![CONGA-TCA5/I-HSP-B](https://res.utmel.com/Images/category/Fans, Thermal Management.png)
CONGA-TCA5/I-HSP-B
-
Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
规格参数
- 类型参数全选
Details
conga-TCA5
1
48550 048550
6.605843 oz
Through Hole
系列
conga-TCA5
产品
Heatspreaders
0 类似产品