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40-C182-21
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IC & Component Sockets LOCK/EJECT DIP SCKT WIRE WRAP 40 PINS
规格参数
- 类型参数全选
工厂交货时间
5 Weeks
底架
Surface Mount
安装类型
Surface Mount
引脚数
40
房屋材料
Polyamide (PA46), Nylon 4/6, Glass Filled
位置或引脚数量(网格)
40 (2 x 20)
触点材料 - 配套
Beryllium Copper
触点材料 - 柱子
Brass
Gold
操作温度
-55°C~125°C
包装
Bulk
系列
EJECT-A-DIP™
已出版
2013
JESD-609代码
e4
无铅代码
yes
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
ECCN 代码
EAR99
类型
DIP, 0.6 (15.24mm) Row Spacing
行数
2
附加功能
LATCHED, UL 94V-0
额定电流
3A
间距 - 配套
0.100 2.54mm
接头数量
40
PCB接触图案
RECTANGULAR
本体宽度
0.7 inch
引线长度
1.016mm
触点样式
RND PIN-SKT
绝缘电阻
1000000000Ohm
配套触点间距
0.1 inch
介电耐压
1000VAC V
PCB 触点行距
0.6 mm
端子柱长度
0.040 1.02mm
间距--柱子
0.100 2.54mm
特征
Closed Frame
触点表面处理厚度 - 配套
10.0μin 0.25μm
触点表面处理厚度 - 柱子
10.0μin 0.25μm
材料可燃性等级
UL94 V-0
RoHS状态
ROHS3 Compliant
可燃性等级
UL94 V-0
相关型号
- 图片产品型号品牌Number of RowsMountTerminationHousing MaterialPitch - PostContact Material - MatingMoisture Sensitivity Level (MSL)Part Status
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40-C182-21
2
Surface Mount
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
1 (Unlimited)
Active
-
2
Surface Mount, Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
1 (Unlimited)
Active
-
2
Surface Mount, Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
1 (Unlimited)
Active
-
2
Surface Mount
Solder
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
0.100 (2.54mm)
Beryllium Copper
1 (Unlimited)
Active
-
2
Surface Mount, Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
1 (Unlimited)
Active
40-C182-21 PDF数据手册
- 数据表 :
- 环境信息 :