表面安装

NO

越来越多的功能

THROUGH HOLE MOUNT

终端数量

8

No

Obsolete

TELCOM SEMICONDUCTOR INC

3 Cel

125 °C

-55 °C

1000 µA

CERAMIC

RECTANGULAR

18 V

4.5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

Reach合规守则

unknown

终端类型

SOLDER

传感器/传感器类型

TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,DUAL TRIP POINT

房屋

CERAMIC, METAL-SEALED COFIRED

工作电流-最大值

0.2 mA