你好！请登入 免费注册

我的订单 我的询价 0755-82520436 3307104213

购物车
所有分类 首页 品牌专区 询价 关于我们
首页 / 全部品牌 / NXP / category.null /

制造商是'NXP'

  • NXP 嵌入式 - 微处理器

    (5314)

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

工厂交货时间

包装/外壳

表面安装

操作温度

包装

已出版

系列

JESD-609代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

HTS代码

端子位置

终端形式

峰值回流焊温度（摄氏度）

电源电压

端子间距

时间@峰值回流温度-最大值(s)

基本部件号

JESD-30代码

资历状况

电源电压-最大值(Vsup)

电源

电源电压-最小值(Vsup)

速度

uPs/uCs/外围ICs类型

核心处理器

时钟频率

位元大小

有ADC

DMA 通道

脉宽调制通道

数模转换器通道

地址总线宽度

边界扫描

低功率模式

筛选水平

外部数据总线宽度

格式

集成缓存

内存(字)

电压 - I/O

以太网

核数/总线宽度

图形加速

内存控制器

USB

附加接口

串行I/O数

协处理器/DSP

只读存储器可编程性

总线兼容性

保安功能

显示和界面控制器

萨塔

座位高度(最大)

长度

RoHS状态
MCIMX6Y2DVM05AB MCIMX6Y2DVM05AB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

18 Weeks

289-LFBGA

0°C~95°C TJ

Tray

2015

i.MX6

活跃

3 (168 Hours)

8542.39.00.01

260

40

528MHz

ARM® Cortex®-A7

1.8V 2.8V 3.3V

10/100Mbps (2)

1 Core 32-Bit

无

LPDDR2, DDR3, DDR3L

USB 2.0 OTG + PHY (2)

CAN, I2C, SPI, UART

Multimedia; NEON™ MPE

A-HAB, ARM TZ, CSU, SJC, SNVS

Electrophoretic, LCD

ROHS3 Compliant

MVF61NS151CMK50 MVF61NS151CMK50

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

0

364-LFBGA

YES

131

-40°C~85°C TA

Tray

2002

Vybrid, VF6xx

e2

活跃

3 (168 Hours)

364

5A002.A.1

Tin/Silver (Sn/Ag)

8542.31.00.01

BOTTOM

BALL

260

1.23V

0.8mm

40

MVF61NS151

S-PBGA-B364

不合格

1.26V

3.3V

1.16V

500MHz, 167MHz

MICROCONTROLLER, RISC

ARM® Cortex®-A5 + Cortex®-M4

16

YES

YES

NO

YES

16

16

3.3V

10/100Mbps (2)

2 Core 32-Bit

有

LPDDR2, DDR3, DRAM

USB 2.0 OTG + PHY (1)

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Multimedia; NEON™ MPE

FLASH

ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG

DCU, GPU, LCD, VideoADC, VIU

17mm

ROHS3 Compliant

MCIMX6U5DVM10AC MCIMX6U5DVM10AC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-LFBGA

YES

0°C~95°C TJ

Tray

2002

i.MX6DL

e1

活跃

3 (168 Hours)

624

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

26

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX6U5EVM10AC MCIMX6U5EVM10AC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-LFBGA

YES

-20°C~105°C TJ

Tray

2002

i.MX6DL

e1

活跃

3 (168 Hours)

624

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

26

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX6Q6AVT10AD MCIMX6Q6AVT10AD

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-FBGA, FCBGA

YES

-40°C~125°C TJ

Tray

2002

i.MX6Q

e1

活跃

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

未说明

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR

ARM® Cortex®-A9

16

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

4 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 3Gbps (1)

2.16mm

21mm

ROHS3 Compliant

MCIMX6S5DVM10AC MCIMX6S5DVM10AC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-LFBGA

YES

0°C~95°C TJ

Tray

2002

i.MX6S

活跃

3 (168 Hours)

624

BOTTOM

BALL

260

0.8mm

未说明

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

26

YES

YES

32

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX6S6AVM08AC MCIMX6S6AVM08AC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-LFBGA

YES

-40°C~125°C TJ

Tray

2002

i.MX6S

e1

活跃

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.35V

0.8mm

40

S-PBGA-B624

1.5V

1.275V

800MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

24MHz

64

16

YES

YES

32

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX6G3CVM05AB MCIMX6G3CVM05AB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

289-LFBGA

YES

131

-40°C~105°C TJ

Tray

2002

i.MX6UL

活跃

3 (168 Hours)

289

8542.39.00.01

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B289

1.3V

1.15V

528MHz

ARM® Cortex®-A7

16

YES

16

128000

1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V

10/100Mbps (2)

1 Core 32-Bit

无

LPDDR2, DDR3, DDR3L

USB 2.0 + PHY (2)

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART

Multimedia; NEON™ SIMD

CAN; ETHERNET; I2C; SPI; UART; USB

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

LCD, LVDS

1.32mm

14mm

ROHS3 Compliant

MCIMX287CVM4B MCIMX287CVM4B

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

289-LFBGA

YES

-40°C~85°C TA

Tray

2002

i.MX28

e1

活跃

3 (168 Hours)

289

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

0.8mm

MCIMX287

S-PBGA-B289

1.55V

1.35V

454MHz

多功能外围设备

ARM926EJ-S

24MHz

YES

128000

1.8V 3.3V

10/100Mbps (1)

1 Core 32-Bit

无

LVDDR, LVDDR2, DDR2

USB 2.0 + PHY (2)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART

4

Data; DCP

CAN; ETHERNET; I2C; IRDA; SPI; UART; USB

Boot Security, Cryptography, Hardware ID

Keypad, LCD, Touchscreen

1.37mm

14mm

ROHS3 Compliant

MCIMX6S7CVM08AC MCIMX6S7CVM08AC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-LFBGA

YES

-40°C~105°C TA

Tray

2002

i.MX6S

e1

活跃

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B624

1.5V

1.275V

800MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

YES

YES

浮点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX6Q5EYM10AC MCIMX6Q5EYM10AC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

624-LFBGA, FCBGA

YES

-20°C~105°C TJ

Tray

2002

i.MX6Q

e1

不用于新设计

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

MCIMX6

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR

ARM® Cortex®-A9

24MHz

64

16

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

4 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 3Gbps (1)

1.6mm

21mm

ROHS3 Compliant

MCIMX6S5DVM10AB MCIMX6S5DVM10AB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

624-LFBGA

YES

0°C~95°C TJ

Tray

2002

i.MX6S

不用于新设计

3 (168 Hours)

624

BOTTOM

BALL

未说明

0.8mm

未说明

MCIMX6

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

26

YES

YES

32

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX7D5EVM10SD MCIMX7D5EVM10SD

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

16 Weeks

541-LFBGA

YES

-20°C~105°C TJ

Tray

2012

i.MX7D

活跃

3 (168 Hours)

541

8542.31.00.01

BOTTOM

BALL

260

1.1V

0.75mm

40

S-PBGA-B541

1.25V

1.045V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A7, ARM® Cortex®-M4

32

16

YES

YES

32

浮点

YES

1.8V 3.3V

10/100/1000Mbps (2)

2 Core 32-Bit

无

LPDDR2, LPDDR3, DDR3, DDR3L

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART

Multimedia; NEON™ MPE

A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS

Keypad, LCD, MIPI

1.42mm

19mm

ROHS3 Compliant

MCIMX6Q7CVT08AD MCIMX6Q7CVT08AD

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-FBGA, FCBGA

YES

-40°C~105°C TA

Tray

2002

i.MX6Q

e1

活跃

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B624

1.5V

1.275V

800MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

24MHz

64

16

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

4 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 3Gbps (1)

2.16mm

21mm

ROHS3 Compliant

MPC5200CVR400B MPC5200CVR400B

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

272-BBGA

YES

-40°C~85°C TA

Tray

2003

MPC52xx

e1

不用于新设计

3 (168 Hours)

272

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.5V

1.27mm

40

PC5200

S-PBGA-B272

1.58V

1.42V

400MHz

MICROPROCESSOR

PowerPC e300

35MHz

13

YES

YES

32

浮点

YES

2.5V 3.3V

10/100Mbps (1)

1 Core 32-Bit

无

DDR, SDRAM

USB 1.1 (2)

AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART

2.65mm

27mm

ROHS3 Compliant

MCIMX6S5EVM10AC MCIMX6S5EVM10AC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-LFBGA

YES

-20°C~105°C TJ

Tray

2002

i.MX6S

e1

活跃

3 (168 Hours)

624

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

26

YES

YES

32

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

P1011NXN2HFB P1011NXN2HFB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

689-BBGA Exposed Pad

YES

-40°C~105°C TA

Tray

2002

QorIQ P1

活跃

3 (168 Hours)

689

3A991.A.2

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

P1011

S-PBGA-B689

1.05V

0.95V

800MHz

MICROPROCESSOR, RISC

PowerPC e500v2

100MHz

32

YES

YES

浮点

YES

10/100/1000Mbps (3)

1 Core 32-Bit

无

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I2C, MMC/SD, SPI

2.46mm

31mm

ROHS3 Compliant

MCIMX6G2CVM05AB MCIMX6G2CVM05AB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

289-LFBGA

YES

131

-40°C~105°C TJ

Tray

2002

i.MX6UL

活跃

3 (168 Hours)

289

8542.39.00.01

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B289

1.3V

1.15V

528MHz

ARM® Cortex®-A7

16

YES

16

128000

1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V

10/100Mbps (2)

1 Core 32-Bit

无

LPDDR2, DDR3, DDR3L

USB 2.0 + PHY (2)

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART

Multimedia; NEON™ SIMD

CAN; ETHERNET; I2C; SPI; UART; USB

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

LCD, LVDS

1.32mm

14mm

ROHS3 Compliant

MCIMX7D7DVM10SC MCIMX7D7DVM10SC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

18 Weeks

541-LFBGA

YES

0°C~95°C TJ

Tray

2012

i.MX7D

活跃

3 (168 Hours)

541

8542.31.00.01

BOTTOM

BALL

1.1V

0.75mm

S-PBGA-B541

1.25V

1.045V

1.0GHz

多功能外围设备

ARM® Cortex®-A7, ARM® Cortex®-M4

16

YES

32

1.8V 3.3V

10/100/1000Mbps (2)

2 Core 32-Bit

无

LPDDR2, LPDDR3, DDR3, DDR3L

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART

Multimedia; NEON™ MPE

A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS

Keypad, LCD, MIPI

1.4mm

19mm

ROHS3 Compliant

MPC8247CVRTIEA MPC8247CVRTIEA

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

516-BBGA

YES

-40°C~105°C TA

Tray

1994

MPC82xx

e2

活跃

3 (168 Hours)

516

3A991.A.2

Tin/Silver (Sn/Ag)

8542.31.00.01

BOTTOM

BALL

245

1.5V

1mm

30

MPC8247

S-PBGA-B516

1.575V

1.53.3V

1.425V

400MHz

MICROPROCESSOR, RISC

PowerPC G2_LE

133MHz

32

32

YES

YES

64

浮点

YES

3.3V

10/100Mbps (2)

1 Core 32-Bit

无

DRAM, SDRAM

USB 2.0 (1)

I2C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM

2.55mm

27mm

ROHS3 Compliant

MCIMX257CJM4A MCIMX257CJM4A

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

400-LFBGA

YES

6

-40°C~85°C TA

Tray

2005

i.MX25

活跃

3 (168 Hours)

400

5A992

Tin/Silver/Copper - with Nickel barrier

8542.31.00.01

BOTTOM

BALL

260

1.45V

0.8mm

40

MCIMX257

S-PBGA-B400

1.52V

1.2/1.51.8/3.3V

1.38V

400MHz

MICROPROCESSOR

ARM926EJ-S

24MHz

32

26

YES

YES

16

固定点

YES

128000

2.0V 2.5V 2.7V 3.0V 3.3V

10/100Mbps (1)

1 Core 32-Bit

无

LPDDR, DDR, DDR2

USB 2.0 + PHY (2)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART

I2C; USB

Keypad, LCD, Touchscreen

1.6mm

17mm

ROHS3 Compliant

SPC5200CBV400B SPC5200CBV400B

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

272-BBGA

YES

Automotive grade

-40°C~85°C TA

Tray

2003

MPC52xx

e0

不用于新设计

3 (168 Hours)

272

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

245

1.5V

1.27mm

30

PC5200

S-PBGA-B272

1.58V

1.53.3V

1.42V

400MHz

MICROPROCESSOR

PowerPC G2_LE

66MHz

32

32

YES

YES

AEC-Q100

32

浮点

YES

2.5V 3.3V

10/100Mbps (1)

1 Core 32-Bit

无

DDR, SDRAM

USB 1.1 (2)

AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART

2.65mm

27mm

Non-RoHS Compliant

MCIMX280DVM4B MCIMX280DVM4B

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

289-LFBGA

YES

-20°C~70°C TA

Tray

2002

i.MX28

e1

活跃

3 (168 Hours)

289

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

0.8mm

MCIMX280

S-PBGA-B289

1.55V

1.35V

454MHz

多功能外围设备

ARM926EJ-S

24MHz

YES

128000

1.8V 3.3V

10/100Mbps (1)

1 Core 32-Bit

无

LVDDR, LVDDR2, DDR2

USB 2.0 + PHY (2)

I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART

4

Data; DCP

CAN; ETHERNET; I2C; IRDA; SPI; UART; USB

Boot Security, Cryptography, Hardware ID

Keypad

1.37mm

14mm

ROHS3 Compliant

MCIMX6U5DVM10AB MCIMX6U5DVM10AB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-LFBGA

YES

Commercial grade

0°C~95°C TJ

Tray

2002

i.MX6DL

不用于新设计

3 (168 Hours)

624

BOTTOM

BALL

未说明

0.8mm

未说明

MCIMX6

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

26

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX6D5EYM10AC MCIMX6D5EYM10AC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

624-LFBGA, FCBGA

YES

Commercial grade

-20°C~105°C TJ

Tray

2002

i.MX6D

e1

不用于新设计

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

MCIMX6

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR

ARM® Cortex®-A9

24MHz

64

16

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 3Gbps (1)

1.6mm

21mm

ROHS3 Compliant