N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

207

Tray

M2S060

活跃

400-LFBGA

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

90

1.2000 V

1.14 V

1.26 V

207

Tray

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

无

M2S025TS-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.51 mm

现场可编程门阵列

1

FPGA - 25K Logic Modules

1 Core

256KB

17 mm

17 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

233 I/O

0 C

+ 85 C

400 kbit

64 kB

有

1007 LAB

60

1.2000 V

1.14 V

1.26 V

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S010-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.28

BGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

N/A

-

N

100 MHz

-

-

64 kB

6000 LE

有

-

60

SmartFusion

MCU - 41, FPGA - 128

Tray

A2F500

活跃

无

A2F500M3G-1FG484M

活跃

ARMu00ae Cortexu00ae-M3 System On Chip (SOC) IC SmartFusionu00ae ProASICu00ae3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 100MHz 484-FPBGA (23x23)

MICROSEMI CORP

5.86

484-BGA

484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

A2F500

125 °C

-55 °C

8542.39.00.01

unknown

100 MHz

1.5 V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

100MHz

13.5 kB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

1 Core

512KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

90

1.2000 V

1.14 V

1.26 V

195

Tray

M2S010

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S010T-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

9744

1 Core

256KB

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

60

233

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

85 °C

有

M2S010TS-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

90

207

Tray

M2S025

活跃

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

无

M2S050-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

27

1.2000 V

377

Tray

M2S050

活跃

FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

无

M2S050T-1FG896I

50 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

1.74

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

896

S-PBGA-B896

377

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

48672 CLBS

2.44 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

48672

48672

1 Core

256KB

31 mm

31 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

0.046530 oz

84

Tray

M2S005

活跃

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

207

Tray

M2S060

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

有

M2S060-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

209 I/O

0 C

+ 85 C

191 kbit

64 kB

有

505 LAB

60

1.2000 V

1.14 V

1.26 V

Tray

M2S005

活跃

BGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

1.2000 V

267

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S060T-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

484-BGA

YES

484

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

166MHz

164.3 kB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 60K Logic Modules

56520

1 Core

256KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

138

Tray

M2S025

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

85 °C

无

M2S025T-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

N

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

90

195

Tray

M2S010

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S010TS-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

N/A

-

Details

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

90

293

Tray

M2S150

活跃

FBGA-536

网格排列

3

PLASTIC/EPOXY

BGA536,30X30,20

1.2 V

40

1.14 V

85 °C

有

M2S150-FCSG536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

compliant

S-PBGA-B536

293

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

293

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

90

207

Tray

M2S050

活跃

400-LFBGA

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

176

180

Tray

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S090T-1FCS325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.83

FCBGA-325

YES

325-FCBGA (11x13.5)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

N/A

-

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

90

1.2000 V

1.14 V

1.26 V

293

Tray

M2S150

活跃

FBGA-536

网格排列

PLASTIC/EPOXY

BGA536,30X30,20

1.2 V

30

1.14 V

无

M2S150-FCS536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

not_compliant

536

S-PBGA-B536

293

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

293

现场可编程门阵列

STD

FPGA - 150K Logic Modules

146124

1 Core

512KB

N/A

-

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

90

293

Tray

M2S150

活跃

FBGA-536

网格排列

PLASTIC/EPOXY

BGA536,30X30,20

1.2 V

30

1.14 V

85 °C

无

M2S150-1FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

not_compliant

S-PBGA-B536

293

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

293

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

425

Tray

M2S090

活跃

BGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

N

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

RISC

1.2, 1.5, 1.8, 2.5, 3.3 V

CAN/Ethernet/Serial I2C/SPI/UART/USB

有

表面贴装

267

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S090-FG484

BGA

SQUARE

活跃

ARMu00ae Cortexu00ae-M3 System On Chip (SOC) IC SmartFusionu00ae2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 484-FPBGA (23x23)

MICROSEMI CORP

1.26 V

5.83

Commercial grade

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

484

S-PBGA-B484

267

不合格

0.95, 1.05, 2.375, 2.625 V

1.2 V

OTHER

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

267

2.44 mm

现场可编程门阵列

Commercial

FPGA - 90K Logic Modules

86316

1 Core

512KB

ARM Cortex-M3

23 mm

23 mm

N/A

-

Details

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

90

293

Tray

M2S150

活跃

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 150K Logic Modules

1 Core

512KB

N/A

-

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

24

146124

FCBGA

1.2 V

1.14 V

574

1.26 V

表面贴装

574

Tray

M2S150

活跃

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

85 °C

无

M2S150TS-FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

Commercial grade

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

1152

S-PBGA-B1152

574

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

Commercial

STD

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm