![1109800-26](https://static.esinoelec.com/200fimg/arieselectronics-110980026-3268.jpg)
1109800-26
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IC & Component Sockets QUICK C.A.C.
规格参数
- 类型参数全选
工厂交货时间
5 Weeks
底架
Through Hole
安装类型
Through Hole
房屋材料
Polyamide (PA46), Nylon 4/6, Glass Filled
位置或引脚数量(网格)
26 (2 x 13)
触点材料 - 配套
Beryllium Copper
触点材料 - 柱子
Brass
Gold
包装
Bulk
系列
Correct-A-Chip® 1109800
已出版
2006
JESD-609代码
e0
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
ECCN 代码
EAR99
类型
DIP, 0.3 (7.62mm) Row Spacing
定位的数量
26
附加功能
STANDARD: UL 94V-0
额定电流
1A
间距 - 配套
0.100 2.54mm
接头数量
26
触点表面处理 - 柱子
Tin-Lead
引线长度
3.175mm
端子柱长度
0.125 3.18mm
间距--柱子
0.100 2.54mm
特征
Programmable
触点表面处理厚度 - 配套
10.0μin 0.25μm
触点表面处理厚度 - 柱子
200.0μin 5.08μm
材料可燃性等级
UL94 V-0
RoHS状态
ROHS3 Compliant
可燃性等级
UL94 V-0
相关型号
- 图片产品型号品牌Number of PositionsMountTerminationHousing MaterialPitch - PostContact Material - MatingContact Finish Thickness - MatingContact Material - Post
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1109800-26
26
Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
10.0μin (0.25μm)
Brass
-
-
Surface Mount, Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
10.0μin (0.25μm)
Brass
-
20
Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
10.0μin (0.25μm)
Brass
-
-
Surface Mount, Through Hole
Solder
Polyamide (PA46), Nylon 4/6, Glass Filled
0.100 (2.54mm)
Beryllium Copper
10.0μin (0.25μm)
Brass
-
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1109800-26 PDF数据手册
- 数据表 :
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- 环境信息 :