MLE-111-01-G-DV-A-P
-
CONN RCPT 22POS 0.039 GOLD SMD
规格参数
- 类型参数全选
工厂交货时间
3 Weeks
底架
Surface Mount
安装类型
Surface Mount
触点形状
Square
Gold
Beryllium Copper
Liquid Crystal Polymer (LCP)
310VAC
操作温度
-55°C~125°C
包装
Tube
系列
MLE
已出版
2011
JESD-609代码
e4
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
连接器类型
Receptacle
定位的数量
22
行数
2
性别
Female
紧固类型
Push-Pull
触点类型
Female Socket
额定电流
2.9A per Contact
绝缘高度
0.130 3.30mm
样式
Board to Board
已加载定位数量
All
Reach合规守则
not_compliant
间距 - 配套
0.039 1.00mm
绝缘颜色
Black
行间距-交配
0.039 (1.00mm)
特征
Board Guide, Pick and Place
触点表面处理厚度 - 配套
10.0μin 0.25μm
RoHS状态
ROHS3 Compliant
无铅
Lead Free
相关型号
- 图片产品型号品牌GenderNumber of RowsMountTerminationContact MaterialMoisture Sensitivity Level (MSL)Contact Finish Thickness - Mating
MLE-111-01-G-DV-A-P
Female
2
Surface Mount
Solder
Beryllium Copper
1 (Unlimited)
10.0μin (0.25μm)
Female
2
Surface Mount
Solder
Beryllium Copper
1 (Unlimited)
10.0μin (0.25μm)
Female
2
Surface Mount
Solder
Phosphor Bronze
1 (Unlimited)
10.0μin (0.25μm)
Female
2
Surface Mount
Solder
Beryllium Copper
1 (Unlimited)
10.0μin (0.25μm)
MLE-111-01-G-DV-A-P PDF数据手册
- 数据表 :