826-22-064-00-001000
-
Headers & Wire Housings DIP SPRING PIN HDR 64P, SOLDERCUP, 20U
规格参数
- 类型参数全选
工厂交货时间
3 Weeks
底架
Solder, Through Hole
安装类型
Through Hole, Solder Cup
材料
Beryllium Copper
包装
Bulk
系列
826
JESD-609代码
e4
无铅代码
yes
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
连接器类型
Piston
行数
2
附加功能
PANEL MOUNTABLE
MIL一致性
NO
符合 DIN 标准
NO
IEC一致性
NO
过滤功能
NO
混合接触
NO
选项
GENERAL PURPOSE
螺距
0.100 2.54mm
触点表面处理
Gold
接头数量
64
触点性别
MALE
行间距
0.100 (2.54mm)
触点表面处理厚度
20.0μin 0.51μm
RoHS状态
ROHS3 Compliant
相关型号
- 图片产品型号品牌PitchNumber of RowsMountTerminationMoisture Sensitivity Level (MSL)Part StatusRow Spacing - MatingPitch - Mating
826-22-064-00-001000
0.100 (2.54mm)
2
Solder, Through Hole
Solder
1 (Unlimited)
Active
-
-
-
2
Through Hole
Solder
1 (Unlimited)
Active
0.100 (2.54mm)
0.100 (2.54mm)
-
2
Through Hole
Solder
1 (Unlimited)
Active
0.100 (2.54mm)
0.100 (2.54mm)
2.54 mm
2
Through Hole
Solder
1 (Unlimited)
Active
0.100 (2.54mm)
0.100 (2.54mm)
-
2
Through Hole
Solder
1 (Unlimited)
Active
0.100 (2.54mm)
0.100 (2.54mm)
826-22-064-00-001000 PDF数据手册
- 环境信息 :