制造商是'Silicon Labs'
Silicon Labs 射频收发器模块
(765)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | JESD-30代码 | 工作电源电压 | 温度等级 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 最大电源电流 | 数据率 | 使用的 IC/零件 | 带宽 | 议定书 | 最高频率 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 消费者集成电路类型 | 敏感度 | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 通用输入输出数量 | 环境温度范围高 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | ||
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 | BT121-A-V2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 41-SMD Module | YES | 41 | -40°C~85°C | Tape & Reel (TR) | 2015 | 活跃 | 3 (168 Hours) | 33 | 8542.39.00.01 | 2.2V~3.6V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1mm | 2.4GHz | R-XXMA-N33 | 128kB Flash 16kB RAM | 3Mbps | Bluetooth v4.2 | 电信电路 | 12dBm | Bluetooth | Integrated, Chip | -96dBm | I2C, SPI, UART | 38.7mA | 92mA | 2.1mm | 13.9mm | 11mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | BGM111A256V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | YES | -40°C~85°C | Tape & Reel (TR) | 2016 | 活跃 | 3 (168 Hours) | 31 | 8542.39.00.01 | 1.85V~3.8V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1.2mm | 2.4GHz | R-XXMA-N31 | I2C, SPI, UART | 256kB Flash 32kB RAM | 200mA | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -92dBm | I2C, SPI, UART | 8.7mA | 8.2mA | GFSK | 25 | 85°C | 2.2mm | 15mm | 12.9mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| BGM111A256V2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | YES | -40°C~85°C | Strip | 2016 | 活跃 | 3 (168 Hours) | 31 | 8542.39.00.01 | 1.85V~3.8V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1.2mm | 2.4GHz | R-XXMA-N31 | I2C, SPI, UART | 256kB Flash 32kB RAM | 200mA | 1Mbps | EFR32BG | 83.5MHz | Bluetooth v4.2 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -92dBm | I2C, I2S, SPI, UART | 8.7mA | 8.2mA~23.3mA | GFSK | 25 | 85°C | 2.2mm | 15mm | 符合RoHS标准 | ||||||||||||||||||||||||
 | WT12-A-AI4 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 31 | -40°C~85°C | Tape & Reel (TR) | 2014 | 活跃 | 3 (168 Hours) | 31 | 8542.39.00.01 | 3.1V~3.6V | UNSPECIFIED | 1 | 3.3V | 1.5mm | 2.4GHz | 3.4V | SPI, UART, USB | 8MB Flash | 60mA | 3Mbps | BlueCore4 | Bluetooth v2.1 + EDR, Class 2 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | PIO, SPI, UART, USB | 70mA | DQPSK, GFSK | -86 dBm | 2.6mm | 25.6mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
 | WT11U-A-AI56 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | yes | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 2.7V~3.6V | 2.4GHz | 3 Mbps | Bluetooth v2.1 + EDR | 16.5dBm | Bluetooth | Integrated, Chip | 消费电路 | -88dBm | SPI, USART, USB | 36mA | 110mA | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | BT111-A-HCI | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 41-SMD Module | -30°C~85°C | Cut Tape (CT) | 2013 | 不用于新设计 | 3 (168 Hours) | 21 | 8542.39.00.01 | 1.7V~3.6V | UNSPECIFIED | 无铅 | 1 | 1.1mm | 2.4GHz | R-XXMA-N21 | 3.6V | I2C, SPI, UART, USB | 73mA | 12 Mbps | CSR8510 | Bluetooth v4.0 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | SPI, UART, USB | -89 dBm | 2.31mm | 13.05mm | 9.3mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | BGM11S22F256GA-V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 蓝壁虎 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.85V~3.8V | 2.4GHz | 256kB Flash 32kB RAM | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -90dBm | I2C, SPI, UART | 8.7mA | 8.2mA | GFSK | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | ETRX357-LRS | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | NO | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 33 | 8542.39.00.01 | 2.1V~3.6V | DUAL | 无铅 | 1 | 3V | 1.27mm | 2.4GHz | R-XDMA-N33 | 192kB Flash 12kB RAM | 250kbps | EM357 | Zigbee® | 电信电路 | 20dBm | 802.15.4 | Integrated, Chip | -106dBm | 33mA | 140mA | 25mm | 19mm | 无SVHC | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
 | BGM113A256V2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 36-SMD Module | YES | -40°C~85°C | Strip | 2016 | 蓝壁虎 | 活跃 | 3 (168 Hours) | 36 | 3.8V | UNSPECIFIED | 无铅 | 1 | 3.3V | 0.8mm | 2.4GHz | R-XXMA-N36 | I2C, I2S, IrDA, SMBus, SPI, UART, USART | 256kB Flash 32kB RAM | 200mA | 1Mbps | EFR32BG | 83.5MHz | Bluetooth v4.1 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -93dBm | 1 | SPI, UART | 8.7mA | 8.8mA | 14 | 85°C | 2mm | Non-RoHS Compliant | |||||||||||||||||||||||||
 | BLE121LR-A-M256K | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 36 | -40°C~85°C | Tape & Reel (TR) | 2014 | 活跃 | 3 (168 Hours) | 36 | 2V~3.6V | UNSPECIFIED | 无铅 | 1 | 3V | 0.9mm | 2.4GHz | 3.6V | I2C, SPI, UART | 256kB Flash 8kB SRAM | 36mA | 2Mbps | CC2541 | Bluetooth v4.0 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | 8 | I2C, SPI, UART | 28mA~33mA | 25mA~39mA | -98 dBm | 16 | 1.8mm | 14.7mm | 13mm | 符合RoHS标准 | |||||||||||||||||||||||||
 | BLE112-A-V1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 30 | BLE112-A-V1 | -40°C~85°C | Tape & Reel (TR) | 2011 | 活跃 | 3 (168 Hours) | 31 | 8542.39.00.01 | 2V~3.6V | UNSPECIFIED | 1 | 1.25mm | 2.4GHz | R-XXMA-N31 | SPI, UART | 128kB Flash 8kB SRAM | 2Mbps | CC2540 | Bluetooth v4.0 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -85dBm | SPI, UART | 25mA | 36mA | -87 dBm | 2.3mm | 18.1mm | 12.05mm | 无 | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||
| BGM111A256V21R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 2007 | 蓝壁虎 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.65V~3.8V | 2.4GHz | 256kB Flash 32kB RAM | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -92dBm | I2C, SPI, UART | 8.7mA | 8.2mA | GFSK | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
 | BGM123A256V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 56-SMD Module | YES | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 56 | 1.85V~3.8V | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | S-XXMA-N56 | I2C, I2S, IrDA, SMBus, SPI, UART, USART | 256kB Flash 32kB RAM | 200mA | 1Mbps | Bluetooth v4.2 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -90dBm | 1 | I2C, I2S, SPI, UART | 9mA | 8.2mA | GFSK | 30 | 85°C | 1.4mm | 6.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| BT121-A-V2C | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 41-SMD Module | Strip | 活跃 | 3 (168 Hours) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BLE113-A-M256K | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 1997 | 活跃 | 3 (168 Hours) | 2V~3.6V | 2.4GHz | 3.6V | SPI, UART | 256kB Flash 8kB SRAM | 2Mbps | CC2541 | Bluetooth v4.0 | 电信电路 | 0dBm | Bluetooth | Integrated, Chip | 8 | ISP, PWM, SPI, UART | 14.3mA | 18.2mA | -93 dBm | 19 | 2.09mm | 15.75mm | 9.15mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| BGM123A256V2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 56-SMD Module | YES | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 56 | 8542.39.00.01 | 1.85V~3.8V | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | S-XXMA-N56 | 256kB Flash 32kB RAM | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -90dBm | I2C, I2S, SPI, UART | 9mA | 8.2mA | GFSK | 1.4mm | 6.5mm | 6.5mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | MGM111E256V2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Strip | 2017 | Mighty Gecko | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.85V~3.8V | unknown | 2.4GHz | 256kB Flash 32kB RAM | EFR32 | Zigbee® | 10dBm | 802.15.4 | Integrated, Chip + U.FL | 消费电路 | -99dBm | I2S, SPI, UART | 9.8mA | 8.2mA | DSSS, O-QPSK | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
 | BGM13P22F512GE-V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | Tape & Reel (TR) | 蓝壁虎 | 活跃 | 3 (168 Hours) | 2.4GHz | 512kB Flash 64kB RAM | EFR32BG | Bluetooth v5.0 | 电信电路 | 8dBm | Bluetooth | Antenna Not Included, U.FL | I2C, I2S, SPI, UART | 9.8mA | 9.5mA | GFSK | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| WT12-A-AI3 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | Module | 31 | -40°C~85°C | Strip | 2004 | 最后一次购买 | 3 (168 Hours) | 85°C | -40°C | 3.1V~3.6V | 2.4GHz | SPI, UART, USB | 3.4V | 3.2V | 8MB Flash | 70mA | 3Mbps | BlueCore4 | Bluetooth v2.1 + EDR, Class 2 | 3dBm | Bluetooth | Integrated, Chip | -86dBm | PIO, SPI, UART, USB | 70mA | 70mA | DQPSK, GFSK | -86 dBm | 无 | Unknown | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | MGM111A256V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 31-SMD Module | -40°C~85°C | Tape & Reel (TR) | Mighty Gecko | yes | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.85V~3.8V | 2.4GHz | I2C, SPI, UART | 256kB Flash 32kB RAM | 250kbps | EFR32 | Zigbee® | 10dBm | 802.15.4 | Integrated, Chip | 消费电路 | I2C, I2S, SPI, UART | 9.8mA | 8.2mA | DSSS, O-QPSK | -99 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| BT121-A-V2-IAP | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | -40°C | 表面贴装 | 41-SMD Module | YES | 85°C | Strip | 活跃 | 3 (168 Hours) | 33 | 8542.39.00.01 | UNSPECIFIED | 无铅 | 1 | 3.3V | 1mm | R-XXMA-N33 | INDUSTRIAL | 电信电路 | 2.1mm | 13.9mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | BLE113-A-V1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 30 | -40°C~85°C | Cut Tape (CT) | 2013 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 2V~3.6V | 2.4GHz | 3.6V | SPI | 3.6V | 2V | 128kB Flash 8kB SRAM | 2Mbps | CC2541 | Bluetooth v4.0 | 2.485GHz | 0dBm | Bluetooth | Integrated, Chip | -93dBm | 8 | ISP, PWM, SPI, UART | 27mA | 26.1mA | -93 dBm | 19 | 2.09mm | 15.75mm | 9.15mm | 符合RoHS标准 | |||||||||||||||||||||||||||
| BGM111A256V21 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Strip | 蓝壁虎 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.65V~3.8V | 2.4GHz | 256kB Flash 32kB RAM | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -92dBm | I2C, SPI, UART | 8.7mA | 8.2mA | GFSK | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| BGM11S12F256GA-V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 蓝壁虎 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.85V~3.8V | 2.4GHz | 256kB Flash 32kB RAM | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -90dBm | I2C, SPI, UART | 8.7mA | 8.2mA | GFSK | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| BGM11S22F256GA-V2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tray | 2017 | 蓝壁虎 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.85V~3.8V | 2.4GHz | 256kB Flash 32kB RAM | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -90dBm | I2C, SPI, UART | 8.7mA | 8.2mA | GFSK | 符合RoHS标准 |