N/A

-

RN42

最后一次购买

表面贴装

35-SMD Module

微芯片技术

Bulk

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

PCB

+ 85 C

3.6 V

- 40 C

40

3 V

222 mA, 279 mA

CAN, CAN FD, Ethernet, I2C, SPI, SQI, UART, USB 2.0 OTG

73 mA, 88 mA

Microchip

Microchip Technology / Atmel

802.11 b/g/n

Tray

WFI32E01

活跃

WiFi Modules - 802.11

表面贴装

54-SMD Module

微芯片技术

PIC32MZ1025W104

-40°C ~ 85°C

Tray

-

Wireless & RF Modules

32 bit

3V ~ 3.6V

200MHz

3 V to 3.6 V

1MB Flash, 256kB SRAM

18.5 dBm, 21.5 dBm,

11 Mb/s, 54 Mb/s

WFI32E01

802.11b/g/n

20.5dBm

WiFi

PCB Trace

-99dBm

I²C, JTAG, SPI, UART, USB

-

-

-

WiFi模块

N/A

-

RN73R1J

活跃

表面贴装

0603 (1608 Metric)

0603

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RN73R

0.063 L x 0.031 W (1.60mm x 0.80mm)

±1%

2

±25ppm/°C

58.3 Ohms

Thin Film

0.1W, 1/10W

2.7V ~ 3.6V

2.4GHz

-

1MB Flash, 256kB ROM, 708kB RAM

72.2Mbps

ATWINC3400

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK

Automotive AEC-Q200, Moisture Resistant

0.022 (0.55mm)

AEC-Q200

N/A

-

D38999/26ZE

16

活跃

Free Hanging (In-Line)

-

Circular

Aluminum

-

Amphenol Aerospace Operations

Bulk

-65°C ~ 175°C

Military, MIL-DTL-38999 Series III, Tri-Start™ TV

Plug Housing

用于内螺纹插座

8

Threaded

Crimp

B

Shielded

抗环境干扰

锌 镍

17-8

Black

不包括触点

E

-

Coupling Nut, Self Locking

-

N/A

-

RN73R2B

活跃

1206 (3216 Metric)

1206

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RN73R

0.126 L x 0.063 W (3.20mm x 1.60mm)

±0.5%

2

±50ppm/°C

1.24 kOhms

Thin Film

0.25W, 1/4W

-

Automotive AEC-Q200, Moisture Resistant

0.028 (0.70mm)

AEC-Q200

N/A

-

u.FL

802.11 b/g/n

+ 85 C

3.6 V

- 40 C

50

2.7 V

265 mA

I2C, SPI, UART

61 mA

Microchip

Microchip Technology / Atmel

WEP, WPA, WPA2

802.11 b/g/n

Tray

活跃

21.7 mm x 14.7 mm x 2.1 mm

WiFi Modules - 802.11

表面贴装

28-SMD Module

微芯片技术

Non-Compliant

-40°C ~ 85°C

Tray

-

Male

Wireless & RF Modules

2.7V ~ 3.6V

2.4 GHz

Pin

4MB Flash, 128kB RAM

18.5 dBm

72.2 Mb/s

ATWINC1500

802.11b/g/n

18.9dBm

WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

61mA

264mA ~ 269mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, OFDM, QPSK

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

WiFi模块

N/A

-

壁挂式

MIL-DTL-5015

1

Panel

28-22

Copper Alloy

Amphenol

Amphenol Air LB Germany

Details

军规圆形连接器

Silver

28

6 Position

Circular Connectors

Pin (Male)

Receptacles

Straight

军规圆形连接器

N/A

-

RNBD451

活跃

PCB天线

15.5 mm x 20.7 mm x 2.8 mm

+ 85 C

3.6 V

- 40 C

1.9 V

SMD/SMT

42.8 mA

4-Wire UART

- 92 dBm

20.6 mA

Bluetooth Low Energy (BLE)

-

-

微芯片技术

Tray

-40°C ~ 85°C

-

Wireless & RF Modules

1.9V ~ 3.6V

Shielded

2.402 GHz to 2.48 GHz

1.9 V to 3.6 V

1MB Flash

12 dBm

-

Bluetooth v5.2, Zigbee®

12dBm

Bluetooth

PCB Trace

-102dBm

UART

-

-

-

蓝牙模块

蓝牙模块

2.8 mm

20.7 mm

15.5 mm

N/A

-

1250V (1.25kV)

+ 85 C

3.6 V

- 40 C

171

1.9 V

ADC, GPIO, I2C, SPI, UART

- 90 dBm

Microchip

Microchip Technology / Atmel

Bluetooth Low Energy (BLE)

Tray

活跃

Bluetooth Modules - 802.15.1

通孔

Radial

Polypropylene (PP), Metallized

微芯片技术

--

-55°C ~ 110°C

Bulk

MKP385

0.689 L x 0.335 W (17.50mm x 8.50mm)

±5%

活跃

--

PC引脚

DC Link, DC Filtering; High Frequency, Switching; High Pulse, DV/DT

0.036µF

Wireless & RF Modules

1.9V ~ 3.6V

2.44 GHz

1.9 V to 3.6 V

0.591 (15.00mm)

-

0 dBm

-

-

Bluetooth 5.0

0dBm

Bluetooth

Integrated, Chip

-90dBm

I²C, SPI, UART

10mA

13mA

-

--

蓝牙模块

0.591 (15.00mm)

--

N/A

-

RN52

最后一次购买

表面贴装

50-SMD Module

微芯片技术

Bulk

-40°C ~ 85°C

RN52

-

2.4GHz

16MB Flash

3Mbps

-

Bluetooth v3.0, Class 2

4dBm

Bluetooth

PCB Trace

-85dBm

AIO, I²S, SPI, UART, USB

-

-

DPSK, DQPSK, GFSK

N/A

-

Obsolete

表面贴装

35-SMD Module

微芯片技术

Tray

-40°C ~ 85°C

RN41

3V ~ 3.6V

2.402GHz ~ 2.48GHz

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

18.4dBm

Bluetooth

Integrated, Chip

-80dBm

SPI, UART, USB

35mA

65mA

FHSS, GFSK

N/A

-

RN41

最后一次购买

表面贴装

35-SMD Module

微芯片技术

Bulk

-40°C ~ 85°C

RN41

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

11.9dBm

Bluetooth

不包括天线

-86dBm

SPI, UART

35mA

65mA

-

N/A

-

Compliant

Bulk

RN41

Obsolete

表面贴装

35-SMD Module

微芯片技术

95 V

-40°C ~ 85°C

切割胶带

RN41

0.2 ppm/°C

10 kΩ

300 mW

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

11.9dBm

Bluetooth

不包括天线

-86dBm

SPI, UART

35mA

65mA

-

N/A

-

RN42

Obsolete

表面贴装

35-SMD Module

微芯片技术

Bulk

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

12 Weeks

Tray

Obsolete

,

微电子组件

UNSPECIFIED

-40 °C

3.3 V

85 °C

MRF24WG0MBR-I/RM

RECTANGULAR

Microchip Technology Inc

不推荐

MICROCHIP TECHNOLOGY INC

5.12

Automotive grade

表面贴装

36-SMD Module

NO

36

微芯片技术

150 V

-40°C ~ 85°C

-

0.1 %

25 ppm/°C

132 kΩ

155 °C

-55 °C

Thin Film

500 mW

2.8V ~ 3.6V

DUAL

无铅

1

compliant

2.4GHz

R-XDMA-N36

INDUSTRIAL

-

54Mbps

2.7 mm

-

802.11b/g

TS 16949

电信电路

18dBm

WiFi

Antenna Not Included, U.FL

-95dBm

SPI

156mA

240mA

DSSS, OFDM

650 µm

31 mm

21 mm

N/A

-

Tape & Reel (TR)

Obsolete

表面贴装

36-SMD Module

Aluminium

6 g

微芯片技术

Non-Compliant

-40°C ~ 85°C

Bulk

-

1 %

20 ppm/°C

63.4 Ω

250 °C

-55 °C

Wirewound

10 W

10 W

2.8V ~ 3.6V

2.4GHz

0.01 %

-

Solder

54Mbps

-

802.11b/g

18dBm

WiFi

Integrated, Trace

-95dBm

SPI

156mA

226mA ~ 237mA

DSSS, OFDM

Military, Moisture Resistant

10.287 mm

19.05 mm

20.32 mm

含铅

N/A

-

N/A

-

802.11 b/g/n

+ 85 C

3.6 V

- 40 C

500

802.11b

2.7 V

SMD/SMT

87 mA

SPI, UART

256 mA

Microchip

Microchip Technology / Atmel

External

Details

802.11 b/g/n, Bluetooth

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

ATWINC3400

活跃

22.43 mm x 14.73 mm x 2 mm

多协议模块

表面贴装

36-SMD Module

微芯片技术

u.FL

-40°C ~ 85°C

切割胶带

ATWINC3400-MR210xA

介质访问控制网络控制器

Wireless & RF Modules

2.7V ~ 3.6V

2.412 GHz to 2.472 GHz

10 Channel

256 kB

18.3 dBm

1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s

-

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

23.7mA

24mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK

能源模块

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

多协议模块

N/A

-

8525.60.10.50

无

无

Bluetooth v3.0 + EDR

Microprocessor

921.6

2400(Typ)

ISM

2.4GHz

-90

UART

4.5

5

5.5

2m(Typ)

On-Board/External

-20

70

表面贴装

1.8

15

29

40

5A992.c

Tray

Module

40

N/A

-

表面贴装

SMD模块

Non-Compliant

33

1.9000, 3.6000 V

N/A

-

表面贴装

Tray

活跃

Gold

表面贴装

30-SMD Module

微芯片技术

Copper Alloy

-40 to 85 °C

-

1.9V ~ 3.6V

2.4GHz

-

10kbps

RN4870

Bluetooth v4.2

0dBm

Bluetooth

Integrated, Chip

-90dBm

I²C, AIO, PIO, PWM, SPI, UART

10mA

10mA

GFSK

N/A

-

Wireless & RF Modules

蓝牙模块

N/A

-

表面贴装

33-SMD Module

微芯片技术

-20°C ~ 70°C

Tray

活跃

3.3V ~ 4.2V

2.4GHz

4MB Flash, 320kB ROM, 28kB SRAM

1Mbps

BM78SPPS5MC2/NC2

Bluetooth v5.0 Dual Mode

1.5dBm

Bluetooth

不包括天线

-92dBm

I2C, UART

37mA (Max)

43mA (Max)

N/A

-

表面贴装

39-SMD Module

微芯片技术

-40°C ~ 85°C

Tray

WBZ35x

活跃

1.9V ~ 3.6V

2.4GHz

544kB Flash, 64kB ROM, 96kB SRAM

2Mbps

PIC32CX5109BZ31048-V/ZWX

Bluetooth v5.2, Zigbee?

11dBm

802.15.4, Bluetooth

PCB Trace

-108dBm

ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART

14.5mA ~ 20mA

21.5mA ~ 50mA

N/A

-

SPI

1.8 V

3.6 V

- 40 C

+ 85 C

PCB天线

21.7 mm x 14.7 mm x 2.1 mm

WiFi - 802.11 b/g/n

WPA3

符合RoHS标准

20 MHz

3.3 V