制造商是'STMicroelectronics'
STMicroelectronics 专用
(7)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | I/O类型 | 内存IC类型 | 混合内存类型 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | HCF40108BF | SGS-Ates Componenti Electronici SPA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | SGS-ATES COMPONENTI ELECTRONICI S P A | DIP, DIP24,.6 | 85 °C | -40 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | 不合格 | INDUSTRIAL | ||||||||||||||||||||||||
 | M36L0R8060T1ZAQE | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | STMICROELECTRONICS | BGA | 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 有 | e1 | EAR99 | 锡银铜 | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.052 mA | 16MX16 | 1.2 mm | 16 | 0.00011 A | 268435456 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | ||||
| M36L0R7040U3ZA5U | SGS Thomson | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
| MAP168-45L | Waferscale Integration Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | WAFERSCALE INTEGRATION INC | 45 ns | SQUARE | CHIP CARRIER | 5 V | LDCC44,.7SQ | QCCJ | CERAMIC | 70 °C | 44 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | QUAD | J BEND | 1.27 mm | unknown | S-XQCC-J44 | 不合格 | COMMERCIAL | 0.143 mA | 0.001 A | ||||||||||||||||||||||
| M36W0R6050B1ZAQF | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | STMICROELECTRONICS | BGA | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | 70 ns | 4194304 words | 4000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | |||||
| M36DR232A120ZA6C | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | STMICROELECTRONICS | BGA | 0.80 MM PITCH, STACK, LFBGA-66 | 120 ns | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA66,8X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 66 | 无 | e0 | EAR99 | 锡铅 | THE DEVICE ALSO CONTAINS A 2 MBIT (128K X16) SRAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | not_compliant | 66 | R-PBGA-B66 | 不合格 | 2.2 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 0.04 mA | 2MX16 | 1.4 mm | 16 | 0.000025 A | 33554432 bit | 存储器电路 | FLASH+SRAM | 12 mm | 8 mm | ||||
| M2704 | SGS-Ates Componenti Electronici SPA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | SGS-ATES COMPONENTI ELECTRONICI S P A | DIP, DIP24,.6 | 450 ns | 512 words | 512 | 70 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | 不合格 | COMMERCIAL | 512X8 | 3-STATE | 8 | 4096 bit | COMMON |