![L77HDE15SC309](https://res.utmel.com/Images/category/Connectors, Interconnects.png)
L77HDE15SC309
-
Conn High Density D-Sub SKT 15 POS 2.29mm Solder Cup ST Thru-Hole 15 Terminal 1 Port
规格参数
- 类型参数全选
工厂交货时间
6 Weeks
触点镀层
Gold
底架
Free Hanging, Through Hole
安装类型
Free Hanging (In-Line)
介电材料
Thermoplastic, Glass Filled
房屋材料
Glass
外壳材料,完成
Steel, Tin Plated
Phosphor Bronze
250V
操作温度
-55°C~155°C
包装
Tray
系列
HD
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder Cup
连接器类型
Receptacle, Female Sockets
定位的数量
15
最高工作温度
155°C
最小工作温度
-55°C
行数
3
性别
Female
触点类型
Signal
额定电流
3A
螺距
2.29mm
方向
Straight
额定电流
3A
触点表面处理
Gold
法兰特性
Housing/Shell (Unthreaded)
连接器样式
D-Sub, High Density
触点形式
Stamped
外壳尺寸,连接器布局
1 DE E High Density
触点表面处理厚度
30.0μin 0.76μm
材料可燃性等级
UL94 V-0
RoHS状态
RoHS Compliant
相关型号
- 图片产品型号品牌GenderNumber of PositionsNumber of RowsMountOrientationTerminationContact PlatingConnector Style
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L77HDE15SC309
Female
15
3
Free Hanging, Through Hole
Straight
Solder Cup
Gold
D-Sub, High Density
-
Receptacle
-
3
Through Hole
Straight
Solder
-
D-Sub, High Density
-
Female
15
3
Through Hole
Right Angle
Solder
-
D-Sub, High Density
-
Female
15
3
Through Hole
Right Angle
Solder
Gold, Nickel, Tin
D-Sub, High Density
-
Receptacle
15
3
Through Hole
Straight
Solder
Gold
D-Sub, High Density
L77HDE15SC309 PDF数据手册
- 数据表 :