制造商是'Microchip'
Microchip 嵌入式 - 片上系统(SoC)
(873)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 组成 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 额定电流 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 电压 | 速度 | 内存大小 | 核心处理器 | 极数 | 周边设备 | 程序内存大小 | 连接方式 | 开关类型 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 最高频率 | 速度等级 | 主要属性 | 频带数量 | 逻辑单元数 | 核数量 | 闪光大小 | 断开类型 | 输入电压(交流电) | 知识产权评级 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M2S010S-1TQG144I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 84 I/O | - 40 C | + 100 C | 400 kbit | 1007 LAB | 60 | 1.2000 V | 1.14 V | 1.26 V | Tray | M2S010 | 活跃 | TQFP-144 | 144-TQFP (20x20) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40 to 100 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010S-TQG144I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 84 I/O | - 40 C | + 100 C | 400 kbit | 1007 LAB | 60 | Tray | M2S010 | 活跃 | TQFP-144 | 144-TQFP (20x20) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1.14 V | 1.26 V | 267 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 1.14 V | 1.26 V | Non-Compliant | 267 | Tray | M2S025 | 活跃 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1.14 V | 1.26 V | 267 | Tray | M2S090 | 活跃 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Continental Belt | 265 Inches | MCU - 25, FPGA - 66 | Tray | A2F500 | 活跃 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 11/5V2650 | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-1FGG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | CUL, UL | Cutler Hammer, Div of Eaton Co | 267 | Tray | 活跃 | M2S090 | - | 166 MHz | 86316 LE | SMD/SMT | - | 64 kB | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | DH361UGK | -55°C ~ 125°C (TJ) | SmartFusion®2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | Metallic | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 30 A | S-PBGA-B484 | 267 | 不合格 | 1.2 V | MILITARY | 600 V | 166MHz | 64KB | ARM® Cortex®-M3 | 3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 重型 | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||
![]() | M2S100S-1FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ACH580-BCR-046A-2+B056 | ABB | Panel | ACH580BX122 | 500 Hz | 断路器 | 240 VAC | IP55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-VFG400 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 195 | Tray | M2S010 | 活跃 | - | 166 MHz | 12084 LE | - | 64 kB | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S010TS-VFG400 | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||
![]() | M2S050-1FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 267 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCSG536E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | BGA-536 | 536-LFBGA | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCVG484E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | BGA-484 | 484-FCBGA (19x19) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160TS-FCVG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | BGA-484 | 484-FCBGA (19x19) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160TL-FCVG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | BGA-784 | 784-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TL-FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | BGA-536 | 536-LFBGA | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TS-FCVG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | BGA-484 | 484-FCBGA (19x19) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160TL-FCVG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | BGA-784 | 784-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | BGA-536 | 536-LFBGA | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TL-FCVG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | BGA-784 | 784-BGA | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TL-FCVG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | BGA-784 | 784-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-1FCVG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | BGA-784 | 784-BGA | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TS-FCVG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | BGA-784 | 784-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | FCSG-536 | 536-LFBGA | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCVG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | BGA-784 | 784-BGA | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | BGA-536 | 536-LFBGA | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB |