制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 格式 | 集成缓存 | 以太网 | USB | SPI,SPI | 脉宽调制 | 设备核心 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | ||||||||||||||||||||||||||||||||||||||||
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 | MK10DN512ZVLL10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 70 | 表面贴装 | 100-LQFP | YES | A/D 37x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | 不用于新设计 | 3 (168 Hours) | 100 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G100 | 不合格 | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MIMXRT1051CVL5B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 127 | 表面贴装 | 196-LFBGA | YES | A/D 20x12b | -40°C~105°C TJ | Tray | 2016 | RT1050 | 活跃 | 3 (168 Hours) | 196 | 24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE | BOTTOM | BALL | 260 | 0.65mm | 40 | S-PBGA-B196 | 1.26V | 1.15V | Internal/External | 528MHz | 512K x 8 | 3V~3.6V | MICROPROCESSOR, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 外部程序存储器 | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | YES | YES | 浮点 | YES | 1.52mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKL16Z32VLH4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 54 | 表面贴装 | 64-LQFP | YES | A/D - 16bit; D/A - 12bit | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | DIFFERENTIAL ANALOG CHANNEL INPUTS: 8-CH 16-BIT | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MKL16Z32 | S-PQFP-G64 | 3.6V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK10DX256ZVLQ10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 104 | 表面贴装 | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2013 | Kinetis K10 | e3 | 不用于新设计 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MK10DX256 | S-PQFP-G144 | 不合格 | 3.6V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 4K x 8 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK10DX64VLK7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 56 | 65536 | 表面贴装 | 80-LQFP | YES | A/D 31x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK10DX64 | S-PQFP-G80 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08QD4CSC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 4 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | -40°C~85°C TA | Tube | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 哑光锡 | IT ALSO OPERATES AT 3V SUPPLY | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | MC9S08QD4 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | 8 | YES | NO | YES | NO | 1.75mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK20FX512VLQ12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 | 524288 | 表面贴装 | 144-LQFP | YES | A/D 58x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20FX512 | S-PQFP-G144 | 不合格 | 3.6V | 1.8/3.32.5/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | CORTEX-M4F | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08AW60E5MPUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 54 | 63280 | Automotive grade | 表面贴装 | 64-LQFP | YES | A/D 16x10b | -40°C~125°C TA | Tray | 2000 | S08 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 3V | 0.5mm | S9S08AW60 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LPC824M201JHI33E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 29 | 32768 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2005 | LPC82x | Discontinued | 3 (168 Hours) | 33 | SEATED HGT-NOM | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 未说明 | LPC824M201 | 32 | S-PQCC-N33 | 3.6V | 1.8V | Internal | 30MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 8 | 0.85mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9KEAZ64AVLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 57 | 表面贴装 | 64-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 2006 | Kinetis KEA | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | S-PQFP-G64 | 5.5V | 2.7V | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | NO | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKE02Z32VFM4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 28 | 4096 | 32768 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 从制造商网站考虑的柱塞尺寸 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.8mm | 40 | S-XQCC-N32 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 256 x 8 | 8 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08AC32CFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 34 | 32768 | 表面贴装 | 44-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2008 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08AC32 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912ZVML31F1WKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 31 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | -40°C~150°C TA | Tray | 2011 | S12 MagniV | yes | 活跃 | 3 (168 Hours) | unknown | Internal | 40MHz | 4K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | LINbus, SCI, SPI | 128 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08QG8MFFE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 12 | 8192 | 表面贴装 | 16-VQFN Exposed Pad | YES | A/D 8x10b | -40°C~125°C TA | Bulk | 2005 | S08 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.8mm | 40 | MC9S08QG8 | S-XQCC-N16 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08PT32VLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32768 | 28 | 表面贴装 | 32-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 2013 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08PT32 | S-PQFP-G32 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC56F8257MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 54 | 65536 | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 1x12b | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MC56F8257 | S-PQFP-G64 | 不合格 | 3.6V | 3.3V | 3V | Internal | 60MHz | 4K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 32K x 16 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | NO | YES | YES | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08DV32AMLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 25 | 表面贴装 | 32-LQFP | YES | A/D 10x12b | -40°C~125°C TA | Tray | 2005 | S08 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08DV32 | S-PQFP-G32 | 5.5V | 2.7V | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9KEAZN64ACLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 57 | 表面贴装 | 64-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tray | 2012 | Kinetis KEA | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | 256 x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52256AG80 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 96 | 262144 | 表面贴装 | 144-LQFP | YES | A/D 8x12b | 0°C~70°C TA | Tray | 2004 | MCF5225x | e3 | 活跃 | 3 (168 Hours) | 144 | 5A992 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MCF52256 | S-PQFP-G144 | 不合格 | 3.6V | 3.3V | 3V | Internal | 80MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08MP16VLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 40 | 16384 | 表面贴装 | 48-LQFP | YES | A/D 13x12b; D/A 3x5b | -40°C~105°C TA | Tray | 2009 | S08 | e3 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC9S08MP16 | S-PQFP-G48 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 51.34MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | YES | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKL02Z32VFG4RMULT1 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | KL02 | RISC | 48 | 48 | 32 | 有 | I2C/SPI/UART | 14 | 3 | Single | 12 | Single | 6 | 0 | 1 | 2 | 0 | 1 | 1 | 无 | 无 | 1.71 | 3.3 | 3.6 | -40 | 105 | 无 | QFN | QFN EP | 表面贴装 | 0.6(Max) | 3 | 3 | 16 | No Lead | 3A991.a.2 | 卷带 | 活跃 | 16 | 4KB | Flash | 32KB | ARM | 0 | 0 | 2 | 1 | ARM Cortex M0+ | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MKL26Z64VLH4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 50 | 65536 | 表面贴装 | 64-LQFP | YES | A/D - 16bit; D/A - 12bit | -40°C~105°C TA | Tray | 2013 | Kinetis KL2 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | DIFFERENTIAL ANALOG CHANNEL INPUTS: 4-CH 16-BIT | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MKL26Z64 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCHC908QT2CDWE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 5 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | A/D 4x8b | -40°C~85°C TA | Tube | 1996 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 8 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3V NOMINAL SUPPLY AT 4 MHZ | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | MCHC908QT2 | R-PDSO-G8 | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 24MHz | FLASH | 8-Bit | 1.5KB 1.5K x 8 | 8 | YES | NO | YES | NO | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08PA16AVLD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 37 | 表面贴装 | 44-LQFP | A/D 12x12b | -40°C~105°C TA | Tray | 2009 | S08 | e3 | 活跃 | 3 (168 Hours) | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 260 | 40 | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12XS128J1CAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 44 | 131072 | Automotive grade | 表面贴装 | 64-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2004 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | S9S12XS128 | S-PQFP-G64 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | CPU12 | AEC-Q100 | 1.6mm | 10mm | 10mm | ROHS3 Compliant |