表面安装

YES

终端数量

272

Contact Manufacturer

CHIPHOMER TECHNOLOGY LTD

BGA, BGA272(UNSPEC)

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA272(UNSPEC)

GRID ARRAY

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

Reach合规守则

unknown

资历状况

Not Qualified

温度等级

INDUSTRIAL