
规格参数
- 类型参数全选
工厂交货时间
14 Weeks
触点镀层
Gold
底架
Edge
安装类型
Board Edge, Cutout
房屋材料
Liquid Crystal Polymer (LCP), Glass Filled
执行器材料
Polyamide (PA), Nylon, Glass Filled
White
Copper Alloy
50V
操作温度
-40°C~85°C
包装
Bulk
系列
FA5
已出版
2004
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
定位的数量
10
最高工作温度
85°C
最小工作温度
-40°C
额定电流
0.8A per Contact
螺距
0.020 0.50mm
额定电流
800mA
触点表面处理
Gold
房屋颜色
Black
配套周期
20
平屈型
FPC
电缆终端类型
Tapered
锁定功能
Flip Lock
特征
Solder Retention, Zero Insertion Force (ZIF)
FFC、FCB厚度
0.30mm
材料可燃性等级
UL94 V-0
RoHS状态
RoHS Compliant
可燃性等级
UL94 V-0
相关型号
- 图片产品型号品牌PitchNumber of PositionsTerminationMountContact PlatingHousing MaterialContact MaterialActuator Material
-
FA5B010HP1
0.020 (0.50mm)
10
Solder
Edge
Gold
Liquid Crystal Polymer (LCP), Glass Filled
Copper Alloy
Polyamide (PA), Nylon, Glass Filled
-
0.020 (0.50mm)
10
Solder
Surface Mount
-
Liquid Crystal Polymer (LCP), Halogen Free
Copper Alloy
Liquid Crystal Polymer (LCP), Halogen Free
-
0.020 (0.50mm)
10
Solder
Surface Mount
-
Liquid Crystal Polymer (LCP), Halogen Free
Phosphor Bronze
Polyamide (PA), Nylon
-
0.020 (0.50mm)
10
Solder
Surface Mount
-
Liquid Crystal Polymer (LCP), Halogen Free
Phosphor Bronze
Polyamide (PA), Nylon
FA5B010HP1 PDF数据手册
- 数据表 :
- PCN 设计/规格 :