![5-146483-3](https://res.utmel.com/Images/category/Connectors, Interconnects.png)
5-146483-3
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PCB Mount Header, Vertical, Board-to-Board, 6 Position, 2.54 mm [.1 in] Centerline, Breakaway, Tin, Through Hole - Solder, Signal, AMPMODU Headers
规格参数
- 类型参数全选
触点镀层
Tin
房屋材料
Thermoplastic (TP)
Straight
Solder
22 to 12, 16 AWG
Thermoplastic
Copper Alloy
Through Hole
+ 125 C
- 65 C
100
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TE Connectivity
TE Connectivity
AMPMODU
Details
系列
AMPMODU MOD II
类型
Unshrouded
定位的数量
6 Position
子类别
Headers & Wire Housings
螺距
9.5200 mm
额定电流
3 A
引脚数量
16
终端样式
Solder Pin
房屋颜色
Black
行间距
2.54 mm
配套立柱长度
2.79 mm
产品类别
Headers & Wire Housings
产品
Headers
产品类别
Headers & Wire Housings
产品长度
153.94 mm