规格参数
- 类型参数全选
工厂交货时间
10 Weeks
底架
Through Hole
安装类型
Through Hole
触点形状
Circular
Gold
Beryllium Copper
Liquid Crystal Polymer (LCP), Glass Filled
操作温度
-55°C~125°C
包装
Bulk
系列
833
已出版
2012
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Press-Fit, Solder
连接器类型
Socket
定位的数量
84
行数
2
紧固类型
Push-Pull
触点类型
Female Socket
额定电流
3A
绝缘高度
0.165 4.20mm
样式
Board to Board
已加载定位数量
All
间距 - 配套
0.079 2.00mm
绝缘颜色
Black
行间距-交配
0.079 (2.00mm)
触点长度 - 柱子
0.098 2.50mm
触点表面处理 - 柱子
Tin
触点表面处理厚度 - 配套
29.5μin 0.75μm
材料可燃性等级
UL94 V-0
RoHS状态
ROHS3 Compliant
相关型号
- 图片产品型号品牌Number of PositionsNumber of RowsMountRow Spacing - MatingMoisture Sensitivity Level (MSL)Pitch - MatingFastening TypeNumber of Positions Loaded
833-83-084-64-001101
84
2
Through Hole
0.079 (2.00mm)
1 (Unlimited)
0.079 (2.00mm)
Push-Pull
All
84
2
Through Hole
0.079 (2.00mm)
1 (Unlimited)
0.079 (2.00mm)
Push-Pull
All
84
2
Through Hole
0.079 (2.00mm)
1 (Unlimited)
0.079 (2.00mm)
Push-Pull
All
80
2
Through Hole
0.079 (2.00mm)
1 (Unlimited)
0.079 (2.00mm)
Push-Pull
All
84
2
Through Hole
0.079 (2.00mm)
1 (Unlimited)
0.079 (2.00mm)
Push-Pull
All
833-83-084-64-001101 PDF数据手册
- 数据表 :
- 环境信息 :