制造商是'NA'
NA 嵌入式 - 微处理器
(651)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电容量 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 时钟频率 | 电源电流-最大值 | 位元大小 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 速度等级 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 定时器数量 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | 外部中断数量 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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 | OMAP3530DCBB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | no | Obsolete | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | OMAP3530 | 515 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 12 | 26 | ARM | YES | YES | 浮点 | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 0.9mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||
 | AM3351BZCE30R | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 5 days ago) | 289-LFBGA | YES | 298 | 0°C~90°C TJ | Tape & Reel (TR) | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 298 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT MIN 0.912 V | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 未说明 | AM3351 | 1.144V | 1.056V | 300MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 26MHz | 32 | YES | YES | 固定点 | YES | 131072 | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (1) | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | 64 | 1.3mm | 13mm | 13mm | 890μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | DP8344BV | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | 0°C~70°C TA | Tube | e0 | Obsolete | 1 (Unlimited) | 84 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 220 | 5V | 1.27mm | 20MHz | DP8344 | S-PQCC-J84 | 5V | 5.5V | MICROPROCESSOR, RISC | 71mA | 8 | 16 | NO | NO | 16 | 固定点 | NO | 0 | 5.0V | 1 Core 8-Bit | 无 | 1 | 2 | 4.57mm | 29.21mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM1707DZKB4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 256-BGA | 256 | 2.784008g | L1 Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 456MHz | AM1707 | 1.3V | Ethernet, I2C, SPI, UART, USB | 1.35V | 1.25V | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | 2.05mm | 17mm | 17mm | 1.36mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | AM1806EZCED4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | ACTIVE (Last Updated: 1 week ago) | 361-LFBGA | YES | 361 | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | AM1806 | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | 1.3mm | 13mm | 13mm | 890μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | OMAPL138BGWTMEP | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Military grade | ACTIVE (Last Updated: 1 week ago) | Lead, Tin | 表面贴装 | 361-LFBGA | 361 | L2 Cache, ROM, SRAM | -55°C~125°C TJ | Tube | OMAP-L1x | e0 | 活跃 | 3 (168 Hours) | 361 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 220 | 1.2V | 0.8mm | 345MHz | OMAPL138 | 361 | 3.3V | 1.35V | SPI | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | ARM | YES | YES | 浮点 | YES | 8192 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 8 | Signal Processing; C674x, System Control; CP15 | MROM | NO | SINGLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.4mm | 16mm | 16mm | 900μm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||
| OMAPL138EZWTA4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 361-LFBGA | YES | 361 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | OMAPL138 | 361 | 微处理器电路 | ARM926EJ-S | ARM | 456 MHz | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM5716AABCXQ1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 760-BFBGA, FCBGA | YES | 760 | FCBGA 760 | Automotive grade | -40°C~125°C TJ | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 760 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5716 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 固定点 | NO | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| AM3703CBPA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | NRND (Last Updated: 2 days ago) | 515-WFBGA, FCBGA | YES | 515 | ROM | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 不用于新设计 | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 800MHz | AM3703 | 515 | 1.1V | 1.8V | I2C, SPI, UART, USB | 1.5V | 32kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 700μm | 12mm | 12mm | 500μm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| OMAP3530DZCBB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | Obsolete | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | OMAP3530 | 515 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | 12 | 26 | ARM | YES | YES | 浮点 | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 0.9mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
| OMAP3503ECBBA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | yes | 活跃 | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | OMAP3503 | 515 | 1.8V | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 900μm | 12mm | 12mm | 610μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
 | OMAP3515ECUS72 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 4 (72 Hours) | 423 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 720MHz | OMAP3515 | 423 | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | NO | SINGLE | LCD | 1.4mm | 16mm | 16mm | 960μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
| XOMAP3530BCBB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 188 | 64kB | 表面贴装 | 515-VFBGA, FCBGA | 515 | FLASH | 0°C~90°C TJ | Tray | OMAP-35xx | Obsolete | 3 (168 Hours) | 515 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.4mm | 600MHz | OMAP3530 | 515 | 3V | 1.35V | I2C, MMC, SDIO, UART, USB | 2mA | 256kB | MICROPROCESSOR | ARM® Cortex®-A8 | 32b | 12 | YES | YES | 浮点 | YES | 1.8V 3.0V | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 0.9mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL138BZCEA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 361-LFBGA | 361 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.65mm | 375MHz | OMAPL138 | 361 | 1.35V | 950mV | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | ARM | YES | YES | 浮点 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL138BZCEA3E | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 361-LFBGA | 361 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.65mm | 375MHz | OMAPL138 | 361 | 1.35V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | YES | YES | 浮点 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | OMAP2530CZAC400 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 0°C~70°C TA | 活跃 | 3 (168 Hours) | OMAP2530 | 400MHz | ARM® Cortex®-A8 | 1.2V | 1 Core 32-Bit | 有 | LPDDR | USB OTG (1) | 1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO | Multimedia; NEON™ SIMD | Boot Security, Secure JTAG | LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAP3525DCUS | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | no | Obsolete | 3 (168 Hours) | 423 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | OMAP3525 | 423 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 12 | 26 | ARM | YES | YES | 浮点 | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 1.4mm | 16mm | 无 | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||
| AM5718AABCXEQ1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 760-BFBGA, FCBGA | YES | 760 | Automotive grade | -40°C~125°C TJ | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 760 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5718 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 固定点 | NO | 524288 | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | HDMI, LCD | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | OMAP3503DCBC | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | no | Obsolete | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | OMAP3503 | 515 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.89V | 1.71V | 64kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | 12 | ARM | YES | YES | 浮点 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | NO | SINGLE | LCD | 0.9mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
| OMAP3530DCUSA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | no | Obsolete | 4 (72 Hours) | 423 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 720MHz | OMAP3530 | 423 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 600 MHz | 64kB | MICROPROCESSOR, RISC | 32 | ARM® Cortex®-A8 | 32 | 32b | 12 | 26 | ARM | YES | YES | 浮点 | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 1.4mm | 16mm | 无 | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||
| OMAP3530ECBBLPD | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 515-VFBGA, FCBGA | YES | 515 | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | yes | 活跃 | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.35V | 0.5mm | 600MHz | 未说明 | OMAP3530 | 515 | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | ARM | YES | YES | 固定点 | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | 1 | LCD | 900μm | 12mm | 12mm | 610μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| AM5716AABCXEQ1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 760-BFBGA, FCBGA | YES | 760 | Automotive grade | -40°C~125°C TJ | Automotive, AEC-Q100 | e1 | yes | 活跃 | 3 (168 Hours) | 760 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5716 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 固定点 | NO | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | XOMAPL137DZKBA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256-BGA | YES | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | no | Obsolete | 4 (72 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | OMAPL137 | 256 | S-PBGA-B256 | 1.32V | 1.14V | 375MHz | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 30MHz | 15 | YES | YES | 16 | 浮点 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | SINGLE | LCD | 2.05mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| OMAP3503ECUS72 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 4 (72 Hours) | 423 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 720MHz | OMAP3503 | 423 | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | NO | SINGLE | LCD | 1.4mm | 16mm | 16mm | 960μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| OMAPL137BZKBA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | Copper, Silver, Tin | 表面贴装 | 256-BGA | 256 | 16 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | no | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | 375MHz | OMAPL137 | 256 | 1.32V | 1.32V | 1.14V | 128kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | 2 | 13 | ARM | YES | YES | 浮点 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | MULTIPLE | LCD | 17mm | ROHS3 Compliant | 含铅 |