表面安装

NO

材料

synthetic polyolefin

终端数量

16

No

Obsolete

GEC PLESSEY SEMICONDUCTORS

DIP, DIP16,.3

125 °C

-55 °C

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

Diameter of protected wire (cable)

12.8…24 mm

Diameter before shrink

26.0 mm

Diameter after shrink

12.5 mm

Wall thickness before shrink

0.55 mm

包装

coil 50 m

JESD-609代码

e0

类型

Heat shrink tube without adhesive

端子表面处理

Tin/Lead (Sn/Pb)

颜色

blue

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

Not Qualified

温度等级

MILITARY

逻辑IC类型

PRESCALER

电源电流-最大值(ICC)

21 mA

最大频率@Nom-Sup

200000000 Hz

收缩率

2:1