表面安装

YES

终端数量

85

Yes

Obsolete

RENESAS ELECTRONICS CORP

FBGA, BGA85,10X10,20

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA85,10X10,20

SQUARE

GRID ARRAY, FINE PITCH

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B85

资历状况

Not Qualified

温度等级

OTHER