8-146276-2
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PCB Mount Header, Vertical, Board-to-Board, 32 Position, 2.54 mm [.1 in] Centerline, Breakaway, Gold, Through Hole - Solder, Signal, AMPMODU Headers
规格参数
- 类型参数全选
触点镀层
Gold
房屋材料
Liquid Crystal Polymer (LCP)
100
TE Connectivity
TE Connectivity
AMPMODU
Details
系列
AMPMODU MOD II
包装
Bulk
定位的数量
32 Position
行数
1 Row
子类别
Headers & Wire Housings
螺距
2.54 mm
终端样式
Solder Pin
房屋颜色
Black
产品类别
Headers & Wire Housings
产品类别
Headers & Wire Housings