类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 通信IC类型 | 过滤器 | 压缩法 | 负电源电压 | 增益公差-最大 | 线性编码 | 长度 | 宽度 | ||||||||||||||
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![]() | RFFM8515TR7 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | QORVO INC | HVQCCN, LCC16,.09SQ,16 | 2 | 85 °C | -40 °C | HVQCCN | LCC16,.09SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 16 | 有 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.4 mm | compliant | S-XQCC-N16 | INDUSTRIAL | 电信电路 | 2.3 mm | 2.3 mm | |||||||||||||||||||
![]() | TX4930 | Dau Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | DAU SEMICONDUCTOR INC | SSOP, SSOP16,.25 | 60 °C | -10 °C | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3 V | 16 | 接触制造商 | 8542.39.00.01 | DUAL | 鸥翼 | 0.635 mm | unknown | R-PDSO-G16 | 不合格 | COMMERCIAL | 12 mA | 电信电路 | |||||||||||||||||||||
![]() | HM9101AY | Hualon Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | HUALON MICROELECTRONICS CORP | , | 接触制造商 | unknown | ||||||||||||||||||||||||||||||||||||||||
![]() | BG96MA-128-SGN/02A07M1G-0101401014 | Quectel Wireless Solutions Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | SI4461-C1A-GMR | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | SI3453D-B01-GMR | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SILICON LABORATORIES INC | QFN | HVQCCN, | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | 3.3 V | 40 | 有 | 8542.39.00.01 | QUAD | 无铅 | 4 | 0.5 mm | unknown | 40 | S-XQCC-N40 | 不合格 | INDUSTRIAL | 0.9 mm | 电信电路 | -48 V | 6 mm | 6 mm | |||||||||||||||
![]() | TC35823F | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TOSHIBA CORP | QFP | FQFP, | 70 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 5 V | 240 | 活跃 | 8542.39.00.01 | QUAD | 鸥翼 | 4 | 0.5 mm | unknown | 240 | S-PQFP-G240 | 不合格 | COMMERCIAL | 4.45 mm | ATM/SONET/SDH NETWORK INTERFACE | 32.2 mm | 32.2 mm | ||||||||||||||||||
![]() | TDA5660P | Siemens | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | RFFC5072ASQ | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | RF MICRO DEVICES INC | QFN | HVQCCN, | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 32 | 有 | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | unknown | 未说明 | 32 | S-XQCC-N32 | INDUSTRIAL | 0.95 mm | 电信电路 | 5 mm | 5 mm | ||||||||||||||
![]() | RFFC5072ASQ | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | QORVO INC | HVQCCN, | 2 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 32 | 活跃 | e4 | 镍钯金 | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5 mm | compliant | 40 | S-XQCC-N32 | INDUSTRIAL | 0.95 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||
![]() | MH88631-2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | 美泰半导体 | SIP | , SIP40,.1 | 70 °C | PLASTIC/EPOXY | SIP40,.1 | RECTANGULAR | IN-LINE | 5 V | 40 | 无 | e0 | 锡铅 | 8542.39.00.01 | SINGLE | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-PSIP-T40 | 不合格 | COMMERCIAL | 8 mA | SLIC | -5 V | ||||||||||||||||
![]() | MT8961AC | Zarlink Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | ZARLINK SEMICONDUCTOR INC | DIP, DIP18,.3 | 70 °C | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 5 V | 18 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | unknown | R-XDIP-T18 | 不合格 | COMMERCIAL | 0.008 mA | PCM 编解码器 | YES | A-LAW | -5 V | 0.25 dB | 不提供 | ||||||||||||
![]() | MT8961AC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Transferred | MICROSEMI CORP | DIP, DIP18,.3 | 70 °C | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 5 V | 18 | 无 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-XDIP-T18 | 不合格 | COMMERCIAL | 8 mA | PCM 编解码器 | YES | A-LAW | -5 V | 0.25 dB | 不提供 | |||||||||||||||
![]() | TTRN012G5 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | BROADCOM LTD | FQFP, | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | RECTANGULAR | FLATPACK, FINE PITCH | 3.3 V | 128 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 1 | 0.5 mm | compliant | 30 | R-PQFP-G128 | 不合格 | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | 19.86 mm | 13.89 mm | ||||||||||||||||
![]() | PMB2200SV2.1G | Siemens | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | TK14588VTL | TOKO Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TOKO INC | TSSOP, | 85 °C | -30 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 16 | Obsolete | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.65 mm | unknown | R-PDSO-G16 | 不合格 | OTHER | 1.2 mm | 电信电路 | 5 mm | 4.4 mm | |||||||||||||||||||
![]() | SE2438T | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | SKYWORKS SOLUTIONS INC | HVQCCN, | 1 | 125 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 20 | 有 | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.4 mm | unknown | S-XQCC-N20 | AUTOMOTIVE | 0.6 mm | 电信电路 | 3 mm | 3 mm | |||||||||||||||||
![]() | BGS8L2 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NXP SEMICONDUCTORS | BCC, | 85 °C | -40 °C | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | 1.8 V | 6 | 不推荐 | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.4 mm | unknown | R-PBCC-B6 | INDUSTRIAL | 0.4 mm | 射频前端电路 | 1.1 mm | 0.7 mm | ||||||||||||||||||||
![]() | TCA3383A-DP | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | MOTOROLA INC | 60 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5.2 V | DIP, DIP28,.6 | 28 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T28 | 不合格 | COMMERCIAL | 5.08 mm | 电话语音电路 | 36.83 mm | 15.24 mm | |||||||||||||||
![]() | TCA3383A-DP | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP28,.6 | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5.2 V | 28 | 无 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T28 | 不合格 | 5.2 V | COMMERCIAL | |||||||||||||||||||||
![]() | SIW3500GIG3 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RF MICRO DEVICES INC | BGA | VFBGA, | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | 96 | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.5 mm | compliant | 96 | S-PBGA-B96 | 不合格 | INDUSTRIAL | 1 mm | 电信电路 | 6 mm | 6 mm | ||||||||||||||
![]() | RFPA3807PCK-410 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | RF MICRO DEVICES INC | HSOP, | 85 °C | -40 °C | PLASTIC/EPOXY | HSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | 5 V | 8 | Transferred | 5B991 | 9030.82.00.00 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G8 | INDUSTRIAL | 1.8288 mm | 射频和基带电路 | 4.8895 mm | 3.8989 mm | |||||||||||||||||||
![]() | PEB2465H | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | TH72036 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MELEXIS N V | QFN | HVSON, | 125 °C | -40 °C | UNSPECIFIED | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 10 | 有 | e3 | 哑光锡 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | 不合格 | AUTOMOTIVE | 1 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||
![]() | SC11004CN | Sierra Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | SIERRA SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | 24 | 无 | e0 | 锡铅 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | 1 Mbps | MODEM | -5 V |