N/A

-

活跃

RP-SMA

WiFi

58 mm x 115 mm x 70 mm

+ 60 C

48 V

0 C

12 V

-

Ethernet

-

802.11 a/b/g/n

National Semiconductor

Bulk

*

Wireless & RF Modules

2.4 GHz, 5 GHz

24 V

-

300 Mb/s

WiFi模块

N/A

-

085651

活跃

1

SkyeTek

SkyeTek

ThingMagic

射频模块

Molex

Bulk

*

Wireless & RF Modules

射频模块

N/A

-

RK73H1J

活跃

1

SkyeTek

SkyeTek

ThingMagic

射频模块

0603 (1608 Metric)

0603

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RK73H

0.063 L x 0.031 W (1.60mm x 0.80mm)

±1%

2

±100ppm/°C

1 MOhms

厚膜

0.1W, 1/10W

Wireless & RF Modules

-

Adapters

Automotive AEC-Q200, Moisture Resistant

射频模块

0.022 (0.55mm)

AEC-Q200

N/A

-

Obsolete

1

SkyeTek

SkyeTek

ThingMagic

射频模块

Panduit Corp

Bulk

*

Wireless & RF Modules

射频模块

N/A

-

活跃

100V

XB3-C-V1

Surface Mount, MLCC

1206 (3216 Metric)

Vishay Vitramon

Tape & Reel (TR)

-55°C ~ 150°C

GA

0.126 L x 0.063 W (3.20mm x 1.60mm)

±20%

X7R

汽车

0.039 µF

3V ~ 5.5V

-

-

-

32kB Flash, 32kB RAM

-

-

LE866AA-NA

4G LTE CAT-1 (Verizon)

23dBm

Cellular

Integrated, Chip + U.FL

-102dBm

SPI, UART, USB

-

850mA

-

-

-

0.067 (1.70mm)

AEC-Q200

N/A

-

1250V (1.25kV)

+ 85 C

3.6 V

- 40 C

171

1.9 V

ADC, GPIO, I2C, SPI, UART

- 90 dBm

Microchip

Microchip Technology / Atmel

Bluetooth Low Energy (BLE)

Tray

活跃

Bluetooth Modules - 802.15.1

通孔

Radial

Polypropylene (PP), Metallized

微芯片技术

--

-55°C ~ 110°C

Bulk

MKP385

0.689 L x 0.335 W (17.50mm x 8.50mm)

±5%

活跃

--

PC引脚

DC Link, DC Filtering; High Frequency, Switching; High Pulse, DV/DT

0.036µF

Wireless & RF Modules

1.9V ~ 3.6V

2.44 GHz

1.9 V to 3.6 V

0.591 (15.00mm)

-

0 dBm

-

-

Bluetooth 5.0

0dBm

Bluetooth

Integrated, Chip

-90dBm

I²C, SPI, UART

10mA

13mA

-

--

蓝牙模块

0.591 (15.00mm)

--

N/A

-

1600V (1.6kV)

通孔

Radial

Polypropylene (PP), Metallized

--

-55°C ~ 110°C

Tape & Box (TB)

MKP385

0.492 L x 0.157 W (12.50mm x 4.00mm)

±5%

活跃

--

PC引脚

DC Link, DC Filtering; High Frequency, Switching; High Pulse, DV/DT

470pF

0.295 (7.50mm)

--

0.472 (12.00mm)

--

N/A

-

50V

--

SMD

Thin-Film Directional Coupler

表面贴装

3000

KYOCERA AVX

KYOCERA AVX

Industrial grade

信号调理

通孔

Axial

--

-55°C ~ 125°C

Bulk

Military, MIL-PRF-39003/1, CSR13

0.289 Dia x 0.686 L (7.34mm x 17.42mm)

±20%

活跃

--

密封

6.8µF

Filters

4

--

M (1%)

--

C

Industrial

Military

信号调理

--

N/A

-

1250V (1.25kV)

通孔

Radial

Polypropylene (PP), Metallized

--

-55°C ~ 110°C

Tray

MKP385

1.240 L x 0.709 W (31.50mm x 18.00mm)

±5%

活跃

--

PC引脚

DC Link, DC Filtering; High Frequency, Switching; High Pulse, DV/DT

0.43µF

1.083 (27.50mm)

--

1.102 (28.00mm)

--

N/A

-

N/A

-

有

+ 105 C

3.8 V

- 40 C

100

1.8 V

SMD/SMT

10.6 mA

I2C, SPI, UART

- 96.2 dBm

4.3 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

Strip

BGM220

活跃

12.9 mm x 15 mm x 2.2 mm

Bluetooth Modules - 802.15.1

表面贴装

31-SMD Module

Silicon Labs

Chip

-40°C ~ 105°C (TA)

切割胶带

-

Wireless & RF Modules

1.8V ~ 3.8V

Shielded

2.44 GHz

1.8 V to 3.8 V

32 kB, 512 kB

8 dBm

2Mbps

EFR32BG22

Bluetooth 5.2

2.4 GHz to 2.4835 GHz

8dBm

Bluetooth

Integrated, Chip

- 96.2 dBm

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

4.3mA ~ 4.8mA

4.8mA ~ 10.8mA

GFSK

蓝牙模块

蓝牙模块

2.2 mm

15 mm

12.9 mm

N/A

-

有

+ 105 C

3.8 V

- 40 C

490

1.8 V

SMD/SMT

8.8 mA

I2C, SPI, UART

- 98.6 dBm

4.8 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

Tray

BGM220

活跃

6 mm x 6 mm x 1.1 mm

Bluetooth Modules - 802.15.1

表面贴装

44-SMD Module

Silicon Labs

Chip

-40°C ~ 105°C (TA)

Tray

-

Wireless & RF Modules

1.8V ~ 3.8V

Shielded

2.44 GHz

1.8 V to 3.8 V

32 kB, 352 kB

6 dBm

2Mbps

EFR32BG22

Bluetooth 5.2

2.4 GHz to 2.4835 GHz

6dBm

Bluetooth

Integrated, Chip

- 98.6 dBm

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

4.2mA ~ 4.8mA

4.6mA ~ 8.8mA

GFSK

蓝牙模块

蓝牙模块

1.1 mm

6 mm

6 mm

N/A

-

有

+ 85 C

3.8 V

- 40 C

1000

1.8 V

SMD/SMT

10.6 mA

I2C, SPI, UART

- 96.2 dBm

4.3 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

BGM220

活跃

Bluetooth Modules - 802.15.1

表面贴装

31-SMD Module

Silicon Labs

Chip

-40°C ~ 85°C (TA)

切割胶带

-

Wireless & RF Modules

1.8V ~ 3.8V

Shielded

2.44 GHz

1.8 V to 3.8 V

32 kB, 352 kB

8 dBm

2 Mb/s

EFR32BG22

Bluetooth 5.2

2.4 GHz to 2.4835 GHz

8dBm

Bluetooth

Integrated, Chip

- 96.2 dBm

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

4.3mA ~ 4.8mA

4.8mA ~ 10.8mA

GFSK

蓝牙模块

蓝牙模块

2.2 mm

15 mm

12.9 mm

N/A

-

Gold

U.FL

有

+ 125 C

3.8 V

- 40 C

1000

1.71 V

PCB 安装

173 mA

I2C

- 94.1 dBm

9.9 mA

Silicon Laboratories

Silicon Labs

Bluetooth Low Energy (BLE), Class 2

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

BGM210

活跃

15 mm x 12.9 mm x 2.2 mm

Bluetooth Modules - 802.15.1

表面贴装

31-SMD Module

Aluminium

Silicon Labs

Non-Compliant

-40°C ~ 125°C (TA)

切割胶带

蓝壁虎

Crimp

Circular

USB适配器

2.805 MΩ

Receptacle

Wireless & RF Modules

1.71V ~ 3.8V

Shielded

2.44 GHz

3

3 V

Socket

5 GΩ

1 MB

10 dBm

2 Mb/s

EFR32BG21

Bluetooth 5.1

2.4 GHz to 2.4835 GHz

10dBm

Bluetooth

Integrated, Chip

-104.5dBm

ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART

9.1mA ~ 9.9mA

16.1mA ~ 34.1mA

GFSK

蓝牙模块

蓝牙模块

2.2 mm

15 mm

12.9 mm

无SVHC

N/A

-

BGM220

活跃

Chip

有

+ 105 C

3.8 V

- 40 C

2500

1.8 V

SMD/SMT

8.8 mA

I2C, SPI, UART

- 98.6 dBm

4.8 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

6 mm x 6 mm x 1.1 mm

Bluetooth Modules - 802.15.1

表面贴装

44-SMD Module

Silicon Labs

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-40°C ~ 105°C (TA)

MouseReel

-

Wireless & RF Modules

1.8V ~ 3.8V

Shielded

2.4GHz ~ 2.4835GHz

1.8 V to 3.8 V

512kB Flash, 32kB RAM

6 dBm

2Mbps

EFR32BG22

Bluetooth v5.2

2.4 GHz to 2.4835 GHz

6dBm

Bluetooth

Integrated, Chip

-106.4dBm

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

4.2mA ~ 4.8mA

4.6mA ~ 8.8mA

GFSK

蓝牙模块

蓝牙模块

1.1 mm

6 mm

6 mm

N/A

-

Non-Compliant

Bulk

活跃

表面贴装

42-SMD Module

SparkFun Electronics

200 V

-40°C ~ 85°C

-

1 %

100 ppm/°C

240 Ω

155 °C

-55 °C

厚膜

250 mW

3V ~ 3.6V

2.4GHz

4MB Flash

150Mbps

ESP32-S2

802.11b/g/n

19.5dBm

WiFi

PCB Trace

-97dBm

GPIO, I²C, I²S, JTAG, PWM, SPI, UART

63mA ~ 68mA

160mA ~ 310mA

-

650 µm

N/A

-

有

+ 105 C

3.8 V

- 40 C

1000

1.8 V

SMD/SMT

200 mA

I2C

- 98.9 dBm

50 mA

Silicon Laboratories

Silicon Labs

Built-in

Bluetooth Low Energy (BLE)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

BGX220P22

最后一次购买

Bluetooth Modules - 802.15.1

表面贴装

31-SMD Module

Silicon Labs

Compliant

-40°C ~ 105°C (TA)

Tape & Reel (TR)

-

0.1 %

2

25 ppm/°C

93.1 kΩ

125 °C

-55 °C

Thin Film

Wireless & RF Modules

500 mW

500 mW

1.71V ~ 3.8V

Shielded

2.44 GHz

3 V

512 kB, 32 kB

8.2 dBm

2 Mb/s

EFR32BG22

Bluetooth 5.2

2400 MHz to 2483.5 MHz

8.2dBm

Bluetooth

Integrated, Chip

- 98.9 dBm

I²C, UART

3.1mA ~ 4mA

4.3mA ~ 4.6mA

-

蓝牙模块

Automotive AEC-Q200, Moisture Resistant

蓝牙模块

762 µm

6.2992 mm

3.0988 mm

N/A

-

N/A

-

有

+ 85 C

3.3 V

- 40 C

1000

3.3 V

SMD/SMT

7 mA

Serial

- 91.2 dBm

7 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

BGX13P22

最后一次购买

Bluetooth Modules - 802.15.1

表面贴装

Module

Silicon Labs

U.FL

-40°C ~ 85°C (TA)

切割胶带

蓝壁虎

USB适配器

Male

Wireless & RF Modules

2.4V ~ 3.8V

Shielded

2.44 GHz

3.3 V

-

8 dBm

2 Mb/s

BGX13P

Bluetooth 5.0

2.4 GHz to 2.4835 GHz

8dBm

Bluetooth

Integrated, Chip

- 91.2 dBm

UART, USART

3.5mA ~ 7mA

3.5mA ~ 7mA

GFSK

蓝牙模块

蓝牙模块

2 mm

15 mm

12.9 mm

N/A

-

HL7800

活跃

表面贴装

86-BFLGA Module

Sierra Wireless

Tape & Reel (TR)

-40°C ~ 85°C

HL - AirPrime®

3.2V ~ 4.35V

-

-

375kbps

-

GLONASS, GPS, LTE

23dBm

Cellular, Navigation

Antenna Not Included, SMA, U.FL

-161dBm

GPIO, PCM, UART, USB

-

-

-

N/A

-

-

活跃

表面贴装

16-SMD Module

Adafruit Industries LLC

Bulk

-

-

-

868MHz ~ 915MHz

-

-

RFM95CW

LoRa™

20dBm

General ISM < 1GHz

Integrated, Wire Antenna

-

SPI

-

-

LoRa

N/A

-

N/A

-

Tape & Reel (TR)

ESP32

不用于新设计

表面贴装

38-SMD Module

Espressif Systems

Non-Compliant

-40°C ~ 85°C (TA)

ESP32

1 %

2

300 ppm/°C

40 mΩ

275 °C

-65 °C

Wirewound

7 W

3V ~ 3.6V

2.4GHz

4MB Flash

150Mbps

ESP32-D0WD

802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3

18.5dBm

Bluetooth, WiFi

PCB Trace

-98dBm

ADC, GPIO, I²C, I²S, JTAG, SDIO, SPI, UART

-

-

CCK, DSSS, OFDM

35.3314 mm

9.525 mm

N/A

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

ENS22

Obsolete

表面贴装

106-BLGA Module

Telit Cinterion

Non-Compliant

-40°C ~ 85°C

Cinterion ENS22

2.8V ~ 4.2V

700MHz, 800MHz, 850MHz, 900MHz, 1.8GHz

-

250kbps

Hi2115

LTE CAT.NB

23dBm

Cellular

不包括天线

-

UART, USB

-

-

-

N/A

-

表面贴装

Module

-40°C ~ 85°C

Tape & Reel (TR)

--

活跃

2.7 V ~ 3.6 V

2.4GHz ~ 2.5GHz

448kB ROM, 520kB SRAM

150Mbps

ESP32-D0WDQ6

802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3

20.5dBm

Bluetooth, WiFi

--

-98dBm

I²C, I²S, PWM, SDIO, UART

--

--

CCK, DSSS, OFDM