表面安装

YES

材料

body - nickel-plated brass; seal - silicone rubber

终端数量

64

Purpose

for pressure equalization in sealed housings and protection from condensation formation

IP67

Application area

electrotechnical, lighting, photoelectric, security, automotive and other equipment

Air permeability

not less than 1 l/min at 70 mbar pressure

No

Obsolete

NATIONAL SEMICONDUCTOR CORP

TFQFP, TQFP64,.47SQ

70 °C

PLASTIC/EPOXY

TFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

JESD-609代码

e0

无铅代码

No

类型

Pressure equalization valve M8X1.25, metal

电阻

hydrostatic pressure - not less than 100 mbar for 30 min

端子表面处理

TIN LEAD

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

GULL WING

峰值回流焊温度（摄氏度）

235

功能数量

1

端子间距

0.5 mm

Reach合规守则

not_compliant

JESD-30代码

S-PQFP-G64

资历状况

Not Qualified

电源电压-最大值(Vsup)

2.625 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

2.375 V

座位高度-最大

1.2 mm

消费者集成电路类型

CONSUMER CIRCUIT

饱和电流

2

长度

10 mm

宽度

10 mm