型号:

50-02-1038-0000

品牌:

封装:

-

描述:

CHO-BOND 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics CHO BOND� 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding.