8-146458-2
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PCB Mount Header, Vertical, Board-to-Board, 32 Position, 2.54 mm [.1 in] Centerline, Unshrouded, Tin, Through Hole - Solder, Signal, AMPMODU Headers
规格参数
- 类型参数全选
触点镀层
Tin
房屋材料
Thermoplastic
250
TE Connectivity
TE Connectivity
AMPMODU
Details
系列
AMPMODU MOD II
定位的数量
32 Position
子类别
Headers & Wire Housings
螺距
2.54 mm
行间距
2.54 mm
产品类别
Headers & Wire Housings
产品
Headers
产品类别
Headers & Wire Housings