表面安装

YES

终端数量

64

No

Transferred

PHILIPS SEMICONDUCTORS

QFP, QFP64,.66SQ,32

PLASTIC/EPOXY

QFP

QFP64,.66SQ,32

SQUARE

FLATPACK

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

GULL WING

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G64

资历状况

Not Qualified

通信IC类型

ATM/SONET/SDH TRANSCEIVER