![AGN200S06X](https://res.utmel.com/Images/category/Relays.png)
规格参数
- 类型参数全选
1 A
257 Ohms
Silver Palladium (AgPd) with Gold Plating
Yes
SMD/SMT
500
触点额定电流
1 A
触点终端
Solder Pad
触点形式
DPDT (2 Form C)
线圈电压
6 VDC
线圈型
Latching
线圈电流
23.3 mA
消耗功率
140 mW
1 A
257 Ohms
Silver Palladium (AgPd) with Gold Plating
Yes
SMD/SMT
500
触点额定电流
1 A
触点终端
Solder Pad
触点形式
DPDT (2 Form C)
线圈电压
6 VDC
线圈型
Latching
线圈电流
23.3 mA
消耗功率
140 mW