类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 通信IC类型 | 过滤器 | 长度 | 宽度 | |||||||||||||||
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HMC737LP4 | Hittite Microwave Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | HITTITE MICROWAVE CORP | QFN | HVQCCN, | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER | 4.2 V | 24 | 无 | e0 | 无 | EAR99 | 锡铅 | 8542.39.00.01 | QUAD | 无铅 | 235 | 1 | 0.5 mm | compliant | 24 | S-PQCC-N24 | 不合格 | INDUSTRIAL | 1 mm | 电信电路 | 4 mm | 4 mm | |||||||||||
HMC737LP4 | Analog Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ANALOG DEVICES INC | QFN-24 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER | 4.2 V | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-PQCC-N24 | 不合格 | INDUSTRIAL | 1 mm | 电信电路 | 4 mm | 4 mm | |||||||||||||||
SI3230M-GT | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SILICON LABORATORIES INC | , | Obsolete | unknown | SLIC | ||||||||||||||||||||||||||||||||||||||||
TA31076F (TP1) | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||
CM8870C | California Micro Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | CALIFORNIA MICRO DEVICES CORP | DIP | DIP, DIP18,.3 | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 5 V | 18 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-CDIP-T18 | 不合格 | COMMERCIAL | 7 mA | DTMF信号电路 | |||||||||||||||||
R6653-20 | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 康讯系统 | QFP | QFP, | 70 °C | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 5 V | 100 | Obsolete | HALF DUPLEX; FULL DUPLEX | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | 100 | R-PQFP-G100 | 不合格 | COMMERCIAL | 2 Mbps | 3.4 mm | MODEM-SUPPORT CIRCUIT | 20 mm | 14 mm | |||||||||||||||||
VISHA10017 | Vishay Intertechnologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||
RF6555 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | RF MICRO DEVICES INC | QCCN, | UNSPECIFIED | QCCN | SQUARE | CHIP CARRIER | 20 | Transferred | 8542.39.00.01 | QUAD | 无铅 | 1 | unknown | S-XQCC-N20 | 电信电路 | |||||||||||||||||||||||||||||
R8071AG | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Transferred | 康讯系统 | PGA, PGA68,11X11 | 70 °C | CERAMIC | PGA | PGA68,11X11 | SQUARE | 网格排列 | 5 V | 68 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | compliant | S-XPGA-P68 | 不合格 | COMMERCIAL | ||||||||||||||||||||||
PX1012AI-EL1/G | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NXP SEMICONDUCTORS | BGA | LFBGA, | SOT-643-1 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.2 V | 81 | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 81 | S-PBGA-B81 | 不合格 | INDUSTRIAL | 1.6 mm | 电路接口 | 9 mm | 9 mm | ||||||||||||||
TH72015 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MELEXIS N V | QFN | HVSON, | 125 °C | -40 °C | UNSPECIFIED | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 10 | Obsolete | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | 不合格 | AUTOMOTIVE | 1 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||||
ATA8403C-6AQY | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | MICROCHIP TECHNOLOGY INC | LEAD FREE, TSSOP-8 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 8 | 有 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.65 mm | compliant | S-PDSO-G8 | 不合格 | INDUSTRIAL | 0.011 mA | 1.05 mm | 电信电路 | 3 mm | 3 mm | |||||||||||||||||
MXL86282C-ABE-R | MaxLinear Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||
SY8805DFC | Silergy Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||
WM9712LSEFT/V | Cirrus Logic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | CIRRUS LOGIC INC | TFQFP, | 85 °C | -25 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.3 V | 48 | Obsolete | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | compliant | S-PQFP-G48 | OTHER | SYNCHRONOUS | 1.2 mm | PCM 编解码器 | YES | 7 mm | 7 mm | |||||||||||||||||||
RFFM6906 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QORVO INC | 2020-04-06 | Obsolete | 5A991.G | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||
AWT6321RM28P9 | ANADIGICS Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | ANADIGICS INC | BCC | HQCCN, | 3 | 85 °C | -20 °C | UNSPECIFIED | HQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | 3.4 V | 14 | 有 | 8542.39.00.01 | BOTTOM | 无铅 | 1 | 0.73 mm | unknown | 14 | R-XBCC-N14 | 不合格 | OTHER | 1.1 mm | 射频和基带电路 | 5 mm | 3 mm | ||||||||||||||||
AWT6321RM28P9 | Coherent Thermal Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | II-VI INC | 3 X 5 MM, 1 MM HEIGHT, ROHS COMPLIANT, SMT-14 | 3 | 85 °C | -20 °C | UNSPECIFIED | HQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | 3.4 V | 14 | 有 | 8542.39.00.01 | BOTTOM | 无铅 | 1 | 0.73 mm | unknown | R-XBCC-N14 | 不合格 | OTHER | 1.1 mm | 射频和基带电路 | 5 mm | 3 mm | ||||||||||||||||||
L7582HAE | Alcatel-Lucent | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||
BCM54994EB0IFSBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||
RFVA1027TR13 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | RF MICRO DEVICES INC | QFN | QCCN, | 3 | 85 °C | -40 °C | UNSPECIFIED | QCCN | SQUARE | CHIP CARRIER | 5 V | 8 | 有 | 有 | 5A991.G | 8542.33.00.01 | QUAD | 无铅 | 1 | compliant | 8 | S-XQCC-N8 | INDUSTRIAL | 射频和基带电路 | 7 mm | 7 mm | |||||||||||||||||
RF7303 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Transferred | RF MICRO DEVICES INC | , | UNSPECIFIED | SQUARE | 微电子组件 | 10 | 有 | 8542.39.00.01 | DUAL | 无铅 | 未说明 | 1 | unknown | 未说明 | S-XDMA-N10 | 基带电路 | |||||||||||||||||||||||||||
SX1272IMLTRT-CUT | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||
LE75183CFSC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICROSEMI CORP | SOIC | SOP, | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 28 | 有 | e3 | 哑光锡 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | 不合格 | INDUSTRIAL | 2.65 mm | 电信电路 | 17.9 mm | 7.5 mm | |||||||||||||||
SC5272-M4 | Hangzhou Silan Microelectronics CO LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | -20 °C | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 5 V | DIP, DIP18,.3 | HANGZHOU SILAN MICROELECTRONICS CO LTD | 接触制造商 | 有 | 18 | 70 °C | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T18 | 不合格 | COMMERCIAL | 电信电路 |