规格参数
- 类型参数全选
工厂交货时间
6 Weeks
触点镀层
Gold
安装孔直径
0.089 (2.26mm)
Beryllium Copper
包装
Bulk
JESD-609代码
e0
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
连接器类型
INTERCONNECTION DEVICE
绝缘材料
Non-Insulated
孔直径
2.2606 mm
法兰直径
0.126 (3.20mm)
尾部类型
No Tail
接受销直径
0.032 ~ 0.046 (0.81mm ~ 1.17mm)
插座深度
0.236 5.99mm
长度
5.9944mm
触点表面处理厚度
10.0μin 0.25μm
长度 - 整体
0.236 6.00mm
RoHS状态
Non-RoHS Compliant
相关型号
- 图片产品型号品牌TerminationInsulationContact PlatingContact MaterialMoisture Sensitivity Level (MSL)PackagingContact Finish Thickness
1496
Solder
Non-Insulated
Gold
Beryllium Copper
1 (Unlimited)
Bulk
10.0μin (0.25μm)
Solder
Non-Insulated
-
Brass Alloy
1 (Unlimited)
Bulk
10.0μin (0.25μm)
Solder
Non-Insulated
-
Brass
1 (Unlimited)
Bulk
10.0μin (0.25μm)
Solder
Non-Insulated
-
Brass Alloy
1 (Unlimited)
Bulk
10.0μin (0.25μm)
Solder
Non-Insulated
-
Brass Alloy
1 (Unlimited)
Bulk
10.0μin (0.25μm)
1496 PDF数据手册
- 数据表 :
- 环境信息 :