制造商是'NA'
NA 嵌入式 - 微处理器
(651)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 位元大小 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 最高频率 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 定时器数量 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||||
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 | OMAP3530DCBC | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | no | Obsolete | 3 (168 Hours) | 515 | BOTTOM | BALL | 1.8V | 0.65mm | 720MHz | OMAP3530 | 515 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 600 MHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 12 | 26 | ARM | YES | YES | 浮点 | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 1mm | 14mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||
| OMAP3503ECBCA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 600MHz | OMAP3503 | 515 | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 950μm | 14mm | 14mm | 630μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
 | AM3894BCYGA120 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1031-BFBGA, FCBGA | YES | 1031 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | Obsolete | 4 (72 Hours) | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 0.65mm | 1.2GHz | AM3894 | 1V | 1.05V | 1.05V | 950mV | 1200 MHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 28 | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | DDR2, DDR3 | USB 2.0 + PHY (2) | I2C, McASP, McBSP, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | HDMI, HDVPSS | SATA 3Gbps (1) | 3.31mm | 25mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | OMAPL138BZCED4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 361-LFBGA | 361 | 789.392471mg | -40°C~90°C TJ | Tray | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.65mm | 456MHz | OMAPL138 | 361 | 1.3V | 1.35V | I2C, Parallel, SPI, USB | 1.35V | 1.25V | 8kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | 3 | ARM | YES | YES | 浮点 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 2 | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | OMAPL137BPTPH | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 128kB | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 176-LQFP Exposed Pad | 176 | Military grade | -55°C~175°C TJ | Tray | OMAP-L1x | e4 | yes | 活跃 | 4 (72 Hours) | 176 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 300MHz | OMAPL137 | 176 | 1.2V | 1.32V | 1.32V | 1.14V | 64kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | 4 | Signal Processing; C674x, System Control; CP15 | MROM | 1 | NO | MULTIPLE | LCD | 1.6mm | 24mm | 24mm | 1.4mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
 | XAM3359ZCZ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 324-LFBGA | 324 | 1.713814g | Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | Discontinued | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 600MHz | 未说明 | AM3359 | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | TMP34094CPCL | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 55°C | no | 160 | QUAD | 鸥翼 | 5V | 0.65mm | 160 | S-PQFP-G160 | 不合格 | 5.5V | COMMERCIAL | 4.5V | BUS CONTROLLER, ISA | 32 | 32 | 3.85mm | 28.2mm | 28.2mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3703CBC100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NRND (Last Updated: 1 week ago) | 表面贴装 | 515-VFBGA, FCBGA | 515 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 不用于新设计 | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 1GHz | AM3703 | 515 | 1.1V | 1.8V | 1.5V | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 16b | 16 | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 950μm | 14mm | 14mm | 630μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | OMAP3503ECBBALPD | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 515-VFBGA, FCBGA | YES | 515 | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | yes | 活跃 | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.15V | 0.4mm | 600MHz | OMAP3503 | 515 | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | ARM | YES | YES | 固定点 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | YES | MULTIPLE | LCD | 900μm | 12mm | 12mm | 610μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | OMAP3503ECUSA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 4 (72 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | OMAP3503 | 423 | 1.8V | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 1.4mm | 16mm | 16mm | 960μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
| OMAPL138BZWTA3R | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 361-LFBGA | 361 | -40°C~105°C TJ | Tape & Reel (TR) | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | OMAPL138 | 361 | 1.2V | I2C, Parallel, SPI, USB | 1.32V | 1.14V | 8kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | 3 | 23 | ARM | YES | YES | 浮点 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | NO | SINGLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
| XOMAP3515BCBB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 188 | 64kB | 表面贴装 | 515-VFBGA, FCBGA | 515 | FLASH | 0°C~90°C TJ | Tray | OMAP-35xx | Obsolete | 4 (72 Hours) | 515 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.5mm | 600MHz | OMAP3515 | 515 | 3V | 1.35V | I2C, MMC, SDIO, UART, USB | 2mA | 256kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM® Cortex®-A8 | 32b | 12 | 26 | YES | YES | 浮点 | 1.8V 3.0V | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | NO | MULTIPLE | LCD | 1mm | 14mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| OMAP2531BZAC400 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 活跃 | 3 (168 Hours) | OMAP2531 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAP3525DCBB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | no | Obsolete | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | OMAP3525 | 515 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 12 | 26 | ARM | YES | YES | 浮点 | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 0.9mm | 无 | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||
 | AM3874BCYE100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 684-BFBGA, FCBGA | YES | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | Discontinued | 4 (72 Hours) | 684 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 1.35V | 0.8mm | 1GHz | AM3874 | 684 | 0.95/1.35V | 1.42V | 1000 MHz | MICROPROCESSOR | ARM® Cortex®-A8 | 32 | 32b | 28 | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR2, DDR3 | USB 2.0 (2) | CAN, I2C, McASP, McBSP, SPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | HDMI, HDVPSS | SATA 3Gbps (1) | 23mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| OMAP3525ECBBA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64kB | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | yes | 活跃 | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.4mm | 600MHz | OMAP3525 | 515 | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 900μm | 12mm | 12mm | 610μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | XAM5728AABCXE | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 760-BFBGA, FCBGA | 760 | 0°C~90°C TJ | Bulk | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 760 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.15V | 0.8mm | 1.5GHz | 未说明 | AM5728 | 24V | 1500 MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 16 | ARM | YES | YES | 32 | 浮点 | NO | 1.8V 3.3V | 10 | GbE | 2 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | DSP, BB2D, IPU, IVA, GPU, VPE | 2 | SATA 3Gbps (1) | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| OMAP3525DZCBC | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | Obsolete | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 600MHz | OMAP3525 | 515 | 1.35V | 1.35V | 985mV | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | 26 | ARM | YES | YES | 浮点 | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 1mm | 14mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||
 | OMAPL137BZKBD4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | 256 | -40°C~90°C TJ | Tray | OMAP-L1x | e1 | no | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 1mm | 456MHz | OMAPL137 | 256 | 1.32V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 13 | ARM | YES | YES | 16 | 浮点 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | MULTIPLE | LCD | 2.05mm | 17mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||
| AM1808BZCED4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | -40°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | AM1808 | 361 | 1.35V | I2C, SPI, UART, USB | 1.3V | 950mV | 64kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 4 | 23 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | SATA 3Gbps (1) | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||
| AM3352ZZCZA60 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 64kB | Copper, Silver, Tin | 表面贴装 | 324-LFBGA | 324 | ROM | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.8mm | 600MHz | 未说明 | AM3352 | 1.1V | CAN, Ethernet, I2C, SPI, UART, USB | 176kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 16 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
| AM3357ZCZD72 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | Copper, Silver, Tin | 324-LFBGA | YES | 324 | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 324 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.26V | 0.8mm | 720MHz | AM3357 | 324 | 1.26V | 1.15V | CAN, I2C, SPI, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 28 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
 | AM5K2E02ABD4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | ACTIVE (Last Updated: 2 days ago) | Copper, Silver, Tin | 表面贴装 | 1089-BFBGA, FCBGA | 1089 | 0°C~85°C TC | Tube | Sitara™ | e1 | yes | 活跃 | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | AM5K2E02 | 1V | 1.05V | Ethernet, I2C, SPI, UART, USB | 1400 MHz | 2MB | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 32b | ARM | 1.4GHz | YES | YES | 浮点 | YES | 1.35V 1.5V 1.8V 3.3V | 2 | 1GBE (8) | 2 Core 32-Bit | 无 | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| AM5K2E04XABDA25 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 1089-BFBGA, FCBGA | 1089 | -40°C~100°C TC | Tray | Sitara™ | e1 | yes | 活跃 | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | 1.25GHz | AM5K2E04 | 1.05V | 0.95V | Ethernet, I2C, SPI, UART, USB | 2MB | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 72b | ARM | YES | YES | 浮点 | YES | 1.35V 1.5V 1.8V 3.3V | 2 | 1GBE (8), 10GBE (2) | 4 Core 32-Bit | 无 | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | 4 | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
| AM1806BZCED4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | LFBGA-361 | -40°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | AM1806 | 361 | 1.3V | 1.35V | I2C, SPI, UART, USB | 1.35V | 1.25V | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 23 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | 1.4mm | 16mm | ROHS3 Compliant | 含铅 |