![5-147378-1](https://res.utmel.com/Images/category/Connectors, Interconnects.png)
规格参数
- 类型参数全选
触点镀层
Gold
房屋材料
Thermoplastic (TP)
Straight
30
Solder
Glass Reinforced Thermoplastic
Phosphor Bronze
Surface Mount
30 V
300
TE Connectivity
TE Connectivity
AMPMODU
Details
操作温度
-65 to 105 °C
系列
AMPMODU SYSTEM 50
包装
Reel
类型
Socket Strip
定位的数量
10 Position
行数
2
性别
Receptacle
子类别
Board to Board & Mezzanine Connectors
螺距
1.2700 mm
终端样式
Solder
房屋颜色
Black
产品类别
Board to Board & Mezzanine Connectors
产品
Receptacles
安装角
Vertical
产品类别
Board to Board & Mezzanine Connectors