规格参数
- 类型参数全选
工厂交货时间
10 Weeks
底架
Surface Mount
安装类型
Surface Mount
引脚数
68
房屋材料
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
位置或引脚数量(网格)
68 (10 x 10)
触点材料 - 配套
Beryllium Copper
触点材料 - 柱子
Brass
Gold
操作温度
-55°C~125°C
包装
Bulk
系列
514
已出版
2012
JESD-609代码
e3
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
ECCN 代码
EAR99
类型
PGA
附加功能
STANDARD: UL 94V-0
HTS代码
8536.69.40.40
额定电流
1A
间距 - 配套
0.100 2.54mm
接头数量
68
触点表面处理 - 柱子
Tin
引线长度
1.397mm
触点电阻
10mOhm
端子柱长度
0.055 1.40mm
间距--柱子
0.100 2.54mm
特征
Open Frame
触点表面处理厚度 - 配套
Flash
材料可燃性等级
UL94 V-0
RoHS状态
ROHS3 Compliant
可燃性等级
UL94 V-0
相关型号
- 图片产品型号品牌MountTerminationHousing MaterialPitch - PostContact Material - MatingPackagingPart StatusPitch - Mating
514-87-068-10-061117
Surface Mount
Solder
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
0.100 (2.54mm)
Beryllium Copper
Bulk
Active
0.100 (2.54mm)
Surface Mount, Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
Bulk
Active
0.100 (2.54mm)
Surface Mount, Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
Bulk
Active
0.100 (2.54mm)
Surface Mount, Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
Bulk
Active
0.100 (2.54mm)
Horizontal, Surface Mount, Through Hole
Solder
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100 (2.54mm)
Beryllium Copper
Bulk
Active
0.100 (2.54mm)
514-87-068-10-061117 PDF数据手册
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