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BHI260AP SHUTTLE BOARD 3.0
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Multiple Function Sensor Development Tools BHI260AP Evaluation Shuttle Board
规格参数
- 类型参数全选
触点镀层
Gold
外壳材料
Stainless Steel
19
Wall Mount
MIL-DTL-38999 III
300 VAC, 450 VDC
1
Panel
19-88
Copper Alloy
Threaded
Amphenol
Amphenol Aerospace
HD38999
Details
0440.SB6.368
系列
TV 38999 III
包装
Bulk
定位的数量
88 Position
子类别
Circular Connectors
额定电流
5 A
终端样式
Crimp
触点性别
Without Socket Contacts
线规
28 AWG to 22 AWG
产品类别
Circular MIL Spec Connector
产品
Receptacles
安装角
Straight
产品类别
Circular MIL Spec Connector