制造商是'Xilinx'
Xilinx 嵌入式 - 片上系统(SoC)
(1945)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 系列 | 工作电源电压 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 收发器数量 | 主要属性 | 核数量 | 闪光大小 | ||||||||||||||||||
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![]() | XCZU47DR-1FSVG1517E5149 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-1517 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 597 I/O | 0 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||
![]() | XCZU9CG-1FFVB1156I5228 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-1156 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 599550 LE | 353 I/O | - 40 C | + 100 C | 8.8 Mb | 34260 LAB | 1 | SMD/SMT | 850 mV | 24 Transceiver | 4 Core | |||||||||||||||||||||
![]() | XCZU1EG-1SBVA484I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-484 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 81900 LE | 82 I/O | - 40 C | + 100 C | 1 Mb | 4680 LAB | 1 | Tray | 活跃 | 484-FCBGA (19x19) | AMD 赛灵思 | SMD/SMT | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||
![]() | XCZU1EG-2SBVA484I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-484 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 81900 LE | 82 I/O | - 40 C | + 100 C | 1 Mb | 4680 LAB | 1 | 活跃 | 484-FCBGA (19x19) | AMD 赛灵思 | SMD/SMT | -40°C ~ 100°C (TJ) | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||||
![]() | XCZU1EG-1SBVA484E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-484 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 81900 LE | 82 I/O | 0 C | + 100 C | 1 Mb | 4680 LAB | 1 | Tray | 活跃 | 484-FCBGA (19x19) | AMD 赛灵思 | SMD/SMT | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||
![]() | XCZU1CG-L1SFVC784I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-784 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 81900 LE | 180 I/O | - 40 C | + 100 C | 1 Mb | 4680 LAB | 1 | Tray | 活跃 | 784-FCBGA (23x23) | AMD 赛灵思 | SMD/SMT | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | 4 Core | - | ||||||||
![]() | XCZU2CG-L1UBVA530I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-530 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 103320 LE | 82 I/O | - 40 C | + 100 C | 1.2 Mb | 5904 LAB | 1 | Tray | 活跃 | 530-FCBGA (16x9.5) | AMD 赛灵思 | SMD/SMT | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 4 Core | - | ||||||||
![]() | XCZU2CG-2SFVC784I5230 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-784 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 103320 LE | 252 I/O | - 40 C | + 100 C | 1.2 Mb | 5904 LAB | 1 | SMD/SMT | 850 mV | 4 Core | ||||||||||||||||||||||
![]() | XCZU3EG-1UBVA530I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-530 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 154350 LE | 82 I/O | - 40 C | + 100 C | 1.8 Mb | 8820 LAB | 1 | Tray | 活跃 | 530-FCBGA (16x9.5) | AMD 赛灵思 | SMD/SMT | -40°C ~ 100°C (TJ) | - | 850 mV | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 7 Core | - | ||||||||
![]() | XCZU4CG-2SFVC784I5231 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-784 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 192150 LE | 252 I/O | - 40 C | + 100 C | 2.6 Mb | 10980 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 4 Core | |||||||||||||||||||||
![]() | XCZU15EG-L2FFVB1156E4535 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-1156 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 746550 LE | 353 I/O | 0 C | + 110 C | 11.3 Mb | 42660 LAB | 1 | SMD/SMT | 850 mV | 24 Transceiver | 7 Core | |||||||||||||||||||||
![]() | XCZU3EG-1UBVA530E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-530 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 154350 LE | 82 I/O | 0 C | + 100 C | 1.8 Mb | 8820 LAB | 1 | Tray | 活跃 | 530-FCBGA (16x9.5) | AMD 赛灵思 | SMD/SMT | 0°C ~ 100°C (TJ) | - | 850 mV | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 7 Core | - | ||||||||
![]() | XCZU3CG-L2UBVA530E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-530 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 154350 LE | 82 I/O | 0 C | + 110 C | 1.8 Mb | 8820 LAB | 1 | Tray | 活跃 | 530-FCBGA (16x9.5) | AMD 赛灵思 | SMD/SMT | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | ||||||||
![]() | XCZU3EG-2UBVA530E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-530 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 154350 LE | 82 I/O | 0 C | + 100 C | 1.8 Mb | 8820 LAB | 1 | Tray | 活跃 | 530-FCBGA (16x9.5) | AMD 赛灵思 | SMD/SMT | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 7 Core | - | ||||||||
![]() | XCZU21DR-1FFVD1156I5245 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-1156 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 514 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||
![]() | XCZU19EG-L2FFVC1760E4524 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-1760 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 1143450 LE | 560 I/O | 0 C | + 110 C | 9.8 Mb | 65340 LAB | 1 | SMD/SMT | 850 mV | 72 Transceiver | 7 Core | |||||||||||||||||||||
![]() | XQZU43DR-1FFQE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BGA-1156 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||
![]() | XQZU42DR-1FFQE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BGA-1156 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 489300 LE | - 40 C | + 100 C | 6.8 Mb | 27960 LAB | 1 | SMD/SMT | 850 mV | 8 Transceiver | 6 Core | ||||||||||||||||||||||
![]() | XCZU5EV-L1SFVC784I5255 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-784 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 256200 LE | 256 I/O | - 40 C | + 100 C | 3.5 Mb | 14640 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 7 Core | |||||||||||||||||||||
![]() | XCZU5EG-L1SFVC784I4765 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCBGA-784 | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 256200 LE | 252 I/O | - 40 C | + 100 C | 3.5 Mbit | 5.1 Mbit | 14640 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | XCZU5EG | 720 mV/850 mV | - | 4 Transceiver | 7 Core | |||||||||||||||
![]() | XCZU9CG-2FFVC900I4998 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-900 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 599550 LE | 220 I/O | - 40 C | + 100 C | 8.8 Mb | 34260 LAB | 1 | SMD/SMT | 850 mV | 24 Transceiver | 4 Core | |||||||||||||||||||||
![]() | XCVC1902-2LLEVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2197-BFBGA, FCBGA | 0 C | + 110 C | 1 | 770 | Tray | 活跃 | 2197-FCBGA (45x45) | AMD 赛灵思 | Details | 0°C ~ 100°C (TJ) | Versal™ AI Core | 700 mV | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||
![]() | XCVC1902-2MLIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | - 40 C | + 110 C | 1 | 692 | Tray | 活跃 | 1760-FCBGA (40x40) | AMD 赛灵思 | Details | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||
![]() | XCZU49DR-1FSVF1760E5149 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-1760 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 674 I/O | 0 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||
![]() | XCZU46DR-2FSVH1760I5184 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-1760 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 618 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core |