APF30-30-10CB
-
HEATSINK LOW-PROFILE FORGED
规格参数
- 类型参数全选
工厂交货时间
18 Weeks
材料
Aluminum
形状
Square, Fins
包装冷却
Assorted (BGA, LGA, CPU, ASIC...)
材料处理
Black Anodized
系列
APF
已出版
2006
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
类型
Top Mount
结构
FIN
附着方法
Thermal Tape, Adhesive (Not Included)
离底高度(鳍的高度)
0.370 9.40mm
强制空气流动时的热阻
3.30°C/W @ 200 LFM
个人资料
PIN FIN ARRAY
翅片方向
LONGITUDINAL
长度
1.181 30.00mm
宽度
1.181 30.00mm
RoHS状态
RoHS Compliant
相关型号
- 图片产品型号品牌MaterialThermal Resistance @ Forced Air FlowShapeLengthWidthTypePart StatusAttachment Method
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APF30-30-10CB
Aluminum
3.30°C/W @ 200 LFM
Square, Fins
1.181 (30.00mm)
1.181 (30.00mm)
Top Mount
Active
Thermal Tape, Adhesive (Not Included)
-
Aluminum
3.70°C/W @ 200 LFM
Square, Fins
1.181 (30.00mm)
1.181 (30.00mm)
Top Mount
Active
Thermal Tape, Adhesive (Included)
-
Aluminum
3.80°C/W @ 200 LFM
Square, Pin Fins
1.283 (32.60mm)
1.283 (32.60mm)
Top Mount
Active
Thermal Tape, Adhesive (Included)
-
Aluminum
3.40°C/W @ 200 LFM
Square, Angled Fins
1.181 (30.00mm)
1.181 (30.00mm)
Top Mount
Active
Thermal Tape, Adhesive (Included)
-
Aluminum
4.10°C/W @ 200 LFM
Square, Pin Fins
1.181 (30.00mm)
1.181 (30.00mm)
Top Mount
Active
Thermal Tape, Adhesive (Included)
APF30-30-10CB PDF数据手册
- 数据表 :
- 环境信息 :