SOP28,.4 | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | 小概要 | 28 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | not_compliant | 28 | R-PDSO-G28 | 不合格 | OTHER | 2.65 mm | 电话多功能电路 | 17.9 mm | 7.5 mm | ||||||||||||||||||||||||||||
WE9215 | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | WINBOND ELECTRONICS CORP | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 28 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T28 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||||||||||
PX1011BI-EL1/G | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NXP SEMICONDUCTORS | BGA | LFBGA, | SOT-643-1 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.2 V | 81 | 有 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 30 | 81 | S-PBGA-B81 | 不合格 | INDUSTRIAL | 1.6 mm | 电路接口 | 9 mm | 9 mm | ||||||||||||||||||||||||
IDT82V3380DQ | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | INTEGRATED DEVICE TECHNOLOGY INC | QFP | HLFQFP, | 85 °C | -40 °C | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 3.3 V | 100 | 无 | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | INDUSTRIAL | 1.4 mm | 电信电路 | 14 mm | 14 mm | |||||||||||||||||||||||||||
TK83361MTL-G | TOKO Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | TOKO INC | SOP, | 70 °C | -30 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 4 V | 16 | 有 | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | unknown | 未说明 | R-PDSO-G16 | 不合格 | OTHER | 1.94 mm | 电信电路 | 9.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||
TK83361MTL-G | Asahi Kasei Microsystems Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | ASAHI KASEI MICRODEVICES CORP | SOIC | SOP, | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 4 V | 16 | Obsolete | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 16 | R-PDSO-G16 | INDUSTRIAL | 1.94 mm | 电信电路 | 9.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||
TK83361MTL-G | Asahi Kasei Power Devices Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 接触制造商 | ASAHI KASEI POWER DEVICES CORP | SOIC | SOP, | 70 °C | -30 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 4 V | 16 | 有 | 有 | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | unknown | 未说明 | 16 | R-PDSO-G16 | 不合格 | OTHER | 1.94 mm | 电信电路 | 9.9 mm | 3.9 mm | |||||||||||||||||||||||||||
LT3960JMSE#WTRPBF | Analog Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | EXPOSED PAD MINI_SOIC | EXPOSED PAD MINI_SOIC | 150 °C | -40 °C | PLASTIC/EPOXY | HTSSOP | TSSOP10,.2,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | 3.3 V | 10 | 2020-10-15 | 有 | DUAL | 鸥翼 | 未说明 | 1 | 0.5 mm | 未说明 | 10 | S-PDSO-G10 | 400 Mbps | 1.1 mm | AEC-Q100 | 可收发器 | 1 | 3 mm | 3 mm | ||||||||||||||||||||||||||||
TCM129C14DWR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TEXAS INSTRUMENTS INC | SOP, | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 24 | Obsolete | FULL DUPLEX | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G24 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 13 mA | 2.65 mm | PCM 编解码器 | YES | A/MU-LAW | -5 V | 15.4 mm | 7.5 mm | |||||||||||||||||||||||||||
TZA3005H | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | 飞利浦半导体 | QFP, QFP64,.66SQ,32 | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | 64 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.8 mm | unknown | S-PQFP-G64 | 不合格 | ATM/SONET/SDH TRANSCEIVER | |||||||||||||||||||||||||||||||||||||
TP3410J304 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, DIP28,.6 | 1 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 28 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | compliant | R-GDIP-T28 | 不合格 | 160 Mbps | 数码单反 | 0.0032 A | ANSI T1.601 | BASIC | U | 2.4 V | 0.4 V | ||||||||||||||||||||||||||
TJA1145ATK | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NXP SEMICONDUCTORS | , | 150 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC14,.12,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 14 | 2019-09-04 | 活跃 | EAR99 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.65 mm | unknown | R-PDSO-N14 | 65 mA | 1 mm | AEC-Q100 | 可收发器 | 1 | 3 mm | 4.5 mm | |||||||||||||||||||||||||||||
M21451G-13 | Mindspeed Technologies Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MINDSPEED TECHNOLOGIES INC | , | Obsolete | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
TC35603F | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
QHX220ICSR | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | RENESAS ELECTRONICS CORP | 有 | 8542.39.00.01 | compliant | 电信电路 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
NJG1161PCD | Nisshinbo Micro Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | NISSHINBO MICRO DEVICES INC | PACKAGE-10 | 105 °C | -40 °C | UNSPECIFIED | BCC | LCC10,.09SQ,20 | SQUARE | CHIP CARRIER | 2.8 V | 10 | 有 | BOTTOM | BUTT | 1 | 0.5 mm | compliant | S-XBCC-B10 | 6.4 mA | 0.63 mm | 射频和基带电路 | 2.5 mm | 2.5 mm | |||||||||||||||||||||||||||||||||
TP13067AN | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | TEXAS INSTRUMENTS INC | DIP, DIP20,.3 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | 20 | 无 | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | not_compliant | 未说明 | R-PDIP-T20 | 不合格 | INDUSTRIAL | SYNCHRONOUS/ASYNCHRONOUS | 11 mA | 5.08 mm | PCM 编解码器 | YES | A-LAW | -5 V | 0.15 dB | 不提供 | 24.325 mm | 7.62 mm | |||||||||||||||||||||
SC11031CQ | Sierra Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SIERRA SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | QFP | QFP80,.7SQ | RECTANGULAR | FLATPACK | 5 V | 80 | 无 | e0 | 锡铅 | QUAD | 鸥翼 | 1 | 0.635 mm | unknown | R-PQFP-G80 | 不合格 | COMMERCIAL | 60 mA | 电信电路 | ||||||||||||||||||||||||||||||||||
S2046B | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | APPLIED MICRO CIRCUITS CORP | QFP | QFP, QFP52,.52SQ | 70 °C | PLASTIC/EPOXY | QFP | QFP52,.52SQ | SQUARE | FLATPACK | 3.3 V | 52 | Obsolete | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | 52 | S-PQFP-G52 | 不合格 | COMMERCIAL | 160 mA | 2.45 mm | 以太网收发器 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||
S2046B | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | ROCHESTER ELECTRONICS LLC | QFP, | 70 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 3.3 V | 52 | 接触制造商 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | S-PQFP-G52 | COMMERCIAL | 2.45 mm | 以太网收发器 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||
TQ-95 | Taiyosha Electric Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PEB20590HV2.1 | Lantiq | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | LANTIQ | QFP, | 70 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 3.3 V | 80 | Obsolete | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | S-PQFP-G80 | COMMERCIAL | 2.45 mm | 数码单反 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
GD16585-EB | Giga | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | GIGA | , | Transferred | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
GD16585-EB | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INTEL CORP | BGA | BGA, | 70 °C | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | 网格排列 | 132 | Obsolete | SONET;SDH | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | unknown | 132 | S-CBGA-B132 | 不合格 | COMMERCIAL | 2.1 mm | ATM/SONET/SDH MUX/DEMUX | -5.2 V | 13 mm | 13 mm |