![1352-1](https://static.esinoelec.com/200dimg/keystoneelectronics-13521-4371.jpg)
规格参数
- 类型参数全选
工厂交货时间
6 Weeks
底架
Solder, Through Hole
安装类型
Through Hole
安装孔直径
0.043 (1.09mm)
Brass
0.300 7.62mm
0.028 0.71mm
包装
Bulk
已出版
2008
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
连接器类型
INTERCONNECTION DEVICE
触点表面处理
Gold
绝缘材料
Non-Insulated
端子类型
PC Pin
孔直径
1.0922 mm
法兰直径
0.070 (1.77mm)
外径
1.78 mm
端子样式
Single End
销钉尺寸--在法兰盘上方
0.031 0.79mm Dia
销钉尺寸--法兰下面
0.040 1.02mm Dia
长度
8.8392mm
触点表面处理厚度
10.0μin 0.25μm
长度 - 整体
0.348 8.84mm
直径 - 内部
790 μm
板厚
0.032 0.81mm
RoHS状态
ROHS3 Compliant
相关型号
- 图片产品型号品牌MountTerminationInsulationContact MaterialRoHS StatusMoisture Sensitivity Level (MSL)PackagingContact Finish Thickness
-
1352-1
Solder, Through Hole
Solder
Non-Insulated
Brass
ROHS3 Compliant
1 (Unlimited)
Bulk
10.0μin (0.25μm)
-
Through Hole
Swage
Non-Insulated
Brass
ROHS3 Compliant
1 (Unlimited)
Bulk
10.0μin (0.25μm)
-
Through Hole
Swage
Non-Insulated
Brass
ROHS3 Compliant
1 (Unlimited)
Bulk
10.0μin (0.25μm)
-
Through Hole
Swage
Non-Insulated
Brass
ROHS3 Compliant
1 (Unlimited)
Bulk
10.0μin (0.25μm)
-
Through Hole
Press-Fit, Square
Non-Insulated
Brass Alloy
ROHS3 Compliant
1 (Unlimited)
Bulk
10.0μin (0.25μm)
1352-1 PDF数据手册
- 数据表 :
- 环境信息 :