制造商是'NXP'
NXP 嵌入式 - 微处理器
(5314)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 速度 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 协处理器/DSP | 总线兼容性 | 保安功能 | 显示和界面控制器 | 萨塔 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||
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 | LS1043ASN8MNLB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (3) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | P2020NXN2HFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 固定点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||
 | MC68EN302AG25BT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 144-LQFP | 0°C~70°C TA | Tray | 1997 | M683xx | Obsolete | 3 (168 Hours) | MC68EN302 | 25MHz | M68000 | 5.0V | 10Mbps (1) | 1 Core 8/16-Bit | 无 | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6S1AVM08AD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | i.MX6S | 活跃 | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 16 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MPC8536EBVJANGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2006 | MPC85xx | 活跃 | 3 (168 Hours) | 783 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | MPC8536 | S-PBGA-B783 | 1.05V | 11.5/1.81.8/3.3V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC | Cryptography | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | ||||||||||||||||||
 | MCIMX508CVK8BR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 416-LFBGA | YES | 0°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX50 | e1 | 活跃 | 3 (168 Hours) | 416 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 0.5mm | 40 | MCIMX508 | S-PBGA-B416 | 不合格 | 1.15V | 0.95V | 800MHz | 微处理器电路 | ARM® Cortex®-A8 | 800MHz | YES | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | Boot Security, Cryptography, Secure JTAG | EPDC, LCD | 1.52mm | 13mm | ROHS3 Compliant | |||||||||||||||||||
| MPC8544EVTANG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2007 | MPC85xx | e2 | Obsolete | 1 (Unlimited) | 783 | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8544 | S-PBGA-B783 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | 2.8mm | 29mm | ROHS3 Compliant | ||||||||||||||||||
| MPC8543VTANGB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 0°C~105°C TA | Tray | 2009 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8543 | 800MHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | P1014NXN5DFA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 425-FBGA | YES | -40°C~105°C TA | Tray | 2011 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | P1014 | S-PBGA-B425 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 浮点 | YES | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||
 | MC68340CAB25E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 144-BQFP | -40°C~85°C TA | Tray | 1995 | M683xx | 不用于新设计 | 3 (168 Hours) | MC68340 | 25MHz | CPU32 | 5.0V | 1 Core 32-Bit | 无 | DRAM | USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S5EVM10ADR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | -20°C~105°C TJ | Tape & Reel (TR) | i.MX6S | 活跃 | 3 (168 Hours) | 1GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| LS1023ASE8MQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| P1011NXE2DFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 125°C | 689-BBGA Exposed Pad | YES | -40°C | Tray | 2002 | 活跃 | 3 (168 Hours) | 689 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | P1011 | S-PBGA-B689 | 1.05V | AUTOMOTIVE | 0.95V | 533 MHz | MICROPROCESSOR, RISC | 100MHz | 32 | YES | YES | 浮点 | YES | 2.46mm | 31mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | MPC7410HX450LE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Obsolete | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC7410 | S-CBGA-B360 | 1.9V | 1.7V | 450MHz | MICROPROCESSOR, RISC | PowerPC G4 | 133MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 1 Core 32-Bit | 无 | 3.2mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||
 | MPC8314EVRADDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8314 | S-PBGA-B620 | 1.05V | 13.3V | 0.95V | 266MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | Security; SEC 3.3 | Cryptography, Random Number Generator | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||
 | MCIMX6Y7DVK05AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 52 Weeks | 272-LFBGA | YES | 0°C~95°C TJ | Tray | 2015 | i.MX6 | 活跃 | 3 (168 Hours) | 272 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.5mm | compliant | S-PBGA-B272 | 1.5V | 1.275V | 528MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 528MHz | 16 | YES | 16 | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 4 | Multimedia; NEON™ MPE | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | 1.23mm | 9mm | 符合RoHS标准 | ||||||||||||||||||||||
| P2040NXN7MMC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 780-BBGA, FCBGA | -40°C~105°C TA | Tray | 2002 | QorIQ P2 | 活跃 | 3 (168 Hours) | P2040 | 1.2GHz | PowerPC e500mc | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y1DVK05AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 272-LFBGA | 0°C~95°C TJ | Tray | 2015 | i.MX6 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 528MHz | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | MPC8308VMADD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 473-LFBGA | YES | 0°C~105°C TA | Tray | 2006 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 40 | MPC8308 | S-PBGA-B473 | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| LS1026AXE8T1A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 780 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.03V | 0.97V | 1.8GHz | ARM® Cortex®-A72 | 14 | YES | 64 | 10GbE (2), 2.5GbE (1), 1GbE (4) | 2 Core 64-Bit | DDR4 | USB 3.0 (3) + PHY | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | LS1023ASN7PQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 621-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.4GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| LS1023AXN8PQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 4 | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 780 | ALSO OPERATES AT 1V SUPPLY NOM | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | ARM® Cortex®-A53 | 1400MHz | 14 | YES | 32 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (2) + PHY | ETHERNET, I2C, PCI, SATA, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.07mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MC8641DTVU1333JE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1023-BCBGA, FCCBGA | -40°C~105°C TA | Tray | 2002 | MPC86xx | Obsolete | 3 (168 Hours) | MC8641 | 1.333GHz | PowerPC e600 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR, DDR2 | DUART, HSSI, I2C, RapidIO | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6G2DVK05AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 272-LFBGA | YES | 0°C~95°C TJ | Tray | 2002 | i.MX6UL | 活跃 | 3 (168 Hours) | 272 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.5mm | S-PBGA-B272 | 1.3V | 1.15V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | 26 | YES | YES | 16 | 固定点 | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | 1.23mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MCIMX286CVM4BR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tape & Reel (TR) | 2002 | i.MX28 | e1 | 活跃 | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX286 | S-PBGA-B289 | 1.55V | 1.41.8V | 1.35V | 454MHz | MICROPROCESSOR, RISC | ARM926EJ-S | 24MHz | 32 | YES | YES | 固定点 | YES | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Boot Security, Cryptography, Hardware ID | Keyboard, LCD, Touchscreen | 1.37mm | 14mm | ROHS3 Compliant |