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制造商是'Microchip'

  • Microchip 嵌入式 - 片上系统(SoC)

    (873)

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产品型号

品牌

数据表

有效性

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询价

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终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

组成

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

额定电流

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

电压

速度

内存大小

核心处理器

极数

周边设备

程序内存大小

连接方式

开关类型

建筑学

输入数量

座位高度-最大

可编程逻辑类型

最高频率

速度等级

主要属性

频带数量

逻辑单元数

核数量

闪光大小

断开类型

输入电压(交流电)

知识产权评级

长度

宽度

M2S010S-1TQG144I M2S010S-1TQG144I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

84 I/O

- 40 C

+ 100 C

400 kbit

1007 LAB

60

1.2000 V

1.14 V

1.26 V

Tray

M2S010

活跃

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 10K Logic Modules

1 Core

256KB

M2S010S-TQG144I M2S010S-TQG144I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

84 I/O

- 40 C

+ 100 C

400 kbit

1007 LAB

60

Tray

M2S010

活跃

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S050T-FGG484I M2S050T-FGG484I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.14 V

1.26 V

267

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 50K Logic Modules

1 Core

256KB

M2S025T-FG484I M2S025T-FG484I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

1.14 V

1.26 V

Non-Compliant

267

Tray

M2S025

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 25K Logic Modules

256KB

M2S090-1FGG484I M2S090-1FGG484I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.14 V

1.26 V

267

Tray

M2S090

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

512KB

A2F500M3G-FG256I A2F500M3G-FG256I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Continental Belt

265 Inches

MCU - 25, FPGA - 66

Tray

A2F500

活跃

256-LBGA

256-FPBGA (17x17)

微芯片技术

11/5V2650

-40°C ~ 100°C (TJ)

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11

512KB

M2S090TS-1FGG484M M2S090TS-1FGG484M

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

CUL, UL

Cutler Hammer, Div of Eaton Co

267

Tray

活跃

M2S090

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

1.14 V

125 °C

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

DH361UGK

-55°C ~ 125°C (TJ)

SmartFusion®2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

Metallic

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

30 A

S-PBGA-B484

267

不合格

1.2 V

MILITARY

600 V

166MHz

64KB

ARM® Cortex®-M3

3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

重型

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S100S-1FCG1152I M2S100S-1FCG1152I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

ACH580-BCR-046A-2+B056

ABB

Panel

ACH580BX122

500 Hz

断路器

240 VAC

IP55

M2S010TS-VFG400 M2S010TS-VFG400

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

195

Tray

M2S010

活跃

-

166 MHz

12084 LE

-

64 kB

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

85 °C

M2S010TS-VFG400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.81

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

Non-Compliant

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

M2S050-1FG484I M2S050-1FG484I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

484-BGA

484-FPBGA (23x23)

微芯片技术

267

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

MPFS095T-1FCSG536E MPFS095T-1FCSG536E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095T-1FCVG484E MPFS095T-1FCVG484E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS160TS-FCVG484I MPFS160TS-FCVG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TL-FCVG784E MPFS160TL-FCVG784E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-784

784-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095TL-FCSG536I MPFS095TL-FCSG536I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TS-FCVG484I MPFS250TS-FCVG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS160TL-FCVG784I MPFS160TL-FCVG784I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-784

784-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095T-1FCSG536I MPFS095T-1FCSG536I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095TL-FCVG784I MPFS095TL-FCVG784I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-784

784-BGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TL-FCVG784E MPFS250TL-FCVG784E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-784

784-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095TS-1FCVG784I MPFS095TS-1FCVG784I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-784

784-BGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TS-FCVG784I MPFS250TS-FCVG784I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-784

784-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250T-1FCSG536I MPFS250T-1FCSG536I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

FCSG-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095T-1FCVG784E MPFS095T-1FCVG784E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-784

784-BGA

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095TS-FCSG536I MPFS095TS-FCSG536I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB